Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1882 SMT / PCB Assembly Related Technical Articles

How to Resolve Smart Meter Reliability Issues with Parylene Conformal Coating

Apr 19, 2022 | Mallory McGuinness

Smart water meters provide promising capabilities, but lifetime cost factors can be a hurdle for their implementation. A single service call from a technician can exceed the total price of the smart water meter, making reliability over the entire product lifetime one of the highest design priorities. Parylene conformal coating is an ideal solution to reliability concerns, including corrosion. It also addresses issues such as sustainability and miniaturization, providing truly conformal protection that withstands the lifecycle of smart water meters....

Publisher: HZO, Inc.

HZO, Inc.

HZO provides high-reliability Parylene conformal coatings with scalable, cost-efficient, proprietary processes. Meet specifications with RoHS, REACH, and Prop 65-compliant coatings at 50% thinness of other conformal coating types.

Morrisville, North Carolina, USA

Consultant / Service Provider

iNEMI Webinar 07.07.2021 - PCB Cleaning

Apr 11, 2022 | Stefan Strixner

Agenda  Why Cleaning of electronic assemblies? - Standards - Reliability - Subsequent processes  Cleaning processes - Cleaning chemicals - Cleaning machines  Cleaning process monitoring - Bath monitoring - Result monitoring  Process cost...

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas, Virginia, USA

Consultant / Service Provider, Manufacturer, Training Provider

The Effect Of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Apr 06, 2022 | Richard Coyle, Dave Hillman, Michael Barnes, David Heller, Charmaine Johnson, Richard Popowich, Richard Parker, Keith Howell, Joerg Trodler, Adam Murling

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

...

Publisher: Nokia Bell Labs

Nokia Bell Labs

inspired by the past, energized by the future For nearly 100 years, we've been inventing the future of technology, from the early days of the Bell Telephone System to the latest 5G standards. We constantly improve, innovate and ..

Murray Hill, New Jersey, USA

Research Institute / Laboratory / School

Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence

Mar 21, 2022 | Michael Haller, Volker Robiger, Simone Dill

The purpose of this paper is to compare the performance of X-ray fluorescence (XRF) instruments with different detector systems (proportional counter, positive intrinsic negative and Si drift detectors) for measuring thin Au and Pd coatings on printed circuit boards and to investigate different ways of background treatment. It also aims to provide and certify suitable reference materials which are similar to samples used in production. Design/methodology/approach - XRF measurements were performed with different instruments and detector types. The quantification of the reference materials is based on XRF, gravimetric analysis and Rutherford backscattering (RBS). 

...

Publisher: Fischer Technology

Fischer Technology

Today, measurement and analysis instruments from FISCHER are used around the world in diverse sectors - wherever precision, reliability and easy operation are required. We find out how we can provide our customers with the best...

Windsor, Connecticut, USA

Research Institute / Laboratory / School

Analysis of Circuit Boards and Electrical Connectors for RoHS/WEEE Regulated Elements Using XRF

Mar 21, 2022 | John E. Martin, Lea L. Anderson‐Smith, Gloria Adjei‐Bekoe

Manufacturers and suppliers of electronic and electrical products to member states within the EU must comply with RoHS (Restriction of Hazardous Substances) and WEEE (Waste from Electrical and Electronic Equipment) regulations. Six materials are restricted under these directives: lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr VI), polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE). Maximum allowable concentrations of these materials are 1000ppm, with the exception of cadmium, which is restricted to a maximum of 100ppm....

Publisher: SPEX SamplePrep

SPEX SamplePrep

For over 65 years SPEX® SamplePrep has been the leading sample preparation solutions provider to analytical scientists worldwide. Our range of high performance and easy to use mill, grinders, homogenizers, presses and fusion flux

Metuchen, New Jersey, USA

Research Institute / Laboratory / School

Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X-ray Fluorescence Spectroscopy and Prompt Gamma Activation Analysis

Mar 21, 2022 | Akira Otsuki, Pedro Pereira Gonçalves, Christian Stieghorst and Zsolt Révay

This work aimed to characterize the deportment/concentration and liberation/association of the metals and light elements within mechanically processed waste printed circuit boards (PCBs) that hold the complex and heterogeneous structure and distribution of different material components. Waste PCBs passed through a series of mechanical processing (i.e., comminution and sieving) for metal recovery and were then characterized without further destroying the particles in order to capture their heterogeneity. The characterizations were performed in a laboratory and large-scale neutron facility.

