Electronics Forum | Fri Mar 10 12:28:24 EST 2000 | Keith Luke
SMTnet extends a warm welcome to the Center for Board Assembly Research (CBAR)at the Georgia Institute of Technology who have joined with SMTnet to provide access to the Electronics Forum through the school's web site. SMTnet is pleased to cooperate
Electronics Forum | Fri Mar 10 08:42:40 EST 2000 | John
We're quoting out a new board design, and one of the prospective suppliers is pitching a silver coating process over hot air leveling. We haven't had experience with boards of this type, and I am concerned about any processing issues that may come u
Electronics Forum | Fri Mar 17 07:51:49 EST 2000 | Peter Barton
John, I have had previous experience of immersion silver coated PCB's in place of HASL coated type using no-clean processing with little or no problem at all. All of the process parameters were left unchanged. There is a very minor difference in th
Electronics Forum | Wed Mar 08 19:29:55 EST 2000 | Charles Leech
This is just an Alert: We had a lesson on the effect of air shipments of devices which have been fully saturated with moisture. After being in a pressure cooker for two hours in Singapore, devices were sealed in metalized vapor barrier bags. They we
Electronics Forum | Mon Mar 13 14:41:22 EST 2000 | Boca
By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it
Electronics Forum | Mon Mar 13 14:45:01 EST 2000 | Boca
By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it
Electronics Forum | Thu Mar 09 20:48:30 EST 2000 | Dave F
Van Hoang: Welcome to SMTnet!!!! Regarding your problems: 1. Cleaning glue: Check the SMTnet archives. For instance, a recent thread was: cleaning glue off of stencils - pr 13:41:43 03/03/2000 2. Bridging on the wave: Bridging on the wave h
Electronics Forum | Fri Mar 03 10:07:15 EST 2000 | Wolfgang Busko
Hi Jacqueline, - what a name in this technical world - I just tried the calculator and for example choose the CQFP and then selected other and an input mask appeared where you have to fill in the required data from the components datasheet. I have to
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
