Electronics Manufacturing Technical Articles

Where PCBs and Printed Electronics Meet

Jul 14, 2016 | Chris Hunrath

Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that make connections. Both PCB and PE technologies have been in use for a long time in one form or another with PCBs currently the standard for complex, high speed electronics and PE for user interface, complex form factor or other film based applications.

New and innovative applications create the opportunity for promising structures. Taking advantage of the PCB shop's capability as well as the material set can help create these structures and indeed PE materials can find use in more traditional PCBs. New materials and new uses of existing materials open up many possibilities in electronic interconnecting structures.

PCB manufacturers have a complex manufacturing infrastructure, well suited for both additive and subtractive conductor processing. While built around rigid material processing (flex PCB being the exception), there are opportunities for PE substrate processing. As electronics devices are applied to more and more parts of our lives, we need to continually push for better solutions. Fit, function, manufacturability, and cost are all important considerations. Crossing the PCB/PE boundary is a way to meet the challenge....

Publisher: INSULECTRO

Dissolution of Metal Foils in Common Beverages

Jul 07, 2016 | Bev Christian, Nancy Wang, Mark Pritzker, Daniella Gillanders, Gyubok Baik, Weiyi Zhang, Joanna Litingtun, Brian Kim; Blackberry, University of Waterloo

How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers.

In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made....

Publisher: BlackBerry Limited

Analog FastSPICE Platform Full-Circuit PLL Verification

Jun 30, 2016 | Mentor Graphics

When designing PLLs in nanometer CMOS, it is essential to validate the closed-loop PLL performance metrics with nanometer SPICE accuracy before going to silicon. Transistor-level, closed-loop PLL verification has been impractical due to traditional SPICE and RF simulator performance and capacity limitations. By using Analog FastSPICE, designers dont have to trade accuracy for performance.

Read this white paper to see how AFS:

• Delivers closed-loop PLL transistor-level verification
• Supports direct jitter measurements
• Produces phase noise results correlating within 1-2dB of silicon

...

Publisher: Mentor Graphics

A Case Study on Evaluating Manual and Automated Heat Sink Assembly Using FEA and Testing

Jun 23, 2016 | Michael Sumalinog, Jesus Tan, Murad Kurwa; AEG, Flex.

Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.

This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA....

Publisher: Flex (Flextronics International)

Today's Smaller Cables Require Automated Processing

Jun 21, 2016 | Pete Doyon - VP Product Management, Schleuniger, Inc.

The trends in mobile electronics today are smaller, thinner and lighter. Yet, mobile devices are more powerful than ever. Applications, like wireless internet connections, RFID and Bluetooth, that have become essential in today’s devices, require more complex transmission mechanisms. As a result, manufacturers find themselves faced with the challenge of working with ultra-miniature RF cable assemblies....

Publisher: Schleuniger, Inc.

Embedding Passive and Active Components: PCB Design and Fabrication Process Variations

Jun 16, 2016 | Vern Solberg

Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.

This paper focuses on six basic embedded component structure designs described in IPC-7092....

Publisher: Vern Solberg - Solberg Technical Consulting

Cable and Harness Manufacturing: Productivity through Flexibility

Jun 06, 2016 | Margaret Bishop (CAMI Research)

Learn how to choose a cable & harness tester that remains relevant as product design changes in addition to providing fast, reliable, accurate results. See how it can improve productivity even beyond the production floor....

Publisher: CAMI Research Inc.

How to Select the Right Conformal Coating Spray for PCB

Jun 06, 2016 | Rana Kalitha

One of the most important steps in PCB assembly is the need for conformal coating for PCB. The process of choosing a conformal coating spray is a complex one as it involves a number of confusing decisions revolving around selections and compromises. ...

Publisher: Sumitron Exports Pvt. Ltd.

Materials Compatibility and Aging for Flux and Cleaner Combination

May 30, 2016 | Kim M. Archuleta, Rochelle Piatt

New engineered cleaning and defluxing agents promise great improvement in cleaning and reliability for electronic assemblies. As complexity grows and dimensions shrink in high reliability electronics, the need for materials compatibility and effectiveness in cleaning and rinsing is vital....

Publisher: Sandia National Laboratories

Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement

May 30, 2016 | Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D., Anwar Mohammed, Murad Kurwa, AEG, Flextronics, George Tint Ph. D., Saki America.

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes....

Publisher: Flex (Flextronics International)