Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1857 SMT / PCB Assembly Related Technical Articles

2020 AUTONOMOUS VEHICLE TECHNOLOGY REPORT

Feb 11, 2021 | How this report came to be: a collaborative effort - Bram Geenen Editor-In-Chief

Motorized transportation has changed the way we live. Autonomous vehicles are about to do so once more. This evolution of our transport - from horses and carriages, to cars, to driverless vehicles, - has been driven by both technical innovation and socioeconomic factors. In this report we focus on the technological aspect....

Publisher: Wevolver

Wevolver

At Wevolver we want to empower people to create and innovate by providing access to engineering knowledge. Humans need innovation to survive and thrive. Developing relevant technologies and creating the best possible solutions ...

Chorley, United Kingdom

Research Institute / Laboratory / School

Recycling Waste Circuit Board Efficiently and Environmentally Friendly through Small-Molecule Assisted Dissolution

Feb 04, 2021 | Zhiqiang Chen, Meng Yang, Qian Shi, Xiao Kuang, H. Jerry Qi & Tiejun Wang

With the increasing amount of electronic waste (e-waste) generated globally, it is an enormous challenge to recycle printed circuit boards (PCBs) efficiently and environmentally friendly. However, conventional recycling technologies have low efficiency and require tough treatment such as high temperature (>200 °C) and high pressure. ... doi.org/10.1038/s41598-019-54045-w....

Publisher: National Natural Science Foundation of China

National Natural Science Foundation of China

The National Natural Science Foundation of China (NSFC) was established on February 14, 1986. Upon its establishment, NSFC was an institution directly under the jurisdiction of the State Council, tasked with the administration ...

Beijing, China

Research Institute / Laboratory / School

Closed‑Loop Recycling of Copper from Waste Printed Circuit Boards Using Bioleaching and Electrowinning Processes

Feb 04, 2021 | Mahsa Baniasadi· John E. Graves · Daniel A. Ray5 · Angélique Lindamulage De Silva · Derek Renshaw · Sebastien Farnaud

In the present study, a model of closed-loop recycling of copper from PCBs is demonstrated, which involves the sequential application of bioleaching and electrowinning to selectively extract copper. This approach is proposed as part of the solution to resolve the challenging ... doi.org/10.1007/s12649-020-01128-9...

Publisher: Waste and Biomass Valorization

Waste and Biomass Valorization

Springer Publishing is an award-winning publisher of healthcare and behavioral sciences content, featuring books, apps, journals, and digital products. With an acute understanding of how educators teach, how practitioners work ...

6330 Cham, Switzerland

Media / Publisher / Online Resource

Extreme Long Term Printed Circuit Board Surface Finish Solderability Assessment

Jan 28, 2021 | Gerard O'Brien, Solderability Testing and Solutions Inc., Richmond, KY Dave Hillman, Rockwell Collins, Cedar Rapids, IA

Printed circuit board surface finishes are a topic of constant discussion as environmental influences, such as the Restriction of Hazardous Substances (RoHS) Directive or technology challenges, such as flip chip and 01005 passive components, initiate technology changes. These factors drive the need for greater control of processing characteristics like coplanarity and solderability, which influence the selection of surface finishes and impact costs as well as process robustness and integrity. The ideal printed circuit board finish would have good solderability, long shelf life, ease of fabrication/processing, robust environmental performance and provide dual soldering/wirebonding capabilities; unfortunately no single industry surface finish possesses all of these traits. The selection of a printed circuit board surface finish is ultimately a series of compromises for a given application....

Publisher: Solderability Testing and Solutions Inc

Solderability Testing and Solutions Inc

Solderability Testing and Solutions Inc is located in Richmond, KY, United States and is part of the Consumer Services Industry. Solderability Testing and Solutions Inc has 2 total employees across all of its locations ...

Richmond, Kentucky, USA

Research Institute / Laboratory / School

Reliability Testing For Microvias In Printed Wire Boards

Jan 21, 2021 | Bill Birch

Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) these structures are proving less reliable, when compared to their single or double level counterparts. Recently false positive results have been recorded on products tested with traditional thermal shock testing methodology (cycling between -40°C and 125°C, or 145°C). A number of companies are incurring product failures resulting in increased costs associated with replacing the circuit boards, components and added labour....

Publisher: PWB Interconnect Solutions Inc.

PWB Interconnect Solutions Inc.

PWB designs and manufactures test equipment and provides services to test the reliability of Printed Circuit Boards.

Nepean, Ontario, Canada

Manufacturer

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Jan 13, 2021 | Yu-An Shen, Shiqi Zhou, Jiahui Li, Chih-han Yang, Sijie Huang, Shih-kang Lin, Hiroshi Nishikawa

Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ......

Publisher: Osaka University

Osaka University

Osaka University, or Handai, is a public research university located in Osaka Prefecture, Japan. It was one of Imperial Universities in Japan, one of the Designated National University and selected as a Top Type university ...

Osaka, Japan

Research Institute / Laboratory / School

Design and Experiment of a Moving Magnet Actuator Based Jetting Dispenser

Jan 13, 2021 | Minh-Sang Tran and Sheng-Jye Hwang

Developing actuators to drive high-frequency jetting dispensers in the dispensing technology for electronic assembly applications has become a concern in recent years. This study proposed a new jetting dispenser without a displacement amplification mechanism directly actuated by a moving magnet actuator (MMA) to jet small fluid droplets. In this article, the main geometric dimensions of ......

Publisher: National Cheng Kung University

National Cheng Kung University

National Cheng Kung University is a public research university located in Tainan, Taiwan. NCKU is one of the best comprehensive universities in Taiwan and a leader in promoting industry-academia cooperation. ...

Tainan City, Taiwan

Research Institute / Laboratory / School

Challenges of Manufacturing with Printed Circuit Board Cavities

Jan 06, 2021 | William O. Alger, Pedro J. Martinez, Weston C. Roth

Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufacturing process varies by the individual PCB...

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Jan 03, 2021 | Ning-Cheng Lee

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer

Fill the Void V - Mitigation of Voiding for Bottom Terminated Components

Dec 29, 2020 | Tony Lentz, FCT Assembly & Greg Smith, BlueRing Stencils

Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs)....

Publisher: FCT ASSEMBLY, INC.

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer

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