Technical Articles From ALTER TECHNOLOGY
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1 technical article added by ALTER TECHNOLOGY
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Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
Jan 22, 2020 | Gonzalo Fernandez, Ana Collado
Flip chip assembly techniques bring a wide range of benefits:</p> <ul> <li>Reduced parasitic interconnection between the semiconductor die and package.</li> <li>Provides a high final assembly integrity density.</li> <li>Minimize the interconnection length, providing better electrical performances, especially for high speed signals.</li> <li>Reduce the device size and weight,…, etc.</li> </ul> <p>But there is no dedicated inspection requirements nor DPA standard which address all the necessary aspects associated to this construction type or only cover partially the topics to be inspected....