Electronics Forum | Thu Jan 25 12:18:40 EST 2007 | wagoner
There are several smd components in our factory that don't reliably wet to solder during reflow. Paste and placement are good, but the component won't wet reliably. All of the other components on the boards solder fine, but one of these components
Electronics Forum | Fri Nov 05 10:01:04 EST 1999 | Dave F
Chris: You can have more than "one question!!!" Anyhow, yes crappy solder paste can cause non-wetting, but before you go there understand why the paste is wetting some surfaces, but not others. Ta Dave F
Electronics Forum | Tue Aug 11 16:49:28 EDT 1998 | Dave F
| Looking for Suppliers of surface mount wetting balance equipment. Bucky: Section 6 of the ANSI/J-STD-002 specification lists wetting balance suppliers. Dave F
Electronics Forum | Wed Jan 04 16:43:36 EST 2006 | jdengler
Wet wipe could allow solvent through the apps and into the paste. For this reason I never never never use wet wipe.
Electronics Forum | Mon Oct 22 20:41:32 EDT 2007 | jkhiew
Hi Dave, The solder has tended to wet the component termination of Ag/Pd (chip capacitor) but has not wetted the pads, whereas the solder has wetted both termination & pads when using Ag/Ni/Sn finishes. Thks
Electronics Forum | Fri Oct 21 12:22:56 EDT 2016 | horchak
Looking at your picture I'm not sure you have a wetting problem. Who determined it's not wetted? Are you having functional failures? Is this an isolated incident? What was your TAL? Is the pad on the suspect ball possibly smaller than the others, or
Electronics Forum | Fri Feb 24 19:22:58 EST 2023 | SMTA-71549289
From my understanding titanium is typically used for non-wetting nozzles, correct? And then wetting nozzles are made of other metals with a coating that allows it to wet.
Electronics Forum | Mon Jul 31 03:50:26 EDT 2023 | calebcsmt
Is below the correct interpretation of IPC 610/JSTD requirements for FLAT LUG LEADS (seen on USBs and Diodes mainly) For class 1 or 2, no toe wetting would be required as minimum side joint is only 'evident wetting' and no actual length or fillet he
Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg
I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this
Electronics Forum | Wed Jul 09 13:48:03 EDT 2003 | russ
Sam, You may want to be careful with your analisys, reducing paste volume also reduces flux volume. Flux is there to promote and aid in wetting. by reducing flux you may have initiated the poor wetting yourself with the experiment. Just anothe
winsouce.jpg)
