Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1799 SMT / PCB Assembly Related Technical Articles

Effect of BGA Reballing and its Influence on Ball Shear Strength

Jul 11, 2013 | S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute of Technology, Scott Rushia; MARTIN

This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient)....

Publisher: MARTIN (a Finetech company)

MARTIN (a Finetech company)

Manufacturer of rework and reballing systems, hand soldering solutions, and micro-dispensing technologies

Manchester, New Hampshire, USA

Manufacturer

PCB Guide Design

Jul 11, 2013 | Y. B. Kang

The basic is essential to understand any technology. In SMT, PCB design is an important factor as the technology is fully automated and all the work is performed by machine. Machine is a sensor and it works by sensing the data given to it, so the data should be accurate for quality product. In the attached topic the basics of SMT designing is explained. In the book “Essentials of SMT: Practical Know-How” all the basics of SMT manufacturing is explained in very simple and easy to understand language. ...

Publisher:

Performance of Kapton Stencils vs Stainless Steel Stencils for Prototype Printing Volumes Processes

Jul 03, 2013 | Bob Wettermann, Hung Hoang

It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality....

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center

Rolling Meadows, Illinois, USA

Consultant / Service Provider, Manufacturer

Justifying AOI and Automated X-Ray

Jul 02, 2013 | Don Miller, YesTech Inc.

AOI and AXI systems can address multiple tasks in various locations of the manufacturing process and have become the leading technologies in the quest to identify defects and improve process yields....

Publisher: Nordson YESTECH

Nordson YESTECH

Nordson YESTECH is a leading global provider of automated optical inspection and high-resolution x-ray inspection systems.

Carlsbad, California, USA

Manufacturer

System Level ESD Part II: Implementation of Effective ESD Robust Designs

Jun 27, 2013 | Industry Council on ESD Target Levels

While IC level ESD design and the necessary protection levels are well understood, system ESD protection strategy and design efficiency have only been dealt with in an ad hoc manner. This is most obvious when we realize that a consolidated approach to system level ESD design between system manufacturers and chip suppliers has been rare. This White Paper discusses these issues in the open for the first time, and offers new and relevant insight for the development of efficient system level ESD design....

Publisher: Industry Council on ESD Target Levels

Industry Council on ESD Target Levels

An independent body of ESD experts with the mission to review the ESD robustness requirements of modern IC products for allowing safe handling and mounting

Dallas, Texas, USA

Association / Non-Profit

Low Surface Energy Coatings Rewrites the Area Ratio Rules

Jun 20, 2013 | Ricky Bennett; Assembly Process Technologies, Eric Hanson; Aculon

With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process....

Publisher: Assembly Process Technologies LLC

Assembly Process Technologies LLC

With over 20 years of experience in the electronic and semiconductor assembly design, we offer rapid prototypes for R&D or New Product Introduction.

Flemington, New Jersey, USA

Consultant / Service Provider

Electromigration Damage Mechanics of Lead-Free Solder Joints Under Pulsed DC: A Computational Model

Jun 13, 2013 | Wei Yao, Cemal Basaran

Electromigration (EM) is a mass transportation mechanism driven by electron wind force, thermal gradient, chemical potential and stress gradient. According to Moore’s law, number of transistors on integrated circuits (ICs) doubles approximately every 2 years. Moore’s law holds true since its introduction in 1970s. This insatiable demand for smaller ICs size, larger integration and higher Input/Output (IO) count of microelectronics has made ball grid array (BGA) the most promising connection type in electronic packaging industry. This trend, however, renders EM reliability of solders joints a major bottleneck to hinder further development of electronics industry......

Publisher: Electronic Packaging Laboratory, State University of New York

Electronic Packaging Laboratory, State University of New York

The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices.

Buffalo, New York, USA

Research Institute / Laboratory / School

Best Practices Reflow Profiling for Lead-Free SMT Assembly

Jun 05, 2013 | Ed Briggs and Ronald C. Lasky, Ph.D., PE.

The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constant miniaturization of electronic components, hence smaller solder paste deposits, may require the use of smaller particle-sized powders (...) This paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer

Crimp Quality Standards Comparison and Trends

Jun 05, 2013 | Rob Boyd, Crimping Product Manager

Quality standards are getting tougher each year. In these difficult times, wire harness manufacturers are looking to expand business in their existing markets and are looking for new markets. The following article will compare and contrast the current quality standards that are most commonly used today. It will review proper measurement techniques, discuss some trends in crimp quality, and address methods to improve efficiency in quality data collection....

Publisher: Schleuniger, Inc.

Schleuniger, Inc.

Schleuniger, Inc. is a leading manufacturer of wire processing equipment. Our innovative automatic and semi-automatic machines are designed to cut, strip, crimp and mark all types of wire and cable.

Manchester, New Hampshire, USA

Other

Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence

May 30, 2013 | Michael Haller, Volker Rößiger, Simone Dill

This paper covers the following topics: The Measurement Application, Measurement Requirements, Measurement Problems, Measurement Results, Reference Samples, Conclusions ...

Publisher: Fischer Technology, Inc.

Fischer Technology, Inc.

As trends towards the miniaturization and increased functional integration of electronics, the demands on quality assurance are rising. FISCHER has many coating thickness measurement solutions for the electronics sector.

Windsor, Connecticut, USA

Manufacturer

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