Electronics Manufacturing Technical Articles

The Proximity of Microvias to PTHs And Its Impact On The Reliability

May 09, 2007 | Anthony Primavera Manager - CSP Consortium Universal Instruments Corporation, Jaydutt Joshi, Package Development Engineer - Conexant Systems Inc.

High Density Interconnect (HDI) technology is fast becoming the enabling technology for the next generation of small portable electronic communication devices. These methods employ many different dielectrics and via fabrication technologies. In this research, the effect of the proximity of microvias to Plated Through Holes (PTHs) and its effect on the reliability of the microvias was extensively evaluated. The reliability of microvia interconnect structures was evaluated using Liquid-To-Liquid Thermal Shock (LLTS) testing (-55oC to +125oC). Comprehensive failure analysis was performed on microvias fabricated using different via fabrication technologies....

Publisher: Universal Instruments Corporation

A Study of Lead-Free Wave Soldering

May 02, 2007 | David Suraski.

This brief study of lead-free wave soldering focuses upon copper dissolution and solder maintenance issues. Unfortunately, it is determined that waste and changeover costs can dramatically increase with lead-free wave soldering....

Publisher: AIM Solder

Real-Time Yield Monitoring Through ERP Systems

Apr 25, 2007 | P. Bhargava, J. Sturek, J. Peck, R. Murcko, K. Srihari

Globalization and increased competition requires an enterprise to focus on cost reduction, improved manufacturing processes and higher standards of quality. Effective yield management using Enterprise Resource Planning (ERP) systems is crucial for the success of any manufacturing organization. An ERP system provides the infrastructure for consolidating all business operations by integrating the information flow across functions, including production planning and control....

Publisher: i3 Electronics

Fragility of Pb-free Solder Joints

Apr 18, 2007 | Universal Instruments Corporation

Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embrittlement processes. This is of obvious concern for products facing relatively high operating temperatures for protracted times and/or mechanical shock or strong vibrations in service....

Publisher: Universal Instruments Corporation

A Case Study in Troubleshooting Shop Floor Rework Difficulties

Apr 05, 2007 | Martin Hogner; Martin Rework and Dispense Technic, Wessling/Munich, Germany, and Allen Sirois; Web Administrator, Manncorp Inc., USA.

Recently a large global player approached us with a problem. They needed an initial assembly solution for brand new components. Their boards and CSP specimens could not safely be soldered due to wetting problems at the solder joints....

Publisher: MARTIN (a Finetech company)

Effects of Assebly Process Variables on Voiding at a Thermal Interface.

Apr 04, 2007 | Muffadal Mukadam, Jeff Schake, Peter Borgesen, Krishnaswami Srihari.

The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature....

Publisher: Universal Instruments Corporation

Lead-free Rework Process For Chip Scale Packages

Mar 28, 2007 | Arun Gowda and K. Srihari, Ph.D. - Electronics Manufacturing Research and Services, Anthony Primavera, Ph.D. Consortium Manager - Universal Instruments Corporation

Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging....

Publisher: Universal Instruments Corporation

Are You Becoming E-Wasted?

Mar 13, 2007 | Jim Usery

This article gives an explanation of what e-waste is and states the regulations on how it can be disposed of. It also tells what some companies are doing to help the consumer get rid of it....

Publisher: Innovative Circuits Inc.

Prototyping Your New Electronic Product Idea

Mar 13, 2007 | Jim Usery, Sales and Marketing Director, Innovative Circuits Inc.

This article outlines the minimum tasks needed to send your new electronic product idea out for prototyping. It lists and defines the minimums to either perform your self or to have subcontracted....

Publisher: Innovative Circuits Inc.

I Have an Idea for a New Product, but Now What?

Mar 13, 2007 | Jim Usery

Do you have an idea for an electronic product, the next must-have gadget, music or video system, time saver, or the greatest problem-solving device that was ever invented? Before you begin designing the product, there are a number of tasks that you must complete and issues that you must resolve before you have an actual product design that can be produced, marketed, and sold. This article will provide you with some guidelines to assist you in getting your idea turned into a successful design. Other issues, such as whether or not to apply for a patent for your product idea and in detail how a particular product should be advertised or marketed will not be addressed in this article....

Publisher: Innovative Circuits Inc.

Basics of Manufacturing Printed Circuit Boards

Mar 13, 2007 | Jim Usery, Sales and Marketing Director, Innovative Circuits Inc.

This article tells about the basics of manufacturing printed circuit boards including the terminology and the steps to processing a PCB....

Publisher: Innovative Circuits Inc.

