Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1798 SMT / PCB Assembly Related Technical Articles

Coatings and Pottings: A Critical Update

Aug 11, 2021 | Greg Caswell

Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations....

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions (acquired by ANSYS Inc)

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting

College Park,

Consultant / Service Provider

Design, Development & Analysis of Vacuum Chamber of Potting Machine

Aug 11, 2021 | Mahesh S. Ghule, Dr.(Mrs.)R.S.Bindu

This paper shows the Design and Finite Element analysis of vacuum chamber of potting machine designed for electronic ignition coil applications. There are two types of potting methods 1) With Vacuum 2) Without Vacuum....

Publisher: D Y Patil College Of Engineering Akurdi, Pune

D Y Patil College Of Engineering Akurdi, Pune

The oldest campus of Dr. D. Y. Patil group of Institutions. This campus is started in year 1983 and further nurtured by our visionary Chairman Hon'ble Dr. P. D. Patil with the vision "Empowerment through knowledge" "Better ...

Akurdi, Pune, India

Research Institute / Laboratory / School

Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

Aug 11, 2021 | Lei Sun and Wenjun Yi

In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed....

Publisher: Nanjing University

Nanjing University

Located in the ancient capital of Nanjing, Nanjing University and its predecessors have taken responsibility for the country and the nation during its development of over 100 years. Committed to the prosperity of the nation ...

Nanjing, Jiangsu, China

Research Institute / Laboratory / School

Potting And Encapsulating – Avoiding Voids

Aug 11, 2021 | Paul Whitehead

Formulators of multi-component adhesives, potting and encapsulation materials are careful not to supply products with entrapped air. They do this by manufacturing under vacuum or degassing them before supplying to the end user. Consequently, entrapped air in a mixed material is usually a processing issue....

Publisher: Intertronics

Intertronics

INTERTRONICS supplies adhesives, coatings, sealants and equipment to customers with high technology, high performance assembly applications. Our customers are manufacturers in industries such as electronics, medical devices, plast

Oxfordshire, United Kingdom

Manufacturer

An Intelligent Approach For Improving Printed Circuit Board Assembly Process Performance In Smart Manufacturing

Aug 04, 2021 | Vincent WC Fung and Kam Chuen Yung

The process of printed circuit board assembly (PCBA) involves several machines, such as a stencil printer, placement machine and reflow oven, to solder and assemble electronic components onto printed circuit boards (PCBs). In the production flow, some failure prevention mechanisms are deployed to ensure the designated quality of PCBA, including solder paste inspection (SPI), automated optical inspection (AOI) and in-circuit testing (ICT). However, such methods to locate the failures are reactive in nature, which may create waste and require additional effort to be spent re-manufacturing and inspecting the PCBs. Worse still, the process performance of the assembly process cannot be guaranteed at a high level. Therefore, there is a need to improve the performance of the PCBA process. To address the aforementioned challenges in the PCBA process, an intelligent assembly process improvement system (IAPIS) is proposed, which integrates the k-means clustering method and multi-response Taguchi method to formulate a pro-active approach to investigate and manage the process performance....

Publisher: Hong Kong Polytechnic University [The]

Hong Kong Polytechnic University [The]

With 80 years of proud tradition, PolyU is a world-class research university, ranking among the world's top 100 institutions. Hong Kong Polytechnic University (PolyU) is a home for educating thinkers, communicators, and discovers.

Hung Hom, Kowloon, Hong Kong

Research Institute / Laboratory / School

What Does Industry 4.0 Actually Deliver Today? Example Reflow.

Aug 04, 2021 | Vitor Barros

Industry 4.0 is one of the most exciting developments in the manufacturing industry in decades. It promises vast improvements for both manufacturers and their customers. For some companies, however, it can be overwhelming, and it can be difficult with the current available information to understand exactly what the benefits will be in the average factory, and to calculate the return on the investment. Therefore, it may be helpful to bring the discussion down to a tangible level and to isolate one little part of the whole smart electronic assembly factory, namely reflow....

