Electronics Forum | Mon Jun 18 19:49:45 EDT 2001 | Gil Zweig
To best visualize the factors effecting resolution, carry in your minds eye an image of a light shadow being cast on the wall using a flashlight. The size of the flashlight filament would be the analagous x-ray "focal spot" The smoothness and/or roug
Electronics Forum | Fri Jun 22 12:25:42 EDT 2001 | dason_c
DaveP, once you shut down the oven, the moisture will start and move into the oven unless you can completely seal the oven after you turn it off. Therefore, keep the components into the oven, don't work. However, if the oven is continously on until
Electronics Forum | Mon Jun 25 20:32:44 EDT 2001 | davef
You�re correct. This is a messy situation. Do not store components at the bake temperature longer than the time required to dry out the units for use in the reflow. Long storage times at elevated temperatures can cause soldering problems and the
Electronics Forum | Thu Jun 21 12:05:54 EDT 2001 | brownsj
I used to assembly 0402 devices on to a double sided PCBA using a 96% tin 4% silver alloy. This material printed fine but the higher processing temperatures did present a problem. This material had a melting point of 221 deg C which required a peak r
Electronics Forum | Tue Jun 26 22:52:27 EDT 2001 | ianchan
I second that juicy bit from brownsj, Sn96/Ag4 process is what we are using too, currently for BIB runs, dunno about current capital investments needs, coz from what I understand, our company's BIB pioneer guy, personally designed the machines in cur
Electronics Forum | Thu Jun 21 10:47:55 EDT 2001 | caldon
Glenbrook has a solution. I do not know what your definition of low cost is but Glenbrook offers an inspection solution an x-ray system and an endo scope (ersa scope type) for low cost. Contact Steve zweig at (973) 361-8866. They have some great soft
Electronics Forum | Sat Jun 30 09:35:59 EDT 2001 | dmr
I have tried just about everything avalible for BGA inspection on the market. We use X-ray which is great, even through we have a 5-d machine, I use my 2-d unit most often. We also have the expensive scope that lets you look completely through under
Electronics Forum | Fri Jun 22 05:03:29 EDT 2001 | wbu
no - can it be left uncleaned on the board? ---> for many applications yes says our supplier and many companies do ( techi over there) - are our products specified for conditions that we and our customers can live with that? ---> well, at first
Electronics Forum | Mon Jun 25 11:09:26 EDT 2001 | wbu
Who is this, another Dave F ? For me there�s no problem with balling and beading. I know that the boards I have with the new paste do have all what�s needed for balling and beading, just one of the oldest designs with a stencil ...., oh boy, didn�t
Electronics Forum | Mon Jun 25 20:54:28 EDT 2001 | davef
No, I�m suggesting an increase in the distance between the two pads on the board. This "G" in SM-782A "Surface Mount design & Land Pattern Standard" parlance. You shouldn�t fight solder balls for long periods. You should just increase the pressure
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