Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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1882 SMT / PCB Assembly Related Technical Articles

SMT, DIP, PCBA conformal coating equipment and turnkey solution

Jul 21, 2023 | I.C.T

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution....

Publisher: I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.

Dongguan, Guangdong, China

Manufacturer

Applied Statistics and Experimental Design

Jul 16, 2023 | Fritz Scholz

Statistics originally served to describe matters of the state (status of state) by capturing numerically various aspects of full populations. Today this is called a census, from Latin censere (to count or estimate). Recall the historical census of Emperor Augustus. Nowadays the field of statistics focusses mainly on samples, i.e., part of the total. The goal is to make statements or conclusions about the whole population. This process is referred to as induction, from Latin inducere (to lead to). Its validity depends crucially on the process of sampling. Sample   example from Latin exemplum.

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Publisher: University of Washington

University of Washington

The University of Washington is a public research university in Seattle, Washington. Founded on November 4, 1861, as Territorial University, Washington is one of the oldest universities on the West Coast; it was established in Sea

Seattle, Washington, USA

Research Institute / Laboratory / School

Design of Experiment Methods in High Speed Signal Via Transition in Printed Circuit Board

Jul 16, 2023 | Amir A. Asif,

With increase in data transfer speeds between integrated circuits, memories and connectors, the interconnects in printed circuit boards require careful design and optimization. A critical part of an interconnect is via transition. To meet the design goals and maintain signal integrity, every part of the interconnect needs to be carefully designed. Designing via involves variation of several parameters and it is extremely important to understand their contribution to find the usable parameters yielding best possible performance. Out of these numerous combinations of parameters, Design of Experiments (DOE) can offer much needed understanding, suggest possible values and speed up the design process. In this manuscript, two DOE methods (Box-Behnken Design and Central Composite Design) are used to understand the behavior of a pair of vias operating in differential mode.

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Publisher: Clemson University

Clemson University

Clemson University is a public land-grant research university in Clemson, South Carolina. Founded in 1889, Clemson is the second-largest university by enrollment in South Carolina.

Clemson, South Carolina, USA

Research Institute / Laboratory / School

The Compensation Problem and Solution Using Design of Experiments for Dense Multilayer Printed Circuit Boards

Jul 16, 2023 | Wm. Gray McQuarrie

Imagine being able to accurately predict the correct artwork compensations prior to taking on a large quick turn order regardless of the board design, materials, or process. Such predictive power is possible and can be achieved without a lot of cost and complexity. This paper shows how small sets of designed experiments can be used to create a cImagine being able to accurately predict the correct artwork compensations prior to taking on a large quick turn order regardless of the board design, materials, or process. Such predictive power is possible and can be achieved without a lot of cost and complexity. This paper shows how small sets of designed experiments can be used to create a compensation model. Before a discussion of the design of experiments (DOEs), we will examine key processes and material variables that affect movement as demonstrated on real board design layout in a real production process. Only the few most relevant variables need to be included in the experimental design. A solution is presented that uses small experiments that provide the required information for constructing a general compensation model.mpensation model. Before a discussion of the design of experiments (DOEs), we will examine key processes and material variables that affect movement as demonstrated on real board design layout in a real production process. Only the few most relevant variables need to be included in the experimental design. A solution is presented that uses small experiments that provide the required information for constructing a general compensation model....

Publisher: Isola Group

Isola Group

Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.

Chandler, Arizona, USA

Manufacturer

Verifying the efficiency of soldering fume extraction and measuring nanoparticle exposure during soldering with an iron with the testo DiSCmini

Jul 10, 2023 | Testo

That manual soldering produces harmful substances in the form of aerosols is a known problem in the electric and electronic industry. The lead-free electronics solders used today have done little to change that. The soldering fumes still contain particles which are formed by the solder and the flux agent. These particles have a high potential of causing permanent damage to the workers’ health. Due to their small diameter between 10 and 150 nm, they can penetrate all the way into the alveoli. But numerous studies also show that nanoparticles can reach all areas of the body through the bloodstream [1].

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Publisher: Testo SE & Co. KGaA

Testo SE & Co. KGaA

World Leader in Measurement Technology

West Chester, Pennsylvania, USA

Manufacturer

CLEANING BEFORE CONFORMAL COATING

Jul 04, 2023 | Naveen Ravindran

CONTENT * Introduction * Failure Mechanisms * Coating Failures * Cleaning Before Conformal Coating * Analytics & Test Methods...

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas, Virginia, USA

Consultant / Service Provider, Manufacturer, Training Provider

Conformal Coating Defects

Jul 04, 2023 | Diamond MT

Conformal Coatings are polymeric materials used to protect circuitry, parts, and related components. They are most commonly used to protect printed circuit boards (PCBs) and electronic devices. However, conformal coatings can be applied to a wide variety of materials, including metal, plastic, silicone, ceramics, glass, and even paper. We use the term "substrate" to refer to an object or material that's been coated with a conformal coating....

Publisher: Diamond MT

Diamond MT

Conformal Coating Service Provider; Parylene Conformal Coating

Johnstown, Pennsylvania, USA

Other

The Effects of Silver Content and Solidification Profile on the Anand Constitutive Model for SAC Lead Free Solders

Jun 14, 2023 | Munshi M. Basit, Mohammad Motalab, Jordan C. Roberts, Jeffrey C. Suhling, Pradeep Lall

In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically....

Publisher: Auburn University

Auburn University

Auburn University is a comprehensive land-grant institution with primary missions including instruction, research, and extension/outreach.

Auburn, Alabama, USA

Research Institute / Laboratory / School

Using Stencil: Design to Reduce SMT Defects

Jun 12, 2023 | Paul Lotosky, Michael Murphy, Robert Pearson, Michael Tesch

Solder paste printing is understood to be the leading contributor of defects in the electronics assembly process. Because yield accounts for such a large percentage of the margin, the greatest opportunity to improve profitability in the assembly of most electronics can be gained by reducing or eliminating solder defects. This article examines process adjustments made through stencil design that correct a misalignment situation between the PCB and stencil, leading to a 43% reduction in assembly defects. Examples of each are found in Table 1....

Publisher: AVI Precision Engineering Pte Ltd

AVI Precision Engineering Pte Ltd

Manufacturer of compatible replacement parts of SMT, Through-hole & Wave soldering machines, namely Panasert, Dynapert, Universal, Sanyo, Fuji, Juki, Philips, Camalot, Nitto, Yamaha, Tenryu, Samsung, Quad, Electrovert, Soltec, Sensbey, Iemme, Koki, Yokota, Tamura, etc.Precision machining servicesBuy, sell, service & overhaul used SMT & Through-hole machines.Machinery & accessories for Electr

Singapore, Singapore

Manufacturer

Optimizing Stencil Design For Lead-Free Smt Processing

Jun 12, 2023 | Ranjit S Pandher, Chrys Shea

As any new technology emerges, increasing levels of refinement are required to facilitate the mainstream implementation and continual improvement processes. In the case of lead-free processing, the initial hurdles of alloy and chemistry selection are cleared on the first level, providing a base process. The understanding gained from early work on the base process leads to the next level of refinement in optimizing the primary factors that influence yield. These factors may include thermal profiles, PWB surface finishes, component metallization, solder mask selection or stencil design....

Publisher: Cookson Electronics Assembly Materials

Cookson Electronics Assembly Materials

Cookson Electronics Assembly Materials

Singapore, Singapore

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