Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

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1882 SMT / PCB Assembly Related Technical Articles

ElectronicWaste, an Environmental Problem Exported to Developing Countries: The GOOD, the BAD and the UGLY

Sep 21, 2022 | Samuel Abalansa, Badr El Mahrad, John Icely and Alice Newton

Electronic waste (e-waste) is a rapidly developing environmental problem particularly for the most developed countries. There are technological solutions for processing it, but these are costly, and the cheaper option for most developed countries has been to export most of the waste to less developed countries. There are various laws and policies for regulating the processing of e-waste at different governance scales such as the international Basel Convention, the regional Bamoko Convention, and various national laws. However, many of the regulations are not fully implemented and there is substantial financial pressure to maintain the jobs created for processing e-waste. Mexico, Brazil, Ghana Nigeria, India, and China have been selected for a more detailed study of the transboundary movements of e-waste. This includes a systematic review of existing literature, the application of the Driver, Pressure, State, Impact, Response (DPSIR) framework for analysing complex problems associated with social ecological systems, and the application of the Life Cycle Assessment (LCA) for evaluating the environmental impact of electronic devices from their manufacture through to their final disposal. Japan, Italy, Switzerland, and Norway have been selected for the LCA to show how e-waste is diverted to developing countries, as there is not sufficient data available for the assessment from the selected developing countries. GOOD, BAD and UGLY outcomes have been identified from this study: the GOOD is the creation of jobs and the use of e-waste as a source of raw materials; the BAD is the exacerbation of the already poor environmental conditions in developing countries; the UGLY is the negative impact on the health of workers processing e-waste due to a wide range of toxic components in this waste. There are a number of management options that are available to reduce the impact of the BAD and the UGLY, such as adopting the concept of a circular economy, urban mining, reducing loopholes and improving existing policies and regulations, as well as reducing the disparity in income between the top and bottom of the management hierarchy for e-waste disposal. The overarching message is a request for developed countries to help developing countries in the fight against e-waste, rather than exporting their environmental problems to these poorer regions....

Publisher: Murray Foundation

Murray Foundation

The Murray Foundation's purpose is, for the public benefit, to advance education, to encourage and support dissemination of research and technical information in the area of environmental processes.

Liverpool, Lancashire, Ethiopia

Research Institute / Laboratory / School

Handling of Highly-Moisture Sensitive Components - An Analysis of Low-Humidity Containment and Baking Schedules

Sep 12, 2022 | R. L. Shook and J. P. Goodelle

Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device....

Publisher: Alcatel-Lucent

Alcatel-Lucent

Often referred to as "The Idea Factory" or "The Crown Jewel," Nokia Bell Labs has an unparalleled history of innovation output. Researchers at Nokia Bell Labs have been behind or involved in nearly every critical technological mil

New Providence, New Jersey, USA

Research Institute / Laboratory / School

Innovative process for sealing contours protects sensitive components

Sep 08, 2022 | Scheugenpflug

Liquid seals in the automotive industry have to meet high functional quality standards and have to be applied in the shortest possible time in view of the high volume of workpieces. This market environment gives rise to innovations that guarantee maximum speed and quality from initial design to final results....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Producer of bonding, dispensing and potting solutions with outstanding expertise in automation. As part of the Atlas Copco Group, we have a worldwide sales & service network and access to the Group's extensive technology portfolio

Kennesaw, Georgia, USA

Manufacturer

Stencil Cleaning Handbook

Aug 17, 2022 | Mike Konrad

Back in the "good old days," stencil cleaning was effortless and effective. CFC-based solvents were sprayed or wiped onto a stencil with apertures hundreds of times larger than modern-day components. The stencil cleaning process was not considered a value-added procedure; instead it was the cleaning of a production tool. How times have changed. The late-1980s ushered in the end of most of the popular solvents, and the machines that consumed them. Assemblers turned to alternative cleaning agents, including IPAs and other solvents....

Publisher: Aqueous Technologies Corporation

Aqueous Technologies Corporation

Manufacturer of automated defluxing/cleaning equipment, cleanliness testing equipment, and stencil cleaning equipment.

Corona, California, USA

Manufacturer

Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Aug 08, 2022 | Reid Henry

Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing....

