Electronics Forum | Fri Sep 24 09:54:33 EDT 1999 | Charles A. Mohn
I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field?
Electronics Forum | Fri Sep 24 10:19:41 EDT 1999 | C.K.
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | I believe you're referring to "ELECTROMIGRATION."
Electronics Forum | Fri Sep 24 11:12:32 EDT 1999 | Chris May
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? |
Electronics Forum | Fri Sep 24 11:13:33 EDT 1999 | Chris May
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | I believe you may mean DENDRITIC GROWTH (Dendrites).
Electronics Forum | Fri Sep 24 17:14:29 EDT 1999 | Dave F
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | Charles: Both Chris and CK are correct, according to the SMTnet "Dictionary:" "Dendrite. Metallic filaments growing by elec
Electronics Forum | Tue Sep 28 12:00:38 EDT 1999 | -KH
| | I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | | | | I believe you're referring to "ELECTROMIGRATION." | Dendrites.
Electronics Forum | Wed Sep 29 07:52:41 EDT 1999 | Brian
| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | Sorry, forgot one in my previous message: solder balls :-) Brian
Electronics Forum | Wed Sep 22 09:21:43 EDT 1999 | Eric Lee Williams
What is the command string used to download updated software from floppy discs to the mcs16b controller?
Electronics Forum | Tue Sep 21 17:14:44 EDT 1999 | Robert Steltman
Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard t
Electronics Forum | Tue Sep 21 14:25:40 EDT 1999 | Howard Leveque
Corvis has requirements for pc manufacture, parts procurement, and board assembly. This is to include boards of up to 10-12 layers, and down to 0603 SM components. If all of these are what you do, please contact me at: Corvis Howard Leveque 443-25
