Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1826 SMT / PCB Assembly Related Technical Articles

Stencil Options for Printing Solder Paste for .3 Mm CSP's and 01005 Chip Components

Jul 25, 2023 | William E. Coleman Ph.D. , Chris Anglin

Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69....

Publisher: Photo Stencil LLC

Photo Stencil LLC

Photo Stencil provides high-performance stencils, squeegee blades, thick film and metal mask screens and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries.

Colorado Springs, Colorado, USA

Manufacturer

Stencil Print solutions for Advance Packaging Applications

Jul 25, 2023 | Phani Vallabhajosyula, PhD

This paper address two significant applications of stencils in advance packaging field: 1. Ultra-Thin stencils for miniature component (0201m) assembly; 2. Deep Cavity stencils for embedded (open cavity) packaging. As the world of electronics continues to evolve with focus on smaller, lighter, faster, and feature-enhanced high- performing electronic products, so are the requirement for complex stencils to assemble such components. These stencil thicknesses start from less than 25um with apertures as small as 60um (or less). Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and the pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 15um-40um with steps of 15um are used to obtain desired print volumes. Stencils with thickness to this order can be potential tools even to print for RDLs in the package....

Publisher: Photo Stencil LLC

Photo Stencil LLC

Photo Stencil provides high-performance stencils, squeegee blades, thick film and metal mask screens and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries.

Colorado Springs, Colorado, USA

Manufacturer

KE-2050/KE-2060 Causes and Countermeasures of Patch Failure

Jul 22, 2023 | KSUNSMT

Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com...

Publisher: DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

Dongguan, China

Consultant / Service Provider, Distributor, Equipment Dealer / Broker / Auctions, Manufacturer, Manufacturer's Representative

SMT, DIP, PCBA conformal coating equipment and turnkey solution

Jul 21, 2023 | I.C.T

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution....

Publisher: I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.

Dongguan, Guangdong, China

Manufacturer

Applied Statistics and Experimental Design

Jul 16, 2023 | Fritz Scholz

Statistics originally served to describe matters of the state (status of state) by capturing numerically various aspects of full populations. Today this is called a census, from Latin censere (to count or estimate). Recall the historical census of Emperor Augustus. Nowadays the field of statistics focusses mainly on samples, i.e., part of the total. The goal is to make statements or conclusions about the whole population. This process is referred to as induction, from Latin inducere (to lead to). Its validity depends crucially on the process of sampling. Sample   example from Latin exemplum.

...

Publisher: University of Washington

University of Washington

The University of Washington is a public research university in Seattle, Washington. Founded on November 4, 1861, as Territorial University, Washington is one of the oldest universities on the West Coast; it was established in Sea

Seattle, Washington, USA

Research Institute / Laboratory / School

Design of Experiment Methods in High Speed Signal Via Transition in Printed Circuit Board

Jul 16, 2023 | Amir A. Asif,

With increase in data transfer speeds between integrated circuits, memories and connectors, the interconnects in printed circuit boards require careful design and optimization. A critical part of an interconnect is via transition. To meet the design goals and maintain signal integrity, every part of the interconnect needs to be carefully designed. Designing via involves variation of several parameters and it is extremely important to understand their contribution to find the usable parameters yielding best possible performance. Out of these numerous combinations of parameters, Design of Experiments (DOE) can offer much needed understanding, suggest possible values and speed up the design process. In this manuscript, two DOE methods (Box-Behnken Design and Central Composite Design) are used to understand the behavior of a pair of vias operating in differential mode.

...

Publisher: Clemson University

Clemson University

Clemson University is a public land-grant research university in Clemson, South Carolina. Founded in 1889, Clemson is the second-largest university by enrollment in South Carolina.

Clemson, South Carolina, USA

Research Institute / Laboratory / School

The Compensation Problem and Solution Using Design of Experiments for Dense Multilayer Printed Circuit Boards

Jul 16, 2023 | Wm. Gray McQuarrie

Imagine being able to accurately predict the correct artwork compensations prior to taking on a large quick turn order regardless of the board design, materials, or process. Such predictive power is possible and can be achieved without a lot of cost and complexity. This paper shows how small sets of designed experiments can be used to create a cImagine being able to accurately predict the correct artwork compensations prior to taking on a large quick turn order regardless of the board design, materials, or process. Such predictive power is possible and can be achieved without a lot of cost and complexity. This paper shows how small sets of designed experiments can be used to create a compensation model. Before a discussion of the design of experiments (DOEs), we will examine key processes and material variables that affect movement as demonstrated on real board design layout in a real production process. Only the few most relevant variables need to be included in the experimental design. A solution is presented that uses small experiments that provide the required information for constructing a general compensation model.mpensation model. Before a discussion of the design of experiments (DOEs), we will examine key processes and material variables that affect movement as demonstrated on real board design layout in a real production process. Only the few most relevant variables need to be included in the experimental design. A solution is presented that uses small experiments that provide the required information for constructing a general compensation model....

Publisher: Isola Group

Isola Group

Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.

Chandler, Arizona, USA

Manufacturer

Verifying the efficiency of soldering fume extraction and measuring nanoparticle exposure during soldering with an iron with the testo DiSCmini

Jul 10, 2023 | Testo

That manual soldering produces harmful substances in the form of aerosols is a known problem in the electric and electronic industry. The lead-free electronics solders used today have done little to change that. The soldering fumes still contain particles which are formed by the solder and the flux agent. These particles have a high potential of causing permanent damage to the workers’ health. Due to their small diameter between 10 and 150 nm, they can penetrate all the way into the alveoli. But numerous studies also show that nanoparticles can reach all areas of the body through the bloodstream [1].

...

Publisher: Testo SE & Co. KGaA

Testo SE & Co. KGaA

World Leader in Measurement Technology

West Chester, Pennsylvania, USA

Manufacturer

CLEANING BEFORE CONFORMAL COATING

Jul 04, 2023 | Naveen Ravindran

CONTENT * Introduction * Failure Mechanisms * Coating Failures * Cleaning Before Conformal Coating * Analytics & Test Methods...

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas, Virginia, USA

Consultant / Service Provider, Manufacturer, Training Provider

Conformal Coating Defects

Jul 04, 2023 | Diamond MT

Conformal Coatings are polymeric materials used to protect circuitry, parts, and related components. They are most commonly used to protect printed circuit boards (PCBs) and electronic devices. However, conformal coatings can be applied to a wide variety of materials, including metal, plastic, silicone, ceramics, glass, and even paper. We use the term "substrate" to refer to an object or material that's been coated with a conformal coating....

Publisher: Diamond MT

Diamond MT

Conformal Coating Service Provider; Parylene Conformal Coating

Johnstown, Pennsylvania, USA

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