Electronics Forum: voiding (Page 76 of 117)

Large Voids with Via in Pad

Electronics Forum | Tue Apr 13 22:57:52 EDT 2004 | Ken

"Do you at least get to look at the boards before the ship schedule and pricing is determined and the kit is on the floor? " Where I am at, the quote model is a closely guarded secret. It envolves eye of newt, liverwort and a sprinkle of pixie-dus

Glenbrook Technologies X-Ray: Anyone using this??

Electronics Forum | Fri Jun 25 18:57:21 EDT 2004 | Pete

One word of caution, depending on the complexity of the boards and package, the Xray on Jewel Box may not be powerful enough to show the voiding defects within the solder sphere. We ran a board side by side against a high end system and find that out

Grainy Solder Joints

Electronics Forum | Fri Jun 25 13:25:04 EDT 2004 | russ

Sounds like the wrong reflow profile was possibly used on this batch, Or you have a lead solderability problem. Usually you will pull a pad off of the board instead of the lead out of the solder joint. When a lead is torn from the joint it will ha

SOIC FAIL

Electronics Forum | Wed Oct 27 02:13:21 EDT 2004 | Joseph

Dear all, The problematic IC being X-rays and shown excellent wetting with no solder voids. Meanwhile the samples to be sent for independent party to verify the failure, e.g. using SAM method. The condition of failure is the PCB assembly fail functi

BGA Soldering

Electronics Forum | Tue Nov 02 08:01:13 EST 2004 | mattkehoe

Isn't that a good reason to use more paste? With just the paste from the balls, do you really get as good a solder joint as with a standard amount of solder paste added? What about voids? Do they go away by not using paste? I am talking about initial

dry solder paste

Electronics Forum | Sun Feb 27 13:42:44 EST 2005 | pmdeuel

So true, We had paste flux supplied to us from Alpha metals. It was the same as used in the solder paste. The major problem we noted was the in ability to control the ratio of paste to flux resulting in lots of voids. When we mixed enough to get the

Solder joint strength

Electronics Forum | Wed Mar 23 20:44:25 EST 2005 | pmd

Sounds like EA has way too much free time on his hands. How are you taking a reading. What instruments are you useing to get a reading. What are you looking for? Voids? Adhearsion? Contamination? Why would you need to know what it takes to break a co

X-Ray Recommendations

Electronics Forum | Wed May 18 03:13:28 EDT 2005 | grantp

Hi, We place BGA, but until now have not used X-Ray inspection, and it would be a good thing to have. Can anyone recommend a low cost X-Ray that would get us by. We don't need something fast, but it should be able to show us clearly voids etc. Reg

X-Ray Recommendations

Electronics Forum | Thu May 19 07:16:23 EDT 2005 | danhui888

Glenbrook is the best if you are looking for a low cost unit. I had sold numbers of this units in Asia and customers are so please with it. If you need to check the voids and have the data, an option of GTI-5000 software needed. Send an email to me a

BGA pad size

Electronics Forum | Fri Jun 17 23:31:12 EDT 2005 | kenscj

Hi all, currently, we are seeing BGA problem like solder ball misalign, void, solder short (all under BGA, tested with 5DX), after reflow. We examine the solder ball (raw material of BGA), and see that the ball surface is not smooth, will that affe


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