Electronics Forum | Fri Dec 28 17:44:41 EST 2007 | flipit
Back in the mid 90s I used an SVS 3D solder paste inspection system. We used it as a stand along unit but it was an inline model. We would bring printed PCBs off the Dek 265 solder printers and check every 5 or 10 printed panels. They almost alway
Electronics Forum | Tue Jan 08 22:48:58 EST 2008 | davef
Maybe these folk can help you with your MTM issues. http://www.mtm.org We appreciate the desire to balance the line with respect to standard insertion time, number of insertions, and number of assemblers. In reality there are too many variables fo
Electronics Forum | Thu Jan 17 11:49:54 EST 2008 | wayne123
HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the
Electronics Forum | Mon Jan 21 19:22:38 EST 2008 | davef
In your situation, the issue is the compatibility of your flux residues and the encapsulant that you choose. First, contact your encapsulant supplier for advice. They've likely been down this road with other customers and may be able so save you som
Electronics Forum | Wed Feb 13 09:17:47 EST 2008 | scottp
The causes of voids are extremely paste dependent. I did a literature search a couple years ago and the papers all disagreed with each other - one would say turn knob "A" to the right and the next would tell you to turn it to the left. I did my own
Electronics Forum | Wed Feb 20 10:04:15 EST 2008 | slthomas
Yeah, it blows, but basically we toss it when it quits printing. We've never seen any visible quality issues we could attribute to recycling paste like this so we keep doing it. When we start doing BGA and X-raying stuff we'll take a closer look at w
Electronics Forum | Wed Feb 20 16:52:11 EST 2008 | pms
Yea, I'm still here.....sigh. Got bridging problems. These assemblies are SMT topside, then go thru wave for thru-hole components on topside. These assemblies have many, many, many vias VERY close together. We have a problem with solder from the wa
Electronics Forum | Wed Mar 12 09:02:40 EDT 2008 | davef
Your question implies that you would like to find a way to use the device you received with the BOM, rather than returning the part for the correct item. Given that situation, choices are: * Glue the part on the board bug-up [upside-down] and run jum
Electronics Forum | Wed Apr 16 09:02:09 EDT 2008 | tonyamenson
One issue stated incorrectly was that the work order that had no problems, with the same layout and same parts, is a one up at SMT. The problomatic units are two ups. I know the first instinct is to say the profile, but we have run this assembly man
Electronics Forum | Thu Apr 17 05:14:40 EDT 2008 | gregoryyork
I have seen similar things like this before with Solder Resist redepositig back on the pads, this is a clear residue very hard to see. Solder resist will obviously resist solder adhering to it. If you rework the boards then the heat of the iron will
