Application of thick film printing on stainless steel surface

In this research work thick‐film manufacturing technology on stainless steel baseplates was developed. Adequate adhesion of dielectric IP211 to the steel substrate was achieved only by sand blast roughening. Standard PdAg thick‐film conductors were not solderable to IP211. The solution was to have a separate multilayer dielectric under conductors to be soldered. The reliability of soft soldering and gold wire bonding of thick‐film metallisation on stainless steel and other base plate materials was evaluated. The technology developed was applied to manufacturing an intelligent signal node. Present expertise enables the manufacture of thick‐film hybrids on stainless steel base plates. Development of an industrial production line would, however, involve considerable effort.p J7208 Perfect solution to the printing process...