Electronics Forum | Fri Jul 20 18:07:16 EDT 2001 | mparker
The latent contamination in sponges seems to be a minimal concern to me. Sponges will harbor more bacteria than a wet rag that is washable, but that is of greater concern in the kitchen than the rework line. Keeping a properly tinned solder tip is m
Electronics Forum | Mon Jul 30 18:07:22 EDT 2001 | mparker
Kenny- there are a few standards by IPC and EIA that address the strength of solder. A pull test (which is a destructive test) will average 1500 PSI per joint. My concern is that you are wanting to increase solder volume for an 0805 component by inc
Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan
Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
Electronics Forum | Thu Jan 27 14:49:53 EST 2000 | Glenn Robertson
Tuan - One of the reasons I suggested pre-tinning (aside from the negative effects of Gold on appearance and reliability) is the known slower wetting of Sn/Ag and Sn/Cu alloys as compared to Sn/Pb. If you don't have to be Lead-free, the high Lead
Electronics Forum | Tue Jan 11 07:46:23 EST 2000 | Dave F
Wolfgang: Boy it's tough to convey context in this medium, isn't it? Clipped from our paste storage work instruction, environmental effects on paste are: 1a Avoid excessive heat (over 80� F). It causes flux separation, reducing print quality. 1b
Electronics Forum | Fri Dec 17 08:29:18 EST 1999 | Wolfgang Busko
Hi Chuck, let�s say it the other way round. We use noclean since I can�t even remember without nitrogen and all of our subcons do with no known problems. The processes are adapted to it and no complaints are heard up to now. That is related to our pr
Electronics Forum | Sat Dec 11 12:15:21 EST 1999 | Steve Thomas
We have a pretty challenging board (2-up panel, 15"x20", 48 20mil pitch QFP 100's and 2 25mil QFP128) that gives us LOTS of lead bridging on the 20 mil parts. There is typically very poor wetting on these parts also, and some joints just flat aren't
Electronics Forum | Fri Nov 05 21:41:46 EST 1999 | chartrain
Temperature vs time is what soldering is all about. The faster you run your conveyor, the more heat will have to come from the pot for a given assembly. Example: You heat the board to 200F top side through the preheaters. Eutectic 63/37 melts at 361.
Electronics Forum | Tue Nov 02 23:34:58 EST 1999 | chartrain
You appear to have two problems working against you at once. One is component lead corrosion that the no clean flux isn't aggressive enough to remove. Do a simple dip and look test. Flux the leads of a component and dip it into the molten solder for
