Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production

Add Article »

1826 SMT / PCB Assembly Related Technical Articles

The Effects of Silver Content and Solidification Profile on the Anand Constitutive Model for SAC Lead Free Solders

Jun 14, 2023 | Munshi M. Basit, Mohammad Motalab, Jordan C. Roberts, Jeffrey C. Suhling, Pradeep Lall

In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically....

Publisher: Auburn University

Auburn University

Auburn University is a comprehensive land-grant institution with primary missions including instruction, research, and extension/outreach.

Auburn, Alabama, USA

Research Institute / Laboratory / School

Using Stencil: Design to Reduce SMT Defects

Jun 12, 2023 | Paul Lotosky, Michael Murphy, Robert Pearson, Michael Tesch

Solder paste printing is understood to be the leading contributor of defects in the electronics assembly process. Because yield accounts for such a large percentage of the margin, the greatest opportunity to improve profitability in the assembly of most electronics can be gained by reducing or eliminating solder defects. This article examines process adjustments made through stencil design that correct a misalignment situation between the PCB and stencil, leading to a 43% reduction in assembly defects. Examples of each are found in Table 1....

Publisher: AVI Precision Engineering Pte Ltd

AVI Precision Engineering Pte Ltd

Manufacturer of compatible replacement parts of SMT, Through-hole & Wave soldering machines, namely Panasert, Dynapert, Universal, Sanyo, Fuji, Juki, Philips, Camalot, Nitto, Yamaha, Tenryu, Samsung, Quad, Electrovert, Soltec, Sensbey, Iemme, Koki, Yokota, Tamura, etc.Precision machining servicesBuy, sell, service & overhaul used SMT & Through-hole machines.Machinery & accessories for Electr

Singapore, Singapore

Manufacturer

Optimizing Stencil Design For Lead-Free Smt Processing

Jun 12, 2023 | Ranjit S Pandher, Chrys Shea

As any new technology emerges, increasing levels of refinement are required to facilitate the mainstream implementation and continual improvement processes. In the case of lead-free processing, the initial hurdles of alloy and chemistry selection are cleared on the first level, providing a base process. The understanding gained from early work on the base process leads to the next level of refinement in optimizing the primary factors that influence yield. These factors may include thermal profiles, PWB surface finishes, component metallization, solder mask selection or stencil design....

Publisher: Cookson Electronics Assembly Materials

Cookson Electronics Assembly Materials

Cookson Electronics Assembly Materials

Singapore, Singapore

The Effect of Higher Stencil Tension on Printing Performance

Jun 12, 2023 | Tom Meeus, Jan Van Lieshout, Hans Korsse, Sathiya Naryana

In this article we will examine if there is a measurable difference in the printing performance when using stencils which have a higher tension than is commonly accepted in the industry. Alpha's new tensoRED™ High Tension Frame System will be introduced during this wider examination. We will examine their effect in terms of controlling variation in critical deposit volumes and what, if any effect on positional accuracy can be seen....

Publisher: Alpha Assembly Solutions

Alpha Assembly Solutions

Alpha Assembly Solutions is a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places.

South Plainfield, New Jersey, USA

Manufacturer

Stencil Printing Process Tools for Miniaturisation and High Yield Processing

Jun 12, 2023 | Clive Ashmore & Mark Whitmore

The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented....

Publisher: ASM Assembly Systems (DEK)

ASM Assembly Systems (DEK)

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Suwanee, Georgia, USA

Manufacturer

Stencil Design For Mixed Technology Through-Hole / Smt Placement And Reflow

Jun 12, 2023 | William E. Coleman, Denis Jean, Julie Bradbury

This paper will review stencil design requirements for printing solder paste around and in through-hole pads / openings. There is much interest in this procedure since full implementation allows the placement of both through-hole components as well as SMD's and the subsequent reflow of both simultaneously. This in turn eliminates the need to wave solder or hand solder through-hole components....

Publisher: Photo Stencil LLC

Photo Stencil LLC

Photo Stencil provides high-performance stencils, squeegee blades, thick film and metal mask screens and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries.

