Electronics Manufacturing Technical Articles

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Matrix maintenance in PXI with BIRST

Apr 21, 2011 | David Owen, Business Development Manager.

Switching systems, and in particular matrices are a key part of many tests systems, they allow a single core set of test equipment to be connected to the UUT, saving the cost of duplicating test equipment. That places the switching matrix in a very vulner...

Publisher: Pickering Interfaces Ltd.

Pickering Interfaces Ltd.

Manufacturer of commercial and custom switching systems used in the electronics test market and for imbedded switch systems in OEM equipment.

Essex, United Kingdom

Manufacturer of Components

Soldering And Handling Recommendations For Large Size MLC Capacitors

Apr 14, 2011 | Holy Stone Tech Paper

Multilayer Ceramic Capacitors (MLCC) come in a broad range of sizes, geometries, and values, offering design engineers with many options for designing circuits. In many cases these MLCC’s offer advantages over other types of capacitors including low ESR/E...

Publisher: HolyStone International

HolyStone International

Designer and manufacturer of quality Multilayer Ceramic Capacitors and Ceramic Based RF Components.

Murrieta, California, USA

OEM

Voiding Control for QFN Assembly

Apr 07, 2011 | Derrick Herron, Dr. Yan Liu, and Dr. Ning-Cheng Lee

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes.

Mar 30, 2011 | Kenneth Lee, Mustafa Özkök, Stefan Schmitz

The expression "multifunctional PCB", as a synonym for a PCB which is applicable with a variety of assembly techniques, is already established on the market. That means the PCB can be used for multiple reflow soldering and multiple assembly techniques lik...

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components / Substrates

A Two-Layer Board Intellectual Property to Reduce Electromagnetic Radiation

Mar 24, 2011 | Nansen Chen, Hongchin Lin

In this paper, a PCB layout technique is proposed to maintain ideal return paths for high-speed traces routing. Our goal is to implement and verify the digital LCD-TV in 2-layer PCB including the high-speed memory interfaces with less electromagnetic radi...

Publisher: MediaTek Inc.

MediaTek Inc.

MediaTek is a market leader and pioneer in cutting-edge SOC system solutions for wireless communications, high-definition digital TV, optical storage, and high-definition DVD products.

Hsinchu City, Taiwan

Henkel Electronic Materials

Method of Modeling Differential Vias

Mar 17, 2011 | Lambert Simonovich, Dr. Eric Bogatin, Dr. Yazi Cao,

Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high bandwidth, scalable first approximation circuit model using simple transmission lines o...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Backplane Architecture High-Level Design

Mar 16, 2011 | Lambert Simonovich

The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane ...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Practical Fiber Weave Effect Modeling

Mar 16, 2011 | Lambert Simonovich

Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada

Consultant

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Mar 10, 2011 | Neil Poole, Ph.D. and Brian Toleno, Ph.D.

History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead...

Publisher: Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

A New (Better) Approach to Tin Whisker Mitigation

Mar 03, 2011 | Craig Hillman, Gregg Kittlesen, and Randy Schueller

Most of the electronics industry by now knows about tin whiskers. They know whiskers are slim metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures (see nepp.nasa.gov/whisker/ for a list longer than you need). But, with all of this knowledge, the industry is still struggling on how to predict and prevent these "Nefarious Needles of Pain"....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Soldering, Selective Soldering

Dross and the Selective Soldering Process

Feb 24, 2011 | Alan Cable

In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two different areas of the process, and by separate means. Each must ...

Publisher: Nordson SELECT

Nordson SELECT

Selective Soldering Equipment and Solutions for Printed Circuit Board Assembly

Liberty Lake, Washington, USA

Ground Pours - To Pour Or Not To Pour?

Feb 17, 2011 | Barry Olney

Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas < 2.5.mm square are deleted automatically by t...

Publisher: In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

Novel Transmission Line for 40 GHz PCB Applications

Feb 10, 2011 | Jamal S. Izadian, Ph.D. - RFCONNEXT, Inc., Julian Ferry, Justin McAllister - Samtec, Inc.

In this paper, we discuss an electromagnetics based approach to transmission line design, and then explore a novel printed transmission line, Periodic Micro Transmission Line (PMTL™, Patents Pending), with improved signal integrity to 40 GHz....

Publisher: Samtec, Inc.

Samtec, Inc.

Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.

New Albany, Indiana, USA

0201 and 01005 Adoption in Industry

Feb 03, 2011 | DfR Solutions

First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Manufacturer of Assembly Material, Soldering

Dispelling 10 Myths About Nitrogen Reflow

Jan 27, 2011 | Dr. Andy Mackie

In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering.....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Development of Ultra-Multilayer Printed Circuit Board

Jan 20, 2011 | Yasuyuki Shinbo

This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets the market demand for a "semiconductor test board supporting memory increases"....

