Electronics Forum: wire (Page 119 of 139)

Substrate Au/Ni thickness

Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef

Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat

J-STD-002 and -003 solderability testing...

Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef

Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu

ECOs on OSP finish

Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef

Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian

| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco

Re: Profiling

Electronics Forum | Mon Jul 26 11:20:40 EDT 1999 | Kevin Hussey

| | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) |

Re: Profiling

Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones

| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e

Re: Adhesion loss on passives over wave

Electronics Forum | Fri Mar 19 13:26:19 EST 1999 | Scott Cook

| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet

Re: Screen tension (measuring)

Electronics Forum | Mon Mar 15 23:00:40 EST 1999 | Dave F

| In the early days, we used screens made of stainless steel or polyester. Sometimes - after A period - the tension was not good, because A wire was broken. | Later on we started to us metal stencils, glued in A polyester screen. even than we had som

Re: Screen tension (measuring)

Electronics Forum | Tue Mar 16 08:38:59 EST 1999 | George Verboven (Process Engineer)

| | In the early days, we used screens made of stainless steel or polyester. Sometimes - after A period - the tension was not good, because A wire was broken. | | Later on we started to us metal stencils, glued in A polyester screen. even than we had

Re: Gold Finger Cleaning

Electronics Forum | Sat Nov 14 08:05:54 EST 1998 | Earl Moon

| | | | I believe that gold fingers on my circuit boards are being | | | | contaminated and need to clean them with some chemical | | | | solution. Any recommendations. | | | | | | | Chuck: What is the type and source of your contamination? Dave


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