Electronics Forum | Mon Sep 22 15:32:20 EDT 2008 | davef
We see this fairly often. It doesn't affect solderability. Our analysis makes us think this coloration is copper. The reason copper appears on the surface may be that heat cycles increase the thinness and porosity of the immersion silver [IAg] coatin
Electronics Forum | Mon Oct 20 17:19:42 EDT 2008 | davef
You're correct CK. Additionally, Ralph Woodgate gave inspirational lectures on wave soldering. For years, he was on the SMTA lecture tour. He had a real talent for explaining the solder process. He'd be talking blablabla and DING ... you'd remember
Electronics Forum | Wed Nov 05 18:39:06 EST 2008 | joeherz
Hello, We have recently installed a selective soldering machine and are seeing some voiding/cratering in random locations. We have done some basic experimenting with fluxing parameters, preheat and dwell times but haven't been able to eliminate it.
Electronics Forum | Sat Nov 08 09:10:16 EST 2008 | davef
SN100 was designed for selective soldering and producing low levels of voiding. But thin barrel plating is a common cause of voids in wave and selective soldered connections, as you say. As a result, you checked the plating thickness and it was accep
Electronics Forum | Tue Nov 11 19:41:06 EST 2008 | gregoryyork
Thats the problem residual residue from HASL fluxes Lead free especially are worse.Very hygroscopic and out gass and produce dewetting as well over wave soldered boards especially. Leave iron on blown joint and will after several seconds fizz and pop
Electronics Forum | Fri Nov 21 16:48:05 EST 2008 | kennyg
Anyone have an 'easy' solution for reducing PCBA handling damage. I'm fighting low level chipped, scuffed and broken-off SMT parts. The damage is spread out across different areas of the assemblies. The assemblies are double sided SMT with 0402's
Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Mon Feb 09 20:06:15 EST 2009 | davef
Pallet fabricators are: * AGI; 177 Nick Fitcheard Rd NW, Huntsville, AL 35806; 256-858-3300 http://www.agicorp.com/ * Pentagon EMS; 10950 SW 5TH St, Suite 230, Beaverton, OR 97005; 503-924-2747 F503-924-2744 http://www.pentagon-ems.com * M&O Precis
Electronics Forum | Thu Feb 12 11:57:59 EST 2009 | jmiller
i have searched the forum for hours. read all the threads that deals with cleanliness and ionic testing. (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=40295) (http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=22603) (http://www.
Electronics Forum | Thu Mar 12 03:14:14 EDT 2009 | nibirta
Thank you for support. As i promised you, I am coming back with the results. The SM used was Probimer 77 with Kester 979 flux. The supplier says that there is an incompatibility and we have changed the flux with IF2009M. Same problem! They have chan
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