Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1798 SMT / PCB Assembly Related Technical Articles

Conformal Coating Processes

Jul 29, 2019 | ACI Technologies, Inc.

ACI Technologies can assist its users with process development and experimentation through the use of the conformal coating capabilities in the Demonstration Factory. Four types of coating processes are available at ACI Technologies: dip coating, manual spray coating, programmable spray coating, and manual brush application. (Manual brush application will not be discussed in this article.)...

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant / Service Provider, Standards Setting / Certification, Training Provider

Carrier tape introduction and classification

Jul 27, 2019 | James tong

Carrier Tape refers to a strip product used in the field of electronic packaging, which has a specific thickness, and equidistantly distributes holes (also called pockets) for holding electronic components in the longitudinal direction thereof. Positioning hole for index positioning....

Publisher: Shenzhen Sewate Technology Co.,Ltd

Shenzhen Sewate Technology Co.,Ltd

Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel, ESD trays for electronic components.

Shenzhen, China

Consultant / Service Provider, Manufacturer

Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies

Jul 24, 2019 | Brook Sandy-Smith

Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer

Common Process Defect Identification of QFN Packages

Jul 23, 2019 | David Bernard @ Dage Precision Industries, Bob Willis @ ASKbobwillis.com

The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed....

Publisher: Nordson DAGE

Nordson DAGE

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Aylesbury. Buckinghamshire,

Consultant / Service Provider, Manufacturer

A Systematic Approach to RoHS Analysis

Jul 19, 2019 | ACI Technologies, Inc.

One of the most frequently asked questions of ACI Technologies (ACI) is how to qualify and verify that the electronic systems shipped by their respective companies are Restriction of Hazardous Substances (RoHS) compliant. The RoHS directive has been implemented since July of 2006, and the preoccupation with what constitutes a compliant product continues to confuse the electronic industry. ACI receives countless inquiries regarding how to qualify and verify that the electronic systems shipped by the irrespective companies are RoHS compliant. The approach to proving compliancy requires a sequential analytical process that utilizes a decision flow chart....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant / Service Provider, Standards Setting / Certification, Training Provider

Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution

Jul 17, 2019 | Maria Nikolova, Confesol Rodriguez, Kesheng Feng, Carmichael Gugliotti, William Bowerman, Jim Watkowski, Bob Wei

The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface.</p> <p>In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented....

Publisher: MacDermid Inc.

MacDermid Inc.

MacDermid is a global provider of specialty chemicals for the most complex printed circuit board designs. We specialize in the areas of final finishes, through-hole metallization, and circuit formation.

Waterbury, Connecticut, USA

Manufacturer

Design of Experimentation for Affordability

Jul 11, 2019 | ACI Technologies, Inc.

Affordability is not exactly the primary word which comes to mind when discussing the use of design of experiments (DOE) principles, but is generally accepted as a necessary part of the engineering activities required in the development of a product or process. However, a number of studies have indicated that the cost savings derived from a well deliberated experimental design can be substantial in the initial stages where the conditions or parameters of a process are determined. Some studies have shown a greater than 50% cost savings compared to the more conventional means of trial and error approaches to process development. At ACI Technologies (ACI), we have found the use of DOE techniques fundamental in eliminating extraneous costs otherwise spent on unnecessary testing....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant / Service Provider, Standards Setting / Certification, Training Provider

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Jul 10, 2019 | M. Barnes, D.W. Lee, D. Heller - Heller Industries, M.Holtzer, T. Cucu - Alpha Assembly Solutions, J. Fudala, J. Renda - MacDermid Enthone Electronic Solutions

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation....

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer

Fourier Transform Infrared Spectroscopy

Jul 05, 2019 | ACI Technologies, Inc.

Fourier Transform Infrared (FTIR) spectroscopy exists as one of the most powerful techniques for chemical identification and the most practical for “first step” analysis. Analytical instrumentation such as GC-MS and LC-MS are commonly used for identifying organic compounds. However, these techniques are costly and often require extensive set up time, method development, and sample alteration. Reliance upon FTIR as a robust and versatile tool can be based on its attributes of simplicity, speed, sensitivity, and affordability....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant / Service Provider, Standards Setting / Certification, Training Provider

Reduce Pollution of Process Gasses in an Air Reflow Oven

Jul 02, 2019 | Gerjan Diepstraten

The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.</p><p>Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.</p><p>This paper will give more detailed information of catalyst systems during development and performance in production lines....

Publisher: Vitronics Soltec

Vitronics Soltec

Global manufacturer of XPM Reflow Ovens, ZEVA Selective Soldering and Delta Wave Soldering Equipment.

Camdenton, Missouri, USA

Manufacturer

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