Electronics Forum | Thu Oct 04 13:04:52 EDT 2001 | Hussman
Without seeing your X-ray, it sounds like your BGAs are out gassing. This casues the situation you described. Try baking some BGAs and run them along with ones not baked to see.
Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef
Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.
Electronics Forum | Mon Oct 08 20:50:37 EDT 2001 | ksfacinelli
What material are you using? There are a great deal of different Teflons (in the family of Teflons) material....is it from Gore or Rodgers???? Does it have aluminum backing?? More information necessary, Kevin
Electronics Forum | Fri Sep 13 02:27:21 EDT 2002 | jojojameson
kenbliss , We can give you a complete solution for installation,manufacturing & process control. Regards jojo jameson
Electronics Forum | Wed Oct 10 19:04:32 EDT 2001 | mparker
What the heck are you doing having scotch tape in the plant? Isn't there a concern for ESD safety? Ban the scotch tape, then they won't have something to block the apertures with.
Electronics Forum | Fri Oct 12 12:44:03 EDT 2001 | dalejans
Is it acceptable to clean an assembled board in the ultasonic stencil cleaner? The cleaning requirement is where water soluable flux is used and needs to be removed. Thanks for you information!
Electronics Forum | Mon Oct 15 16:56:18 EDT 2001 | davef
First, I�d like to kiss-up to the people that are likely to be responding to this question. Thank you for contributing to my recent query about placement program control. OK. Let�s talk about �good practices� in placement programming. Throw in an
Electronics Forum | Thu Nov 01 13:01:16 EST 2001 | dave231
Ditto for what most people have said. If you have good equipment/ good data / 3 or more fiducals..everything should be OK. Maybe dirt or something got bang'd. tweaking is evil,but if nothing else works??? dave
Electronics Forum | Tue Oct 16 15:58:45 EDT 2001 | roland
In case anyone hasn't noticed...there are now new site features available. You can read more about the changes at: http://www.smtnet.com/about/intro_demo/frame_2.cfm
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
