Technical Articles From Budapest University of Technology and Economics
Read technical articles about electronics manufacturing added by Budapest University of Technology and Economics
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2 technical articles added by Budapest University of Technology and Economics
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Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates
Sep 08, 2021 | Tamás Hurtony, Oliver Krammer, Balázs Illés, Gábor Harsányi, David Bušek and Karel Dušek
Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s....
Stencil Design Guidelines for Electronics Assembly Technologies.
Mar 13, 2014 | Budapest University of Technology and Economics Department of Electronics Technology
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production....