What Your Electronic Manufacturing Service Provider Needs from You

Mar 13, 2007 | Jim Usery, Sales and Marketing Director, Innovative Circuits Inc.

This article tells what your electronic manufacturing service providers needs from you to prepare an accurate quotation for a typical printed circuit board assembly project....

Publisher: Innovative Circuits Inc.

What Are Gerber Files for Printed Circuit Boards, and Who Needs Them?

Mar 13, 2007 | Jim Usery

This article tells what a gerber file is and what it is used for in the electronic manufacturing industry....

Publisher: Innovative Circuits Inc.

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Mar 08, 2007 | Jianbiao Pan, Brian J. Toleno, Tzu-Chien Chou, Wesley J. Dee

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force....

Publisher: Henkel Electronic Materials

New BGA Solder Mask Repair Technique Using Laser Cut Stencils

Feb 01, 2007 | Ronald D. Schaeffer, Chief Executive Officer, Photomachining.

The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed....

Publisher: BEST Inc.

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Feb 01, 2007 | Ray Cirimele, Best, Inc

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture....

Publisher: BEST Inc.

Surface Insulation Resistance (SIR) Testing

Feb 01, 2007 | Roy Johnson, Senior Staff Engineer AG Communication Systems.

Purpose: Compare the Surface Insulation Resistance of reworked BGA Test samples made with standard solder balls using a flux only reattachment and samples made including the StencilQuik™ product from Best Inc. with solder balls using a flux only reattachment....

Publisher: BEST Inc.

BGA Thermal Shock Testing

Feb 01, 2007 | Roy Johnson Senior Staff Engineer AG Communication Systems.

The purpose of the testing was to compare the resistance and check for open circuit conditions of reworked BGA test samples made with and without StencilQuik™ after 500 thermal shock cycles. StencilQuick™ is a product of Best Inc. In this series of tests, the resistance of daisy chain resistance patterns running between the BGA and test board after exposure to thermal shock was measured....

Publisher: BEST Inc.

StencilQuick™ Lead-Free Solder Paste Rework Study

Jan 31, 2007 | Ray Cirimele, BEST Inc

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber. ...

Publisher: BEST Inc.

Reflow Profiling Guide

Jan 31, 2007 | John Viviari, EFD, Inc.

This paper explains the solder paste reflow process and the best practices to follow when developing your profile....

Publisher: Nordson EFD

Auger Valve Dispensing

Jan 31, 2007 | John Viviari, EFD, Inc.

This white paper is suitable for both new and experienced users. It is a practical education in the use and misuse of auger valves for solder paste dispensing....

Publisher: Nordson EFD

Air Powered Dispensing

Jan 31, 2007 | John Viviari, EFD, Inc.

Air-powered dispensing systems use controlled pulses of air pressure to dispense solder paste from syringe reservoirs in uniform amounts. In this paper, EFD explains the most critical variables affecting air-powered dispensing of solder pastes and shows how to manage those variables to your advantage....

Publisher: Nordson EFD

HASL - What a Hassle, or Hasl'd Again

Jan 24, 2007 | Earl Moon

This article updates one I wrote for Printed Circuit Fabrication Magazine in December 1991. Actually, this article trashes that - and about time. I was much too kind then talking about how to control the HASL process....

Breakthrough in Molecular Design Could Unleash the Full Speed of the Internet

Jan 17, 2007 | Cherie Winner, WSU News Service

Researchers at Washington State University have created design guidelines for new molecules that could enhance the speed of internet communications and other optical technologies....

Publisher: Washington State Magazine

Printed Circuit Board Failure Analysis

Jan 10, 2007 | Earl Moon

As with all other F/A processes, PCB's occasionally need a little help from them. The following, just as the component process in Section previous, has been condensed from so many involvements over the past 35 years, I cannot remember - nor should I because they all could have been prevented with DFM/CE. However, the information presented, coupled with good DFM/CE and PCB process management provides an insight to the beast....

Dispensing Solder Paste Micro-Deposits to 0.2mm - A Process Solution

Jan 03, 2007 | John Vivari / EFD Inc.

Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits....

Publisher: Nordson EFD

First Principles of Solder Reflow

Dec 18, 2006 | John Vivari / EFD Inc.

Many solder users have preconceived notions and worries involving reflow profiling guidelines. Year after year of reading profiling recommendations in industry publications, from a litany of pundits, has made it clear that perfect profiles exist and should be sought after. They feel if the solder supplier gives them a tidy drawing on a piece of paper with times and temperatures that it will magically solve all their reflow problems. This is, unfortunately, an often incorrect assumption....