...

Publisher: Ecole Nationale Supérieure de Géologie

Ecole Nationale Supérieure de Géologie

The National School of Geology is the French Grande Ecole of reference in geosciences. Public school under the Ministry of Higher Education, Research and Innovation, it trains in 3 years engineers-geologists, experts in ...

Vandoeuvre-lès-Nancy, Eritrea

Research Institute / Laboratory / School

Smart Determination of Gold Content in PCBs ofWaste Mobile Phones by Coupling of XRF and AAS Techniques

Mar 21, 2022 | Nicolò Maria Ippolito, Gianmaria Belardi, Valentina Innocenzi, Franco Medici , Loris Pietrelli and Luigi Piga

Quantitative determination of most economic valuable metals in waste is the first fundamental operation of evaluating the feasibility of recycling processes. Field-portable X-ray fluorescence spectrometers (FPXRFs) represent a more practical, efficient, and economic tool in determining the elemental composition of samples with respect to conventional analytical techniques, such as atomic absorption spectrometry (AAS) and inductively coupled plasma emission spectrometry (ICP). In this paper, quick and smart determination of gold content in printed circuit boards (PCBs) of waste mobile phones was studied. The aim of the research was to combine the practicality of FPXRFs with the reliability of quantitative spectrometry analysis and evaluate the error between the two techniques....

Publisher: University of L'Aquila

University of L'Aquila

The University of L'Aquila is a public research university located in L'Aquila, central Italy. It was founded in 1964 and is organized in nine departments. The university presents a scientific-technological character ...

L'Aquila, Hong Kong

Research Institute / Laboratory / School

XRF Technology In The Field - XRF Technology For Non-Scientists

Mar 21, 2022 | Thermo Fisher Scientific

X-ray fluorescence (XRF): a non-destructive analytical technique used to determine the chemical composition of materials XRF occurs when a fluorescent (or secondary) X-ray is emitted from a sample that is being excited by a primary X-ray source. Because this fluorescence is unique to the elemental composition of the sample, XRF is an excellent technology for qualitative and quantitative analysis of the material composition. XRF spectrometry has a broad range of applications in industry, which we will discuss later in this ebook....

Publisher: Thermo Fisher Scientific

Thermo Fisher Scientific

Thermo Fisher Scientific is an American provisioner of scientific instrumentation, reagents and consumables, and software and services to healthcare, life science, and other laboratories in academia, government, and industry.

Sunnyvale, California, USA

Other

Understanding Creep Corrosion Field Fails

Mar 16, 2022 | Phil Isaacs, Jing Zhang & Terry Munson

Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction...

Publisher: Foresite Inc.

Foresite Inc.

Foresite is a process consulting house and analytial laboratory dedicated to solving product reliability challenges for electronics manufacturers.

Kokomo, Indiana, USA

Consultant / Service Provider, Manufacturer

Creep Corrosion Of Electronic Assemblies In Harsh Environments

Mar 16, 2022 | Petri Savolainen and Randy Schueller

Creep corrosion occurs in electronics assemblies and it is reminiscent to electromigration but does not require electrical field to drive the reaction. Corrosive elements and moisture must be present for creep corrosion to occur. Sulfur is the most prominent element to cause creep corrosion in environments such as paper mills, rubber manufacturing, mining, cement manufacturing, waste water treatment etc., also including companies and locations nearby such industries. The main part of printed circuit board assembly (PCBA) to be affected is the PCB surface finish. Especially immersion silver is prone to creep corrosion, but it sometimes occurs in NiPd (lead frames), and to a lesser extent in ENIG and OSP surface finishes. As the use of immersion silver is increasing as PCB surface finish and electronics are more and more used in harsh environments, creep corrosion is a growing risk. In this paper we will present the driving forces and mechanisms as well as suitable tests and mitigation strategies against creep corrosion...

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions (acquired by ANSYS Inc)

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting

College Park,

Consultant / Service Provider

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