Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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1882 SMT / PCB Assembly Related Technical Articles

Test Plan for Automotive Electronic Circuit Board

Aug 23, 2021 | pti

After the equipment was introduced, the production capacity was increased by 20%, and the number of operators was reduced by 50%. Employees' salary expenses have been reduced by RMB 120,000 per year, and the pass-through rate has increased by 10% ....

Publisher: Shenzhen PTI Technology CO.,LTD

Shenzhen PTI Technology CO.,LTD

Our company was established in 2004, Main products: ICT on-line tester, ICT, functional testing machine 、FCT、 TSI、 automatic test and control system (ATE), test automation solutions, etc.

深圳, China

Manufacturer

Flexible Hybrid Electronics: Direct Interfacing of Soft and Hard Electronics for Wearable Health Monitoring

Aug 18, 2021 | Yasser Khan, Mohit Garg, Qiong Gui, Mark Schadt, Abhinav Gaikwad, Donggeon Han, Natasha A. D. Yamamoto, Paul Hart, Robert Welte, William Wilson, Steve Czarnecki, Mark Poliks, Zhanpeng Jin, Kanad Ghose, Frank Egitto, James Turner, and Ana C. Arias

The interfacing of soft and hard electronics is a key challenge for flexible hybrid electronics. Currently, a multisubstrate approach is employed, where soft and hard devices are fabricated or assembled on separate substrates, and bonded or interfaced using connectors; this hinders the flexibility of the device and is prone to interconnect issues. Here, a single substrate interfacing approach is reported, where soft devices, i.e., sensors, are directly printed on Kapton polyimide substrates that are widely used for fabricating flexible printed circuit boards (FPCBs)....

Publisher: University of California Berkeley

University of California Berkeley

From a group of academic pioneers in 1868 to the Free Speech Movement in 1964, Berkeley is a place where the brightest minds from across the globe come together to explore, ask questions and improve the world.

Berkeley, USA

Research Institute / Laboratory / School

Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

Aug 18, 2021 | Nagarajan Palavesam , Waltraud Hell, Andreas Drost, Christof Landesberger, Christoph Kutter and Karlheinz Bock

The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated circuits (ICs) on/in flexible foils have the potential to deliver high performance electrical functionalities at very low power requirements while being mechanically flexible....

Publisher: Fraunhofer EMFT Research Institution for Microsystems and Solid State Technologies

Fraunhofer EMFT Research Institution for Microsystems and Solid State Technologies

Fraunhofer EMFT conducts cutting-edge applied research on sensors and actuators for people and the environment. The over hundred employees in the three locations in Munich, Oberpfaffenhofen and Regensburg possess impressive ...

Munich, Germany

Research Institute / Laboratory / School

Electromechanical Reliability Testing of Flexible Hybrid Electronics Incorporating FleX Silicon-on-Polymer ICs

Aug 18, 2021 | Darrell E. Leber, Brian N. Meek, Seth D. Leija, Dale G. Wilson, Richard L. Chaney, and Douglas R. Hackler

Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. New static and dynamic tests are being developed to evaluate the performance of these systems. Dynamic radius of curvature and torsional test results are presented for a flexible hybrid electronics system with a FleX Silicon-on-Polymer operational amplifier manufactured in an 180nm CMOS process with 4-levels of metal interconnect mounted on a PET substrate....

Publisher: American Semiconductor, Inc.

American Semiconductor, Inc.

American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) ...

Boise, Idaho, USA

Research Institute / Laboratory / School

Company X -Air conditioning display panel test plan

Aug 16, 2021 | pti

Air conditioning display panel test plan...

Publisher: Shenzhen PTI Technology CO.,LTD

Shenzhen PTI Technology CO.,LTD

Our company was established in 2004, Main products: ICT on-line tester, ICT, functional testing machine 、FCT、 TSI、 automatic test and control system (ATE), test automation solutions, etc.

深圳, China

Manufacturer

Coatings and Pottings: A Critical Update

Aug 11, 2021 | Greg Caswell

Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations....

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions (acquired by ANSYS Inc)

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting

College Park,

Consultant / Service Provider

Design, Development & Analysis of Vacuum Chamber of Potting Machine

Aug 11, 2021 | Mahesh S. Ghule, Dr.(Mrs.)R.S.Bindu

This paper shows the Design and Finite Element analysis of vacuum chamber of potting machine designed for electronic ignition coil applications. There are two types of potting methods 1) With Vacuum 2) Without Vacuum....

Publisher: D Y Patil College Of Engineering Akurdi, Pune

D Y Patil College Of Engineering Akurdi, Pune

The oldest campus of Dr. D. Y. Patil group of Institutions. This campus is started in year 1983 and further nurtured by our visionary Chairman Hon'ble Dr. P. D. Patil with the vision "Empowerment through knowledge" "Better ...

Akurdi, Pune, India

Research Institute / Laboratory / School

Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

Aug 11, 2021 | Lei Sun and Wenjun Yi

In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed....

Publisher: Nanjing University

Nanjing University

Located in the ancient capital of Nanjing, Nanjing University and its predecessors have taken responsibility for the country and the nation during its development of over 100 years. Committed to the prosperity of the nation ...

Nanjing, Jiangsu, China

Research Institute / Laboratory / School

Potting And Encapsulating – Avoiding Voids

Aug 11, 2021 | Paul Whitehead

Formulators of multi-component adhesives, potting and encapsulation materials are careful not to supply products with entrapped air. They do this by manufacturing under vacuum or degassing them before supplying to the end user. Consequently, entrapped air in a mixed material is usually a processing issue....

Publisher: Intertronics

Intertronics

INTERTRONICS supplies adhesives, coatings, sealants and equipment to customers with high technology, high performance assembly applications. Our customers are manufacturers in industries such as electronics, medical devices, plast

Oxfordshire, United Kingdom

Manufacturer

An Intelligent Approach For Improving Printed Circuit Board Assembly Process Performance In Smart Manufacturing

Aug 04, 2021 | Vincent WC Fung and Kam Chuen Yung

The process of printed circuit board assembly (PCBA) involves several machines, such as a stencil printer, placement machine and reflow oven, to solder and assemble electronic components onto printed circuit boards (PCBs). In the production flow, some failure prevention mechanisms are deployed to ensure the designated quality of PCBA, including solder paste inspection (SPI), automated optical inspection (AOI) and in-circuit testing (ICT). However, such methods to locate the failures are reactive in nature, which may create waste and require additional effort to be spent re-manufacturing and inspecting the PCBs. Worse still, the process performance of the assembly process cannot be guaranteed at a high level. Therefore, there is a need to improve the performance of the PCBA process. To address the aforementioned challenges in the PCBA process, an intelligent assembly process improvement system (IAPIS) is proposed, which integrates the k-means clustering method and multi-response Taguchi method to formulate a pro-active approach to investigate and manage the process performance....

Publisher: Hong Kong Polytechnic University [The]

Hong Kong Polytechnic University [The]

With 80 years of proud tradition, PolyU is a world-class research university, ranking among the world's top 100 institutions. Hong Kong Polytechnic University (PolyU) is a home for educating thinkers, communicators, and discovers.

Hung Hom, Kowloon, Hong Kong

Research Institute / Laboratory / School

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