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1802 SMT / PCB Assembly Related Technical Articles

Scalable Platform Services on the Intel TFLOPS Supercomputer

May 07, 1999 | Bradley Mitchell; Server Software Technology

This paper describes Scalable Platform Services (SPS)- a collection of software providing the manageability solution for Intel's latest parallel processing supercomputer. ...

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

Achieving Large Scale Parallelism Through Operating System Resource Management on the Intel TFLOPS Supercomputer

May 07, 1999 | Sharad Garg, Robert Godley, Richard Griffiths, Andrew Pfiffer, Terry Prickett, David Robboy, Stan Smith, T. Mack Stallcup, Stephan Zeisset.

From the point of view of an operating system, a computer is managed and optimized in terms of the application programming model and the management of system resources. For the TFLOPS system, the problem is to manage and optimize large scale parallelism. This paper looks at the management in terms of three key topics: memory management, communication, and input/output....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

The Performance of the Intel TFLOPS Supercomputer

May 07, 1999 | Greg Henry, Pat Fay, Ben Cole, Timothy G. Mattson.

The purpose of building a supercomputer is to provide superior performance on real applications. In this paper, we describe the performance of the Intel TFLOPS Supercomputer starting at the lowest level with a detailed investigation of the Pentium® Pro processor and the supporting memory subsystem....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

An Overview of the Intel TFLOPS Supercomputer

May 07, 1999 | Timothy G. Mattson, Greg Henry

In this paper, we give an overview of the ASCI Option Red Supercomputer. The motivation for building this supercomputer is presented and the hardware and software views of the machine are described in detail. We also briefly discuss what it is like.....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

Computer Vision Face Tracking For Use in a Perceptual User Interface

May 07, 1999 | Gary R. Bradski; Microcomputer Research Lab

As a first step towards a perceptual user interface, a computer vision color tracking algorithm is developed and applied towards tracking human faces. Computer vision algorithms that are intended to form part of a perceptual user interface must be fast and efficient. They must be able to track in real time yet not absorb a major share of computational resources: other tasks must be able to run while the visual interface is being used. The new algorithm developed here is based on a robust nonparametric technique for climbing density gradients to find the mode (peak) of probability distributions called the mean shift algorithm....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

An Overview of Advanced Failure Analysis Techniques for Pentium® and Pentium® Pro Microprocessors

May 07, 1999 | Yeoh Eng Hong, Lim Seong Leong, Wong Yik Choong, Lock Choon Hou, Mahmud Adnan; Intel Penang Microprocessor Failure Analysis Department, Malaysia

Failure analysis (FA) is one of the key competencies in Intel. It enables very rapid achievement of world class manufacturing standards, resulting in excellent microprocessor time-to-market performance. This paper discusses the evolution of FA techniques from one generation of microprocessors to another....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

EUV Lithography -The Successor to Optical Lithography?

May 07, 1999 | John E. Bjorkholm

This paper discusses the basic concepts and current state of development of EUV lithography (EUVL), a relatively new form of lithography that uses extreme ultraviolet (EUV) radiation with a wavelength in the range of 10 to 14 nanometer (nm) to carry out projection imaging. Currently, and for the last several decades, optical projection lithography has been the lithographic technique used in the high-volume manufacture of integrated circuits. It is widely anticipated that improvements in this technology will allow it to remain the semiconductor industry's workhorse through the 100 nm generation of devices. However, some time around the year 2005, so-called Next-Generation Lithographies will be required. ...

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

MOS Scaling: Transistor Challenges for the 21st Century

May 07, 1999 | Scott Thompson, Paul Packan, Mark Bohr

To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

The Quality and Reliability of Intel's Quarter Micron Process

May 07, 1999 | Krishna Seshan, Timothy J. Maloney, Kenneth J. Wu

This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained. Four main reliability topics: ESD protection, electromigration, gate oxide wearout, and the modeling and management of mechanical stresses are discussed. Based on an analysis of the reliability implications of device scaling, we show how these four topics are of prime importance to component reliability......

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

Why Wide Fine Pitch Pads?

May 07, 1999 | Rick Lathrop, Heraeus SMT Technical Services

Fine pitch SMT devices, although certainly not new, present more of an assembly processing challenge than 50 mil pitch devices. In fact it seems that the finer the pitch the more difficult or narrower the process window becomes. Besides the pitch of the leads being less on fine pitch devices narrower pad width on the board is typical. With fine pitch designs the board fabrication process is also stressed in that the strip of mask between the pads is designed narrower, the alignment of the mask to copper becomes more critical...

Publisher: Heraeus

Heraeus

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer

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