Electronics Forum | Thu Jul 05 17:10:29 EDT 2007 | arun2382
Thanks all! I'm facing this issue with one specific batch of QFNs. It could be a plating issue. But, nothing was evident from visual inspection,No sign of voiding or non-wetting. Cross-section images of solder joints were clean as well. Could this s
Electronics Forum | Tue Nov 13 12:25:12 EST 2007 | gradloff
I have a thick board with ground planes that will be soldered by hand with a mildly active solder/flux. X-ray confirmed that solder was added to the top of the joint causing a void between the bottom and top solder joint. Other than the mildly acti
Electronics Forum | Thu Jan 17 17:54:22 EST 2008 | dman97
Stay far away from the WS619 paste. It is a nightmare to get a decent solder joint out of it. And dont get me started on voiding issues with this paste. We eventually started to use Indium 3.2 lead free "water wash" paste and this drastically reduced
Electronics Forum | Tue Feb 12 04:07:29 EST 2008 | aj
Hi, Have you checked out the BGA datasheet and see what profile is recommended for the BGA ? I use OM338 and there are dozens of recommended profiles for the Paste but you have to consider the components aswell. You state your Peak temp which I w
Electronics Forum | Fri Feb 13 19:51:07 EST 2009 | joeherz
Update Received cross-section analysis for ENIG plated boards and am happy to report that we have no voiding issues. Intermetalics look great and no copper dissolution. No process parameters were changed, only the PCB plating. For now, we are onl
Electronics Forum | Fri Dec 11 15:53:50 EST 2009 | smt_guy
Hi All, I have a PCB that is bonded on an aluminum plate. The size of PCB is 11" x 8" and 0.065" Thick, The aluminum plate has the same size and thickness as the PCB. Process is Lead Free. Questions: Is it possible and achieveable to bond the PC
Electronics Forum | Thu Apr 01 10:05:32 EDT 2010 | brandenspencer10
Hi, My name is Branden Spencer and I am a jr. engineer at TTM technologies. We are currently having and issue with our wave solder process. We are getting what looks like either solder dross or voiding in our solder joints (through hole and SMT). We
Electronics Forum | Thu Jun 10 06:15:45 EDT 2010 | muarty
We currently have a project requiring us to place multiple QFN devices (of various sizes). The pick an place is not a problem at all, where we are seeing 'problems' is that 3 of the devices are being place on locations where the ground pad have plugg
Electronics Forum | Mon Aug 30 10:17:16 EDT 2010 | markgray
We currently use this devise in one of our designs with no issues. We are using a 3mil stencil and a 45% apperature reduction. It is virtually impossible to eliminate voids but they are in an acceptable range. Solder balls are caused on this componen
Electronics Forum | Wed Sep 01 05:29:40 EDT 2010 | arjan
We baked the parts just before assembly. 2>we baked the parts and store them in 4 days in drycab (60degC, Rh0,5%)and finally assembly 3> we baked the parts and refowed them on a leadfree profile and finally the assembly on the boards. The same we als
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