Electronics Forum: works (Page 541 of 1073)

Re: Via in Pad for BGAs

Electronics Forum | Mon Feb 23 23:50:18 EST 1998 | mike

| Does anyone have any experience with via in pad for | BGAs using conventional thru hole technology? | Steve Joy Steve, I had a customer who had designed a board to use a BGA socket. Well the socket did not work out so we then placed the bga dire

Placing 160 Pin QFP on Fuji HP machine?

Electronics Forum | Mon Feb 16 18:38:29 EST 1998 | Eric Cox

Hi All! Has anyone out there had any success using a Fuji HP machine to place a 160-Pin PQFP part? The part is 28 mm square, with 1.6mm long pins. Whenever our HP tries to place the part, it get an Image procs error. Our supplier says that the m

Re: QUAD 4-C

Electronics Forum | Wed Feb 25 03:01:13 EST 1998 | MARK EDVINSSON

| We are facing some placement problems with | our QUAD 4-C. | Program was running fine last week, Next week | program will be off (placement, pickup,vision files | etc, | Any help, any idea,??? | Thanks To be honest with you those machine they never

Re: Stencils for solder paste

Electronics Forum | Mon Dec 22 16:19:26 EST 1997 | Justin Medernach

| Need help determining the size / $ value of the stencil market | in North America. Can you offer suggestions as to who or where I can go to get a grasp on this data??????? | Thanks for any help. Dave, The market is huge. I work in the New England

Re: Vapour Phase Soldering

Electronics Forum | Fri Mar 06 09:24:44 EST 1998 | Hector Valladares

I have been using Vapor Phase for about 5 years. We just started building our first BGA and the reflow profile is the same as most SMT assembly.We build PWA that are 25 layers thick with 0.050 heat sinks. We have done some preliminary X ray and BG

Re: Vapour Phase Soldering

Electronics Forum | Sun Jan 11 11:59:13 EST 1998 | Bob Willis

VP does work well for BGA Technology but it is not any great improvement on convection reflow. It has been stated in a coulpe of articles that there is no delta T difference with VP from the surface ofthe board and under the BGA. That is not true jus

Rectangular uBGAs with 1 raised edge after reflow

Electronics Forum | Sat Sep 29 08:12:06 EDT 2001 | roland

Gregory, Thank you for posting the results of running your boards yesterday (glad to hear everything worked out well). I am sure other SMTneters are glad to see the sharing of their information helped. Perhaps others who have used information pr

Delete Should Delete

Electronics Forum | Thu Aug 09 15:25:52 EDT 2001 | neil

Your right Dave. The system is set up correctly but sometimes there is a problem deleting messages with attachments. This problem was exacerbated by the scam32 virus. We set up Norton AntiVirus to quarantine these attachments and when you try to dele

Tear Down

Electronics Forum | Tue Aug 14 21:16:58 EDT 2001 | mugen

Dave, Do u talk with a whistle then? *grinz* Anyway, thanks for the detour down memory lane, it reminds me of my childhood, A friend and I, stuck a lawn mower motor unit, to my bike, to determine how fast a bike config, could run? It worked alrigh

Solder Beads

Electronics Forum | Thu Aug 16 13:46:06 EDT 2001 | Hussman

Hi Pavel, I'll bet you're talking after reflow - so in a nutshell - it is too much solder. Paste goes under the R or C and rests on the mask after placement. During reflow, this excess paste balls up along your part (wow, look Ma, no rocket scienc


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