Electronics Forum: ws 609 time (Page 1 of 16)

Re: MicroBGA printing problem

Electronics Forum | Tue Sep 21 11:28:26 EDT 1999 | Dave F

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are usi

caps have yellow stain after wash

Electronics Forum | Tue Jun 07 12:07:30 EDT 2016 | wlsmt

Sorry davef. I was not being clear. PCBAs came out cold soldered after being reflowed the first time with ALPHA WS-820. The flux gel ALPHA WS 609 was supposed to be applied only onto the terminations of caps where ALPHA WS-820 was for a second refl

caps have yellow stain after wash

Electronics Forum | Wed Jun 15 10:38:41 EDT 2016 | laynefelix

Hi everyone..i am new here. I am hardware design engineer and as per my experience PCBAs came out cold soldered after being reflowed the first time with ALPHA WS-820. The flux gel ALPHA WS 609 was supposed to be applied only onto the terminations of

To clean or not to Clean??

Electronics Forum | Sat May 29 16:04:49 EDT 1999 | M Cox

I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a double-sided

Re: Poor Solder on TSOP

Electronics Forum | Thu Jun 25 20:26:37 EDT 1998 | Chiakl

I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi

Re: Poor Solder on TSOP

Electronics Forum | Tue Jun 30 11:51:41 EDT 1998 | Michael Fogel

I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everyt

Re: Poor Solder on TSOP

Electronics Forum | Thu Jul 02 19:18:31 EDT 1998 | Rin

I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. E

Re: Poor Solder on TSOP

Electronics Forum | Thu Jun 25 20:16:01 EDT 1998 | chiakl

I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe

Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s

WS-709

Electronics Forum | Tue Apr 01 19:21:25 EST 2003 | Myu

I'm a user changing over from WS-609 to WS-709. WS-709 has less voiding problem and longer stencil life than WS-609. Ws-709 has a less foaming during washing process. Thanks, Myu

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