Publisher: KIC Thermal

KIC Thermal

KIC's provides products and services designed to improve a variety of thermal monitoring, profiling and process control applications.

San Diego, California, USA

Consultant / Service Provider

Industry 4.0 For Inspection In The Electronics Industry

Aug 04, 2021 | Ragnar Vaga

The digital transformation with concepts like Industry 4.0, Smart Factory and the Internet of Things will change production, work processes and business models in electronics manufacturing radically and forever. It is all about connecting, gathering and exchanging big data. It is all about connectivity, and the gathering and exchange of big data....

Publisher: YXLON International

YXLON International

YXLON is the leading supplier of Industrial X-ray Inspection systems and Industrial Computed Tomography (CT) solutions for the non-destructive testing of materials. Markets served include Aerospace, Automotive, Electronics, etc.

Hudson, Ohio, USA

Consultant / Service Provider, Manufacturer

A Conceptual Framework Of Smart Manufacturing For PCB Industries

Aug 04, 2021 | M. Jabir1, G.Zailin, R.Mudassar, Y.Lei, H.Cong and W.Hao

In this paper, the existing status of PCB manufacturing environment and future development towards smart manufacturing system (SMS) are discussed. A cloud manufacturing system (CMS) paradigm is introduced in the existing PCB manufacturing environment to get easy access to resources, materials, manufacturing processes, planning problems and data sharing networks. The goal is to integrate the information sharing from planning problems, PCB assembly lines, retailer and shipment department to CMS for smart planning decisions to cope with the increasing demand and profit enhancement strategies. A conceptual framework is presented to introduce the smart manufacturing environment in the traditional PCB manufacturing system. The suggested framework of SMS helps to improve the performance of PCB manufacturing industries regarding smart planning and scheduling, intelligent monitoring of smart assembly lines for efficiency and production enhancement....

Publisher: Huazhong University of Science and Technology

Huazhong University of Science and Technology

Huazhong University of Science and Technology is a public research university located in Guanshan Subdistrict, Hongshan District, Wuhan, Hubei province, China. As a national key university directly affiliated to the Ministry of ..

Wuhan, Hubei, China

Research Institute / Laboratory / School

Maximal Performance Through Vacuum Potting

Jul 28, 2021 | Scheugenpflug

The performance of electronic components is compromised by factors such as bubbles in the potting medium. Increasing numbers of applications – particularly in the automotive and electronics industries – therefore require completely bubble-free dispensing methods. This is where potting in a vacuum comes into focus. The widespread school of thought about this technology is that it is too complicated, too expensive and too slow. But a closer look shows that this view is incorrect. This is a mastered technology. As for costs, the calculation basis is key, since usually the potting and vacuum method is only considered after the required potting quality cannot be achieved reliably any other way. Under total cost of ownership assessments, higher system costs no longer play a key role, since component failure would result in much higher subsequent costs. And now there are proven solutions for high production volumes and/or shorter cycle times. This whitepaper explains when potting in a vacuum is ideal for your projects and what to be aware of....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Producer of bonding, dispensing and potting solutions with outstanding expertise in automation. As part of the Atlas Copco Group, we have a worldwide sales & service network and access to the Group's extensive technology portfolio

Kennesaw, Georgia, USA

Manufacturer

Conductive Anodic Filament Growth Failure

Jul 27, 2021 | Tarun Amla

With increasing focus on reliability and miniaturized designs, Conductive Anodic Filament (CAF) as failure mechanism is gaining a lot of attention. Smaller geometries make the printed circuit board (PCB) susceptible to conductive anodic filament growth. Isola has carried out work to characterize the CAF susceptibility of various resin systems under different process and design conditions. Tests were carried out to determine the effect of various factors such as resin systems, glass finishes, voltage bias and hole and line spacings on the CAF resistance. This work was intended to provide information to the user on the suitability of various grades for specific end use applications. The focus of the work at Isola is to find the right combination of process and design conditions for improved CAF resistant products....

Publisher: Isola Group

Isola Group

Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.

Chandler, Arizona, USA

Manufacturer

Jade Series Selective Soldering Machines
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