Electronics Forum: you (Page 3196 of 3791)

adhesive on pads

Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef

You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a

adhesive on pads

Electronics Forum | Tue Apr 02 11:50:58 EST 2002 | slthomas

"Oh. [Howabout if I smack you?]" Like I ever said anything 'bout strings. Sheesh. I'm gonna save this one for future reference. Oughta take a week or two to figure out whether yer trying to make a fool of me or not. ;) Criminy. And I was think

Selective wave selection

Electronics Forum | Mon Apr 01 05:55:54 EST 2002 | nifhail

Anyone with selective wave experience ? I'm buying the Selective Wave machine and trying to workout the comparison matrix. Can someone tell me what criteria should I look at when listing down the matrix ?...things like, min clearance to the high prof

Selective wave selection

Electronics Forum | Sat Apr 06 07:44:26 EST 2002 | yngwie

Dave, thanx for your input. Its really helps. Just need some clarifications on : 1) Consider evaluating chimney versus programmable / conveyored machines separately. Question: is there any disadvantages of the programmble/conveyored vs chimney ?

Selective wave selection

Electronics Forum | Tue Apr 16 15:01:55 EDT 2002 | wf

Have you considered point-to-point selective soldering using microflame ? If we look at the excellent points that Dave made.... The clearance required for the microflame is minimal, no tooling plate is required - only to fixture the parts and the p

Reflow profile negative temp ramp rates

Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef

Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping

BGA process requirements

Electronics Forum | Fri Apr 19 08:01:40 EDT 2002 | jnunns

We have been doing BGAs for about 3 years in house. We started off with an outside contractor and then brought it in. We are doing a variety of sizes from .05 to .03 pitch. We have 2D capability at print, but do not use it on any but the .03 pitch. T

QP-132E // FCM 2

Electronics Forum | Sat Apr 20 22:50:36 EDT 2002 | lysik

I am sure the QP-132 is a more stable platform. It is a Fuki after all. My big question is why not X2 CP-6 machines. I mean you can tell by resale value of the FCM Vs the QP-132 that the QP-132 is a rock solid machine but, for such cheap money two CP

Solder paste for RF boards

Electronics Forum | Mon Apr 15 18:58:10 EDT 2002 | davef

Problems using NC in RF circuits are peculiar. Depending on the situation [ie, circuit layout, frequency of use, processes used, materials, and what not], a particular NC flux may not work with a RF circuit. Various NC fluxes leave different levels

Solder Balls

Electronics Forum | Thu May 09 10:00:19 EDT 2002 | brianockert

I'd tend to agree with what the others have said. Check the basics, board supports, setup, wiper paper working correctly. If it's a humidity issue, try taking some paste, place it on a chem wipe, and roll it around a bit, which removes some of the mo


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