Electronics Manufacturing Technical Articles

Several ceramic materials are commonly used for the ceramic PCB

May 10, 2023 | 斯利通

Several ceramic materials are commonly used for the ceramic PCB...

Publisher: Folysky Technology(Wuhan)Co.,Ltd

Several ceramic materials are commonly used for the ceramic PCB

May 10, 2023 | 斯利通

Several ceramic materials are commonly used for the ceramic PCB...

Publisher: Folysky Technology(Wuhan)Co.,Ltd

Zirconia ceramic PCB, for applications in the field of microwave communication

May 10, 2023 | 斯利通

Zirconia ceramic PCB, for applications in the field of microwave communication...

Publisher: Folysky Technology(Wuhan)Co.,Ltd

The role that sapphire ceramic PCB play in MEMSdevices

May 10, 2023 | 斯利通

DPC (DirectPlatingCopper) thin film process is a method of prepare copper film using magnetron sputtering technology. This process is a process in which the copper target with the target material is placed in a true cavity chamber, and plasma is generated on the copper target surface by magnetron sputtering technology. The ions in the plasma are bombarded on the surface of the target, which is sputtered into fine particles and deposited on the substrate to form a copper film....

Publisher: Folysky Technology(Wuhan)Co.,Ltd

Electronic Assembly Misprint Cleaning Advancements

May 07, 2023 | Mike Bixenman, Dirk Ellis, Jody Saultz, Eric Becker, Greg Calvo & Jim Morris

Misprint Circuit Assemblies ■ Cleaning misprints is a production gap ■ Commonly cleaned in stencil cleaning equipment ■ Stencil Cleaning equipment allows for the collection and filtration of wet solder paste ■ Stencil Cleaning equipment short comings + Inability to clean B-Side misprints + Poor rinse quality...

Publisher: ITW EAE

First Post - Tell me about your company!

May 05, 2023 | RW

ETC is an OEM manufacturer out of the US.  Our SMT department is high mix, low volume.  We utilize Mycronic mahcines and have production five lines currently; some single machines, others in sequence.  Our maturity with this manufacturing process is about 20 years.  Our products are populated with my100's, 200's, and 300's.

• ~1 million PCAs
  • ~100 million components
    • 700+ unique materials
      • 2,500+ unique smt components

Publisher: ETC, INC.

IMPACT OF 0201 COMPONENTS ON CURRENT MANUFACTURING SYSTEMS

May 02, 2023 | Andrew Butterfield, Mark Guilford, Kevin Pieper

The use of 0201 components in consumer products offers a major competitive advantage over other products since they allow significant design miniaturization. This leads to either smaller products or allows more features integrated into the same package size. One of the critical aspects of having the capability of placing 0201 components in any product is the ability of the manufacturing equipment to handle such small components. Many process studies have been completed by manufacturers and equipment suppliers and have shown that tight process windows are required. The current process control for 0402 components is CpK > 1.5 with a 150μm specification window. For 0201 components, the minimum requirement is CpK > 2.0 with a 100μm specification window. The spec window may need to be reduced down to 75μm if the controls for high volume manufacturing are insufficient. Also directly impacting the placement quality is the ability to apply sufficient solder consistently to the board. The goal is to maintain current printing practices, but the effect of powder size will be examined. This paper will evaluate the impact of placement accuracy and solder powder size on 0201 manufacturing quality....

Publisher: Motorola Mobility LLC.

Board Design and Assembly Process Evaluation for 0201 Components on PCBs

May 02, 2023 | Mei Wang, Dr. Dongkai Shangguan, David Geiger, Kazu Nakajima, CC. Ho, and Sammy Yi

As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined....

Publisher: Flextronics International

PCB Design Optimization of 0201 Packages for Assembly Processes

May 02, 2023 | Mei Wang, Dr. Dongkai Shangguan, David Geiger, Fredrik Mattsson and Sammy Yi

The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified....

Publisher: Flextronics International

RULES FOR WORKING WITH 0201s AND OTHER SMALL PARTS

May 02, 2023 | Advanced Assembly, LLC

Surface-mount PCB components are smaller than their lead-based counterparts and provide a radically higher component density. They are available in a variety of shapes and sizes designated by a series of standardized codes curated by the electronics industry. Of these PCB components, the 0201-sized are the smallest, measuring 0.024 x 0.012 in. (0.6 x 0.3 mm) – that's 70% smaller than the previous 0402 level! The 0201 components are designed to improve reliability in space-constrained applications such as portable electronics like smartphones, tablets, robotics and digital cameras, but require delicate handling during the assembly process....

Publisher: Advanced Assembly, LLC.