Publisher: Nordson EFD

"High Reliability Products" What does it really take - A Test Perspective

Dec 04, 2006 | Subahu D. Desai

This paper will explore how test can be an integral part of manufacturing to assure High Reliability Products. We will discuss how test parameters and test techniques are effective in finding time zero vs. time dependent defects. Understanding of manufacturing processes in terms defect levels as well as defect types is very critical in defining test parameters, new test techniques and test alternatives. This ultimately can improve the yield, quality, and reliability. We will discuss the types of defects, time zero vs. time dependent defects, test parameters and effectiveness and new test techniques to find time dependent defects....

Publisher: i3 Electronics

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Nov 14, 2006 | David Alcoe, Kim Blackwell and Irving Memis, Endicott NY

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package ...

Publisher: i3 Electronics

Improvement of Organic Packaging Thermal Cycle Performance Measurement

Nov 01, 2006 | Glenn O. Dearing, Paul J. Hart

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation....

Publisher: IBM Corporation

Tombstone Troubleshooting

Oct 26, 2006 | Michael Forti, Applications/Process Engineer, EFD

There have been many studies of the causes of tombstoning; some published, some not. They tend to focus on a single process parameter as the root cause of tombstoning. However, there is no single process change that is a sure cure for tombstoning! Those that claim otherwise are either uninformed or trying to sell you something. Rather than limiting your view to a single solution, EFD recommends you heed all of the studies. Like pieces of a puzzle, each study does not reveal the whole picture, but looked at all together, the picture is clear....

Publisher: Nordson EFD

Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

Oct 02, 2006 | Michael Meilunas of Universal Instruments Corporation, Binghamton, NY; Muffadal Mukadam, and Hari Srihari of Binghamton University, Binghamton, NY

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs....

Publisher: Universal Instruments Corporation

Evaluating Soldering Irons for Lead Free Assembly -A Quantitative Approach

Sep 06, 2006 | Purnanand G. Samant, Srikanth Poranki, & Daryl Santos, Ph.D,

Transition to lead free solder stations in electronics packaging has raised issues regarding process, metallurgy and reliability m assemblies. In regards to soldering, lead has been used for thousands of years in a wide range of applications. Conventional eutectic or near eutectic tin-lead solder compositions have been used for virtually all soldering applications in electronics assembly for the last 50 years, In the electronics assembly process, a majority of commercial rework applications and some low density board assembly processes require hand soldering stations (...) This paper describes an attempt to quantify both qualitative and quantitative data that can aid in the evaluation of lead free soldering irons....

Publisher: T.J. Watson School of Engineering and Applied Science

Design For Test Considerations For PCB Design

Jul 14, 2006 | Zulki Khan, president and founder, Nexlogic, Inc.

The perennial question in electronics design and manufacture is: "How do I design a printed circuit board (PCB) so that it can be properly tested?" To achieve this objective, there are a number of design-for-test (DFT) considerations and techniques. Some are major, others, minor. However, the total contributes to a highly effective PCB design so that testing procedures applied to a given design result in high 90 percent plus test coverage....

Publisher: NexLogic Tech, Inc.

Testing To Eliminate Reliability Defects From Electronic Packages

Jun 29, 2006 | Irving Memis, Consultant, Endicott Interconnect Technologies

Electronic Packaging is a critical part of all electronic devices and can be a source of the reliability problems experienced by systems using those devices. In many cases, the packaging defects are intermittent in nature and difficult to detect. This paper describes a tester that has been used for 20 years on commercial products and has proven to be extremely effective in detecting these defects prior to component assembly....

Publisher: i3 Electronics

Wave Solder Parameter Chart

May 13, 2006 | Kantesh Doss

This Excel Spreadsheet calculates the Wave Solder Contact Time automatically with given main Solder Wave width and Conveyor Speed. There is one chart where conveyor speed is expressed in meters/min and in another where it is expressed in feet/minute....

Publisher: Jabil Circuit, Inc.

You, too, can do 0402!

May 16, 2005 | Bill Shaw, Articulation LLC

Low cost techniques for building prototype and low volume SMT printed circuit boards....

Publisher: Articulation LLC

No-Residue Technology Chemistry and Physics

Sep 02, 2004 | Patrick O. Bruneel Technical Advisor - Interflux USA, Inc.

The main goal of this paper is to highlight the importance of interrelating the physics and the chemistry in wave soldering and soft soldering in general. Often we find the disciplines of chemistry and physics being analyzed distinct and separate. However in the quest for alternative ways for leading edge competitive and especially environmental friendly manufacturing, separating or ignoring this interrelationship is detrimental to the success of No-Residue soldering....

