Electronics Forum: worked (Page 731 of 1069)

Re: IR rework stations

Electronics Forum | Tue Sep 28 05:58:59 EDT 1999 | Wolfgang Busko

| | | | | | | | | | Hiya, | | | | | | | | | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | | | | | | | | | Cheers

Re: IR rework stations

Electronics Forum | Tue Sep 28 08:55:21 EDT 1999 | Earl Moon

| | | | | | | | | | | Hiya, | | | | | | | | | | | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | | | | | | | | |

Re: pallet design for thin pcb's

Electronics Forum | Thu Sep 23 22:31:25 EDT 1999 | Dave F

| | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the scree

Re: Component wastage

Electronics Forum | Wed Sep 22 18:23:27 EDT 1999 | Deon Nungaray

| Does anyone have any figures on what % extra compnents should be supplied on chip components for a particular product build. Typicaly there is wastage due to dropout in loading, 1st board build and machine rejections. Is there any industry standard

Re: The best way to catch defect online

Electronics Forum | Wed Sep 22 10:33:17 EDT 1999 | Boca

| which is the best way to catch defects online? | In circuit Tester or Vision System | Carlos, It depends on the defect you're trying to catch. Vision systems can be good at catching missing, reversed, wrong (if marked) parts. ICT is good with el

Re: MicroBGA printing problem

Electronics Forum | Mon Sep 20 17:26:22 EDT 1999 | Earl Moon

| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi

Re: MicroBGA printing problem

Electronics Forum | Tue Sep 21 12:10:23 EDT 1999 | Mario

| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi

Re: screen printer x axis

Electronics Forum | Mon Sep 20 11:53:41 EDT 1999 | Scott S. Snider

| HI everyone, | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00085 and .001

Re: screen printer x axis

Electronics Forum | Thu Sep 23 21:51:27 EDT 1999 | harry

| | HI everyone, | | | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00085 an

Re: Pick Place Change-overs, strengths, ages

Electronics Forum | Thu Sep 16 18:13:17 EDT 1999 | Earl Moon

| I have a number of hopefully easy questions: | | 1. Are there significant differences in the ease of change-overs and set-up among different equipment manufacturers? For example, are Siemens Siplace machines truly more modular than others? We b


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