Electronics Forum | Thu Mar 03 14:05:49 EST 2011 | davef
Certainly the bridge is ugly, but the voiding is nothing that you should be bragging about either. Pretty ugly work. BRIDGING: If all of your shorts appear in the vacinity of the heat sink, consider reducing the amount of paste that you apply there.
Electronics Forum | Thu May 08 19:52:40 EDT 2014 | hegemon
There are many different style LGA packages, but don't sweat it. Stick with the manufacturers recommendations for PWB pad geometry for a start. Voiding can be reduced by careful profiling, and also by pre-tinning the devices. QFN style packages can b
Electronics Forum | Wed Mar 15 09:53:58 EDT 2017 | rob
Hi Etimov, Understood that to us assembling parts that IPC is king, however it isn't neccesarily the bible for design engineers. We've had customers demand almost zero voiding, or had to use conductive epoxy to avoid it. For some of us solder joi
Electronics Forum | Thu Aug 10 11:24:18 EDT 2017 | dleeper
The exposed metallization on the sides of the QFN probably aren't tinned and therefore not expected to have solder wetted to them. If previous parts formed nice toe filets, it might just be that those parts were fresher and the exposed metal did not
Electronics Forum | Wed Aug 22 16:41:09 EDT 2018 | emeto
To all good suggestions I will add a few other thoughts: 1. Check PCB design(attached). THis mask clearance there is designed so you have some gas escape plan- verify if your PCB design follows that. 2. You can have a long soak reflow profile to re
Electronics Forum | Wed Nov 21 06:01:57 EST 2018 | premkumar_haribabu
Hi Davef, Thanks for your quick reply , just my inputs - we using 99.99 % pure nickel strip for soldeirng & when we do manual soldering this nickle stips its working well but when coming to SMT reflow even after high peak temperature ,its removes ev
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Wed Dec 06 15:22:07 EST 2000 | Christopher Lampron
Does anyone know of documented inspection criteria for inspecting BGA's post reflow? (e.g. void percent, alignment, etc..) Any help would be greatly appreciated Thanks In Advance Chris
Electronics Forum | Thu Mar 01 10:29:00 EST 2001 | davef
If the soldering process is not controlled, the results are variable, regardless of the flux type. Tell us more about your concerns, process, solder, etc
Electronics Forum | Tue Mar 06 03:29:05 EST 2001 | daled
Hello I am looking for any data that confirms the long term reliabilty of no clean paste as opposed to water soluable. Does anyone have any past experiences of problems when changing over from water soluable to no clean in the SMT prcocess?? Thanks i
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