Electronics Forum | Tue Aug 24 03:36:19 EDT 2010 | naveed
Hi all!i m using yv100xg line,with vois application version 1.5R2000,when the mechine starts,after loading all files and returning to origin,a mesg appears ,that iz"Ea12324:the repair detection of the file.the mchne is unusually finished and it has t
Electronics Forum | Fri Sep 03 08:42:01 EDT 2010 | naveed
hi!i have the disc labled mechine software and another labled upgraded software.but i dont have the procedure,or any sort of training regarding this.i got training from my teacher who visited japan trainig schdule,but for last 7 years i am doing all
Electronics Forum | Mon Sep 06 08:38:54 EDT 2010 | sachu_70
I am impressed to know that you are a one-man army confronting YV100Xg. However, you could always call in for an Engineer from a YAMAHA service provider to resolve your problem. Else, just try by reinstalling your machine software. But before you do
Electronics Forum | Tue Aug 24 15:11:32 EDT 2010 | sjohnson
We are experiencing a high incidence of what we call "black barrel" (to differentiate from black pad) with multiple contract manufacturers and PCB vendors. The PCBs are ENIG and during wave solder (SACX-0307) multiple thru-hole components are seeing
Electronics Forum | Tue Aug 31 04:05:23 EDT 2010 | arjan
Hi Mark, Thanks for your responce! The stencil thickness and especially the reduction of 45% are not recommend by LT, did you came to this combination experimentally? We never have the illusion to produce voiding free, but now its around the accepta
Electronics Forum | Wed Sep 01 05:09:27 EDT 2010 | grahamcooper22
Dear SMT Manufacturer, I am wondering if the device could have so much moisture in it and storing it in a dry cabinet isn't going to remove it all. As a final test to see if moisture in the device is causing the voids/solder balls then I'd bake it a
Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
Electronics Forum | Thu Sep 02 16:55:31 EDT 2010 | markgray
I ment LF318. We have a power supply board that has 3 different types of these LGA's and i have had great success with the reductions and stencil thickness mentioned. We had to go with 4 mil stencil due to the consideration of the other large compone
Electronics Forum | Fri Sep 03 06:53:38 EDT 2010 | arjan
Yes, we assembled a lot of QFN in the last years, but we don't have a X-ray machine by ourself, so we cant't inspect each device. This type LGA was designed on a prototyping board of our customer so we would validate our LGA reflow process and a rese
Electronics Forum | Mon Aug 30 14:14:23 EDT 2010 | sreid
Thanks Dave, I was able to get an automated dispenser to apply an amount of paste that should be sufficent. My only question is should I bake the boards before solder is applied and the boards are reflowed. I ask this because the boards have been s
