Electronics Forum | Wed Jan 11 08:27:35 EST 2006 | davef
MSK As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wett
Electronics Forum | Mon Jan 09 07:01:47 EST 2006 | ron
I was wondering if anyone was using this machine to place 0402's and what type of 1st pass yield you were getting. I'm a little leary about the mechanical centering on such small parts. How is the feeder pick up position after it is taught? I have h
Electronics Forum | Tue Jan 10 12:17:17 EST 2006 | Rob
Hi, The ROHS compliant parts are usually Matte Tin on the outer terminal plating. There are also 2 further types of metal on the average chip cap - the undercoat metal of the outer electrode & the inner electrode. These are usually the same & are
Electronics Forum | Wed May 03 22:33:57 EDT 2006 | ramerez
I am based in Nogales and I have also tried the MS2, I was told to immediately cancel my trials, It did reduced the build up of dross but the mess it made to the wave and the surrounding areas was very bad, Everything was coated black and the smell a
Electronics Forum | Tue Feb 14 07:39:19 EST 2006 | samir
I was able to escape from Riyadh last week to attend APEX. PK Metals actually had a booth where they did a live demo. They had a working solder pot with dual wave, and demonstrated how their material acts as a barrier to oxidation, which causes dro
Electronics Forum | Tue Feb 14 09:35:25 EST 2006 | Baer
Let me give some information on the use of MS2. The average wave solder machine will use one liter per five day week per 8 hour shift. The usage can vary + or - 20%. Instead of removing 6 to 10 Lbs of dross every 3 hours you will have to remove 100 M
Electronics Forum | Fri Feb 17 14:54:45 EST 2006 | Baer
We have a great deal of new reliability data and we are preparing a full document that shows the statistically valid reduction in solder related defects as well as the improved throughput. It will include all of the SIR test results which are all goo
Electronics Forum | Sun Feb 19 17:01:28 EST 2006 | Baer
A 70 reduction in solder useage is about what we are seeing. You are correct that there are machines that work better with MS2 than others. We are able to make slight modifications to those units, mainly making it more difficult for dross to hide fro
Electronics Forum | Wed Jan 18 09:06:30 EST 2006 | ronhammer
What I mean by it does not work is after I moved the brackets I have about 4.5 inches from the end of the TWM to the conveyor point. None of our conveyers fit there all our Conveyers have about 6 inches in the front on the conveyer. Is there a differ
Electronics Forum | Fri Mar 31 16:02:35 EST 2006 | daxman
I'm not sure if we are on the same page here....maybe i'm lost in the terminology. We are pulling the entire placing head. The Windmill, the shaft, the clutches...the entire thing. I'm not sure if this is what you mean by, "dropping the clutches"