Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Fri May 13 16:23:03 EDT 2005 | patrickbruneel
PR What you're up against is the usual bottom line manufacturing "cost" I have no direct experience with CEI, but I have experience competing with low labor cost. I have to disagree with Russ that Singapore cant handle high mix low volume because t
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
Electronics Forum | Wed Aug 10 04:15:01 EDT 2005 | vinitverma
Ari, I would suggest you make a checklist of all your requirements (not just large scale production) and prioritize them with weights assigned to each. Fill in the checklist for each equipment and manufacturer and you'll have the results out. I wou
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef
We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste
Electronics Forum | Thu Jun 15 18:15:34 EDT 2006 | nickel
If you have time, download the free Practical Guide to Understanding the Scope of the WEEE and RoHS, you will find what they say about UPS. They consider UPS out from the field of application of RoHS. ORGALIME (Bruxelles)is the European Engineering
Electronics Forum | Fri Mar 24 05:12:17 EST 2006 | Rob
You feeling OK Larry, I'm almost agreeing with you! Right, ROHS & WEEE are designed so that we don't throw away huge amounts of electronic waste into landfill that then pollutes our drinking water with Lead, polybromides, cadmium, mercury etc, which
Electronics Forum | Tue May 23 17:49:07 EDT 2006 | flipit
Hi, Ok I have some numbers for you on my process. For the last 2 years we have been placing 4 BGA on a 2" X 5" X 0.062" PCB. The BGAs are 16X16 256 ball, 15X11 165 ball, 8X8 64 ball, and 26X26 456 ball. The 8X8 is 0.8mm pitch and the others are 1
Electronics Forum | Fri May 26 21:25:52 EDT 2006 | mika
Yes we do place "big and heavy" SMT DC/DC:s on most of our board's. Please tell us what brand it is or at least what the package look like?!? For instance we place a different numbers of "heavy" DC/DC converters (40x20mm & 45x25mm) that has the pick-
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