Colorado Springs, Colorado, USA

Manufacturer

Recurrent Neural Network-Based Stencil Cleaning Cycle Predictive Modeling

Jun 12, 2023 | Haifeng Wang, Tian He, and Sang Won Yoon

This paper presents a real-time predictive approach to improve solder paste stencil printing cycle decision making process in surface mount assembly lines. Stencil cleaning is a critical process that influences the quality and efficiency of printing circuit board. Stencil cleaning operation depends on various process variables, such as printing speed, printing pressure, and aperture shape. The objective of this research is to help efficiently decide stencil printing cleaning cycle by applying data-driven predictive methods. To predict the printed circuit board quality level, a recurrent neural network (RNN) is applied to obtain the printing performance for the different cleaning aging. In the prediction model, not only the previous printing performance statuses are included, but also the printing settings are used to enhance the RNN learning. The model is tested using data collected from an actual solder paste stencil printing line. Based on the predicted printing performance level, the model can help automatically identify the possible cleaning cycle in practice. The results indicate that the proposed model architecture can predictively provide accurate solder paste printing process information to decision makers and increase the quality of the stencil printing process....

Publisher: Binghamton University

Binghamton University

Binghamton as an institution is dedicated to higher education, one that combines an international reputation for graduate education, research, scholarship and creative endeavor with the best undergraduate programs available at ...

Binghamton, New York, USA

Research Institute / Laboratory / School

The Solder Paste Printing Process: Critical Parameters, Defect Scenarios, Specifications, And Cost Reduction

Jun 12, 2023 | Chien-Yi Huang, Yueh-Hsun Lin, Kuo-Ching Ying, Chen-Liang Ku

The purpose of this paper is to comprehensively explore the effects of critical parameters on solder deposition and to establish a systematic approach for determining guidelines for solder paste inspection (SPI) workstations. Design/methodology/approach – This study explored the effects of process parameters, stencil and printed circuit board designs on solder deposition and identified the major post-reflow defect scenarios. Through the investigation of correlation between the results of SPI analysis and post-reflow defective scenarios, SPI specifications are suggested for minimizing the total cost of poor quality. Findings – The higher the printing pressure the lower the solder deposition. There was a significant difference in solder deposition between the front squeegee and the rear squeegee. Insufficient distance between the stencil aperture and the initial printing location resulted in irregular solder paste and variations in solder deposition. A stencil with a higher area ratio resulted in greater solder deposition and less variation. Stencil apertures parallel to the direction of printing were superior to a 458 vector print. Further, the nominal solder thickness should take into account the thicknesses of the solder mask and the legend ink. There was an offset in the results of SPI measurements between the solder mask defined (SMD) pads and non-SMD pads. The specifications for solder deposition with irregular stencil apertures need to be adjusted. Originality/value – To address the arbitrariness of existing industry practice, this study was a joint effort with a Taiwan-based electronics manufacturing service company. Real data were taken from a mass production environment and inferences were then made based on a statistical analysis

...

Publisher: National Taipei University

National Taipei University

National Taipei University, founded in 1949, is a national university in Taiwan which specializes in law, business, humanities, and social sciences. Before 2000, the university was named the College of Law and Business, National C

New Taipei City, T'ai-wan,

Research Institute / Laboratory / School

Conquering SMT Stencil Printing Challenges with Today's Miniature Components

Jun 12, 2023 | Robert F. Dervaes, Jeff Poulos, Scott Williams

The technological advancement of component and PCB technology from through-hole to surface mount (SMT) is a major factor in the miniaturization of today's electronics. Smaller and smaller component sizes and more densely packed PCBs lead to more powerful designs in much smaller product packages. With advancement, however, comes a new set of challenges in building these smaller, more complex assemblies. This is the challenge original equipment manufacturers (OEM) and contract manufacturers (CM) face today....

Publisher: Fine Line Stencil, Inc.

Fine Line Stencil, Inc.

Fine Line Stencil is committed to delivering the highest quality stencil technology in the industry.

Colorado Springs, Colorado, USA

Manufacturer

Additive Manufacturing Technologies

Jun 02, 2023 | K. Srinivasulu Reddy & Solomon Dufera

Additive manufacturing (AM) is a latest technology that could improve manufacturing process by building up thin layers of materials from digitized three-dimensional (3D) designs virtually constructed using advanced CAD software. This technique affords the creation of new types of object with unique material properties. But while AM is widely billed as ‘the next industrial revolution’, in reality there are still significant hurdles for successful commercialisation of the technologies. This paper aims to provide a comprehensive review of literature, technologies and manufacturing practices on modern Additive Manufacturing.

...

Publisher: Adama Science and Technology University

Adama Science and Technology University

ASTU aspires to be the first choice in Ethiopia and the premier center of excellence in applied science and technology in Africa by 2030

Adama, Dominica

Research Institute / Laboratory / School

Solder Paste Dispensing
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB
Now Online
140
Visitors
4
Members

Who are SMTnet visitors?

Become a member now and receive the value and benefits of membership.

Jetting Pump for Integration
IPC Training & Certification - Blackfox

pressure curing ovens