Electronics Forum | Mon Jun 04 18:24:26 EDT 2001 | richf
Hi to all, I found the term AAP rework on BGA rework and process rework document, does anybody know or have seen before the initials AAP? what do they mean?
Electronics Forum | Mon Jun 18 13:33:46 EDT 2001 | nifhail
Thanx Dave. What about the ball park figure for 20 & 16 mil pitch pull strength. Appreciate your input and thank you in advance.
Electronics Forum | Mon Jun 11 10:35:57 EDT 2001 | bbivins
Are there incoming rinse water quality standards - specifically maximum concentrations of magnesium and chloride - for an aqueous or semi-aqueous cleaning process? If there aren't standards, does anyone have experience with what the max can be befor
Electronics Forum | Wed Jun 13 12:08:22 EDT 2001 | vance
What kind of quality improvements could be expected by implementing MPM's Rheopump instead of using squeegee blades on a stencil printer?
Electronics Forum | Thu Jun 14 09:56:13 EDT 2001 | vance66
Could you guys comment on changing heads? We may have to change heads 6-7 times a day. What would be the negatives with this?
Electronics Forum | Thu Jun 14 08:49:36 EDT 2001 | adam
I'd like to know what advantages are there to use silver emerge PCB's. Currently we are using HASL boards, and we are having problems especially using BGA connectors. Any help will be appreciated. Adam.
Electronics Forum | Mon Jun 18 12:31:21 EDT 2001 | ashokdha
Gil For BGA Inspection, What are the other technologies available to us ( e.g. infrared ? ultrasound ? laser ? Mirrors ? ) Can you provide your perspective on that ? How safe and cost effective the X-Ray system is as compared to other methods of i
Electronics Forum | Wed Jun 20 15:56:33 EDT 2001 | Gil Zweig
For the applications you mention you would probably want to resolve details of at least 8 microns (0.0003") which would translate into a bare minimum resolution requirement of 60 to 100 line pairs per millimeter at a minimum geometric magnification o
Electronics Forum | Mon Jun 18 18:28:07 EDT 2001 | davef
We are assembling BGA [Texas Instruments (TMS320C6201)] that has metal slugs in the packaging that act as heat sinks. What are your recommendations for inspecting the solder connections on such devices?
Electronics Forum | Tue Jun 19 17:56:04 EDT 2001 | genny
We don't currently use BGA's on any of our products. Are there other worthwhile reasons to use x-ray that would benefit enough from it to justify it economically? Also, I have heard that to put it inline can cause bottlenecks.