Publisher: Hentec Industries, Inc. (RPS Automation)

Hentec Industries, Inc. (RPS Automation)

Hentec Industries, Inc. designs and manufacturers high quality precision machines for use in selective soldering, lead tinning, and solderability testing applications.

Newman Lake, Washington, USA

Consultant / Service Provider, Manufacturer

Resource-efficient adhesion and potting technologies in electronics manufacturing

Aug 02, 2022 | Scheugenpflug

Saving resources in electronics manufacturing is not an end in itself. It is closely linked with reducing costs and gaining a competitive advantage. However, innovative adhesion and potting technologies in combination with highly functional adhesives and potting media make a significant contribution to the ideal union between economic performance and a reduced ecological footprint....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Producer of bonding, dispensing and potting solutions with outstanding expertise in automation. As part of the Atlas Copco Group, we have a worldwide sales & service network and access to the Group's extensive technology portfolio

Kennesaw, Georgia, USA

Manufacturer

Fairstock hk limited: Authenticity Tests Electronic Components pdf

Jul 22, 2022 | Fairstock hk limited

Authenticity Tests Electronic Components...

Publisher: Fairstock hk limited

Fairstock hk limited

Fairstock hk limited is a leading certified stocking distributor and outsource procurement services provider specializing in the supply and material management of commercial level electronic components for OEMs.

Hong Kong, Greece

Distributor, Manufacturer

How to choose printing squeegees and Pressure details affect printing solder paste result

Jul 11, 2022 | Fiona Zhang

The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil....

Publisher: Shenzhen FS equipment CO.,LTD

Shenzhen FS equipment CO.,LTD

FS Equip Co.,Ltd is a trading company for SMT industrial in China,Own HK subsidiary,with more than 16 years experience and a professional team.FS mainly supply placement SMT&TH machines(axial-radial) and spare parts consumables.

Shenzhen, China

Manufacturer

INTELLI-Pro -- The Future of Automated Optical Inspection

Jun 27, 2022 | Mirtec Corporation

In today's Electronics Manufacturing Industry, standards for defect and quality control are stricter than ever due to advancements of electronic products and increasing safety and environmental regulations. Electronics Manufacturers are forced to maximize their production efficiency by implementing lean manufacturing initiatives and optimizing production processes. With this in mind, manufacturers are relying upon Automated Optical Inspection (AOI) equipment to streamline the manufacturing process and provide real time root cause analysis of manufacturing defects. The objective is to increase profitability by improving production yields and reducing costly rework....

Publisher: MIRTEC Corp

MIRTEC Corp

MIRTEC has earned a solid reputation as one of the most Progressive and Dynamic Suppliers of Automated SMT Inspection Equipment to the Electronics Manufacturing Industry.

Oxford, Connecticut, USA

Manufacturer

A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry

Jun 27, 2022 | Abd Al Rahman M. Abu Ebayyeh, Alireza Mousavi,

Electronics industry is one of the fastest evolving, innovative, and most competitive industries. In order to meet the high consumption demands on electronics components, quality standards of the products must be well-maintained. Automatic optical inspection (AOI) is one of the non-destructive techniques used in quality inspection of various products. This technique is considered robust and can replace human inspectors who are subjected to dull and fatigue in performing inspection tasks. A fully automated optical inspection system consists of hardware and software setups. Hardware setup include image sensor and illumination settings and is responsible to acquire the digital image, while the software part implements an inspection algorithm to extract the features of the acquired images and classify them into defected and non-defected based on the user requirements. A sorting mechanism can be used to separate the defective products from the good ones. This article provides a comprehensive review of the various AOI systems used in electronics, micro-electronics, and opto-electronics industries. In this review the defects of the commonly inspected electronic components, such as semiconductor wafers, flat panel displays, printed circuit boards and light emitting diodes, are first explained. Hardware setups used in acquiring images are then discussed in terms of the camera and lighting source selection and configuration. The inspection algorithms used for detecting the defects in the electronic components are discussed in terms of the preprocessing, feature extraction and classification tools used for this purpose. Recent articles that used deep learning algorithms are also reviewed. The article concludes by highlighting the current trends and possible future research directions....

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

Institute of Electrical and Electronics Engineers (IEEE)

IEEE is the world's largest professional association dedicated to advancing technological innovation and excellence for the benefit of humanity.

Piscataway, New Jersey, USA

Association / Non-Profit

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