Electronics Forum | Tue Mar 16 18:11:54 EDT 2021 | grahamcooper22
I am wondering, I have an application for assembling a 0.4mm WLCSP to a pcb....the solder sphere size is 0.26mm...would you print paste in the normal printing process and then place the device and reflow...or would you use a fluxing station on the pi
Electronics Forum | Thu Apr 14 15:33:41 EDT 2022 | ppcbs
I've never lost memory in a BGA from heat removal. However we can create a profile on our BGA rework stations to remove using bottom heat only. This exposes the BGA body to temperatures of around 190 to 200C. I have a colleague that has a machine
Electronics Forum | Tue Jan 09 14:06:11 EST 2024 | poly
I recently bought an Ebso. I haven't got experience with other manufacturers but I'd currently recommend not them. It doesn't save any time over hand soldering, takes a ton of power and nitrogen, it's really hard to program, has no process control
Electronics Forum | Tue Sep 07 06:14:27 EDT 1999 | Earl Moon
| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine
Electronics Forum | Tue Sep 07 22:07:56 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Fri Dec 12 22:41:27 EST 2008 | split63
I'm looking to purchase a used pick and place machine. A machine like the Samsung CP20 or CP45 is about right. I don't know what the equivalent machine is with the other major vendors such as, Fuji, General, Philips, etc. In general this would be
Electronics Forum | Thu Nov 19 13:01:40 EST 2009 | deanm
I'm assuming that 18k components per month represents less than 100 boards per month. I've worked for both OEMs and CEMs and if your design is stable and your volumes are relatively stable I would highly recommend going with a CEM given the low volum
Electronics Forum | Thu Sep 30 15:06:05 EDT 1999 | Dave F
| Guys & Gals, | | I am at present instigating a formal method of recording and tracking any "process" trials that we may wish to run, such as a new paste, different packaged device etc; | | I started with a simple form.....too simple, but now I th
Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F
| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
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