Publisher: Interflux USA, Inc.

Cost Analysis of Printed Circuit Boards

May 23, 2004 | By Gold Phoenix's North America Service and Tech Center

This is an article written by our company's experts to help our customers to make informed decision on PC boards purchasing. It introduces the materials that are used in the PCB manufacturing and the cost analysis of different materials....

Publisher: Gold Phoenix PCB Co, Ltd

0201 Placement - Only With The Right Team and Tools!

Sep 17, 2003 | P.Gerits / A.Mandos

It appears very logical that the successor of the 0402 size SMD would be the 0201. Curves showing the life-cycle of a body size, from introduction to most used to only for special cases, are very similar for the 1206, 0805, 0603 and 0402. So there is reason to expect that the same will happen with the 0201. Until now there is only little evidence for this, but most technologies come later than expected but faster than expected!...

Publisher: Assembléon

Tutorial: How to Select the Best Stencil for SMT and Advanced IC Package Printing

May 05, 2003 | By Alden Johnson, Cookson Electronics Equipment, Franklin,Mass.

The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization....

Publisher: Cookson Electronics

Equipment Impacts of Lead Free Wave Soldering

Apr 18, 2003 | Jim Morris, Advanced Development Manager, Cookson Electronics Equipment & Matthew J. O'Keefe, Ph.D., Associate Professor of Metallurgical Engineering, University of Missouri

The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem....

Publisher: Cookson Electronics

Wave & Reflow Soldering Troubleshooting Chart

Mar 07, 2002 | Speedline Technologies

Electrovert problems & solutions reflow & wave soldering....

Publisher: Speedline Technologies, Inc.

Line Balancing The Route To Profit in Electronics Manufacturing

Oct 25, 2001 | Paul Gerits, Anton Mandos

The electronics business has been a rather heated, if not over-heated, environment for many years. This has lead to a forgiving climate regarding inefficiencies, as resources have not been stretched and getting products out has been top priority. It might now be time to invest in some reflection on the strategies and tactics applied to the production environment in order to be prepared for the ‘heat’ of the future. Focusing investment in the right resources, and not sub-optimising, is the way to go....

Publisher: Assembléon

Odd or SMD?

Aug 17, 2001 | Paul Gerits, Anton Mandos

Odd or SMD? At one time it was clear. An SMD component was placed on the surface of a PCB and all others were defined as 'odds' or 'specials'. This article discribes the changes and how equipment manufactorers react on it....

Publisher: Assembléon

Effective Supply Chain Management

May 23, 2001 | R. Michael Donovan

The complexities of getting material ordered, manufactured and delivered overload most supply chain management (SCM) systems. The fact is, most systems are just not up to handling all the variables up and down the supply chain......

Publisher: R. Michael Donovan & Co., Inc.

Successful ERP Implementation The First Time

May 23, 2001 | R. Michael Donovan

It’s not pretty out there. Companies have spent fortunes on ERP software and implementation only to find that business performance has not improved at all. These large investments and negative ROIs have created a whirlpool of controversy, rampant company politics and even a number of lawsuits. The trade press has reported many negative ERP stories, and even annual reports have pointed the finger at ERP for lower-than-expected earnings. For some, this has created a higher level of fear about making a big ERP mistake......

Publisher: R. Michael Donovan & Co., Inc.

Demand-based Flow Manufacturing for High Velocity Order-to-Delivery Performance

May 23, 2001 | R. Michael Donovan

Consultant R. Michael Donovan writes that manufacturers need to become more nimble and much faster in their order-to-delivery process. Mike discusses the implications of push vs. pull, IT tools as enablers and potential benefits from Demand-based Flow Manufacturing. ...

Publisher: R. Michael Donovan & Co., Inc.

Customer Service Improvement: It's Mission Critical To Your Future

May 23, 2001 | R. Michael Donovan

Consultant R. Michael Donovan asks, "Do you really provide what your customers want and need?" He contends that companies who continuously excel at customer service will gain more marketshare. Mike provides his reader with 10 questions that can help an organization assess its customer service performance, progress and opportunities for improvement....

Publisher: R. Michael Donovan & Co., Inc.

Performance Measurement: Connecting Strategy, Operations and Actions

May 23, 2001 | R. Michael Donovan

Management consultant R. Michael Donovan outlines the problems and opportunities of performance measurement as an "enabling force" for improving overall business performance......

Publisher: R. Michael Donovan & Co., Inc.