Laser Drilling as an Alternative for Via & Microvia Drilling
Published: |
May 16, 2024 |
Author: |
A-Laser |
Abstract: |
Much like actual cities where streets and roads connect buildings together, ICs on a board are connected to each other with copper traces. And just like any metropolitan city, urban expansion tends to move vertically instead of horizontally, but instead of multi-story buildings, we get multilayer boards. Vias are copper-plated holes spanning through the different layers of a given board or panel. They are the entrance locations to the subway stations, if you will. Having those multilayer boards has enabled electronic design to minimize the size of boards immensely without compromising on the complexity.... |
|
Company Information:
More articles from A-Laser, Inc. »
- Jun 14, 2024 - High Precision Laser Cutting
- Jun 10, 2024 - What is CNC Laser Cutting For PCB's and other materials
- Jun 07, 2024 - What is PCB Depaneling
- Jun 07, 2024 - What is Laser Routing with Ablation
- Jun 07, 2024 - What is Laser Routing with Ablation
- See all SMT / PCB technical articles from A-Laser, Inc. »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Laser Drilling as an Alternative for Via & Microvia Drilling article has been viewed 83 times