Electronics Forum: viewing (Page 6266 of 7929)

Need help on create new MPI

Electronics Forum | Mon Jul 31 20:23:06 EDT 2017 | tey422

I am a process technician (promoted from SMT operator) working for a CM. Now I got assigned a new task, to create new MPIs for the production process. Since I am still new to other aspects of the whole production process, i.e. rework, touch up, I wou

LED sticking into carrier tape

Electronics Forum | Tue Aug 01 11:23:56 EDT 2017 | OrHorti

We are using a custom made nozzle, designed for this particular LED. The dome of the LED is also custom made, the diameter of the lens at the base is 2.9mm while the substrate of the package is 3.3mm, so this gives about 0.2mm spacing between lens a

LED sticking into carrier tape

Electronics Forum | Tue Aug 01 16:29:01 EDT 2017 | tey422

Try the method I mentioned earlier, it greatly improves most of the picked-but-drops issues. We never need to use any custom make nozzles, even for the trapezoid dome shaped LED we were having the issue with. Use smaller round diameter nozzle would

What is needed for UL ?

Electronics Forum | Sun Aug 06 20:50:57 EDT 2017 | leadthree

We have a client that wants to export modules to the USA, which they didn't do so far, and ask for UL status. I am a bit unclear about that, so I wonder what is needed? For the PCB it's clear, must be from a UL supplier. Does the UL number has to b

What is needed for UL ?

Electronics Forum | Mon Aug 07 16:22:13 EDT 2017 | stephendo

The only people that can answer what you need is UL. At least once a year an inspector from UL stops by and makes sure the High-Pot tester is up to date on calibration and that we are following the BOM provided by the customer and approved by UL. A

What is needed for UL ?

Electronics Forum | Thu Aug 10 04:31:02 EDT 2017 | leadthree

The only people that can answer what you need is UL. I worked with VDE and I do not know any company that works like that. With VDE we prepare a module according to VDE standard and do an internal pre-approval - and present it. To put something ra

NXP QFN Solderability Wetting Problems, Kester

Electronics Forum | Wed Aug 09 20:03:22 EDT 2017 | ttheis

We're having problems with Kester pastes (NP545 pb free and EP265 60/40 no clean pastes.) All of our other components reflow just fine with either paste, but for some reason this QFN chip doesn't wick to the QFN's pads well. It seems like some type

NXP QFN Solderability Wetting Problems, Kester

Electronics Forum | Thu Aug 10 10:52:11 EDT 2017 | ttheis

We are just using a stereo microscope at this time. When we first started out with these parts a year ago they filleted very well but with no apparent change they began having problems. While the boards do work, we are concerned about the long term r

NXP QFN Solderability Wetting Problems, Kester

Electronics Forum | Thu Aug 10 11:24:18 EDT 2017 | dleeper

The exposed metallization on the sides of the QFN probably aren't tinned and therefore not expected to have solder wetted to them. If previous parts formed nice toe filets, it might just be that those parts were fresher and the exposed metal did not

Universal Instruments or Mirae

Electronics Forum | Thu Aug 10 12:33:34 EDT 2017 | kalsi311

Hi Everyone, I am working in Electronics manufacturing company and we are using universal instruments Advantis machines. Few months ago I was working in another company and they were using Mirae MR40LS and MR20LP machines. UIS machines are really slo


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