Publisher: OKI Printed Circuits Co., Ltd.

OKI Printed Circuits Co., Ltd.

OKI Printed Circuits is engaged in design, manufacturing and sales of high-end multi-layer printed circuit boards.

Tokyo, Japan

Contract Manufacturer

PCB Stack-Up

Jan 20, 2011 | Henry Ott Consultants

PCB stack-up is an important factor in determining the EMC performance of a product. A good stack-up can be very effective in reducing radiation from the loops on the PCB (differential-mode emission), as well as the cables attached to the board (common-mo...

Publisher: Henry Ott Consultants

Henry Ott Consultants

A consulting and training organization specializing in the field of Electromagnetic Compatibility (EMC) and Signal Integrity (SI).

Livingston, New Jersey, USA

Consultant, Training Provider

Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box)

Jan 13, 2011 | Terry Munson

The tin whisker failures investigated in this paper were found on functional RoHS-compliant hardware. The samples were not conformal coated. This paper will document the conditions associated with the whisker formation under the following conditions; tin ...

Publisher: Foresite Inc.

Foresite Inc.

Foresite is a process consulting house and analytial laboratory dedicated to solving product reliability challenges for electronics manufacturers.

Kokomo, Indiana, USA

Cleaning, Test Services, Consultant, Service Provider

Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

Jan 06, 2011 | Brian O' Leary, Tim Grove, Dr. S. Manian Ramkumar

The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature ...

Publisher: KIC Thermal

KIC Thermal

KIC's provides products and services designed to improve a variety of thermal monitoring, profiling and process control applications.

San Diego, California, USA

Software Manufacturer

Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Dec 22, 2010 | Rabindra N. Das, Varaprasad Calmidi, Mark D. Poliks and Voya R. Markovich

This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted....

Publisher: i3 Electronics

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Heat Management in Printed Circuit Boards

Dec 16, 2010 | Jakob Dieterle

This report discusses the significance of heat management in the design of printed circuit boards (PCB). After an introduction into the basics of PCBs the crucial mechanisms of heat transfer are discussed with regard to significance and typical design par...

Publisher: Lund University, The Faculty of Engineering

Lund University, The Faculty of Engineering

The Faculty of Engineering at Lund University is among the leading engineering faculties in Europe, with more than 7000 undergraduates and 800 postgraduates.

Lund, Sweden

School

3D ICs With TSVs - Design Challenges And Requirements

Dec 09, 2010 | Cadence

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int...

Publisher: Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

World's leading EDA company.

San Jose, California, USA

Design

Multilayer PCB Stackup Planning

Dec 02, 2010 | Barry Olney

Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate ca effectively reduce electromagnetic emissions, crosstalk and also make the...

Publisher: In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

Repair / Rework, Soldering, Service Provider

Component Shortages Causing Electronics Manufacturers to "Use All Means Necessary" to Ship Products

Nov 24, 2010 | Bob Wettermann

As the electronics manufacturing and assembly industry in the US recovers to some degree from the economic crisis which began in 2008, the challenge of component shortages has risen to the top as one of the stumbling blocks for contract assemblers and cap...

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center

Rolling Meadows, Illinois, USA

A High Performance and Cost Effective Molded Array Package Substrate

Nov 18, 2010 | Philip Rogren, Pierangelo Magni, Maura Mazzola, Mark Shaw, Giovanni Graziosi, Claudio Maria Villa

In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package. With respect to lead count, this packaging family is...

Publisher: EoPlex Technologies, Inc.

EoPlex Technologies, Inc.

Advanced materials company that builds small devices to generate and manage energy for various manufacturing components.

Redwood City, California, USA

Manufacturer of Assembly Equipment

Net Ties and How to Use Them

Nov 16, 2010 | Chris Carlson

The Net Tie is a component type which allows for shorting together various nets in a design. The graphic for the symbol can be as simple as two component pins representing a virtual component between nets or as complex as mutipul pins (as many as desired)...

Publisher: Altium

Altium

Altium provides electronics design solutions that help designers create the next generation of electronic products.

La Jolla, California, USA

Software Manufacturer

Assembling the Next Electronic Equipment Generations.

Nov 12, 2010 | Sjef v. Gastel, Manager of Advanced Development, Assembléon

Product roadmaps can look like largely theoretical constructs, but assembly requirements five or ten years down the line have very practical importance. Pick & place machines have a life of seven years or more, so they should be working up to 2017 or beyo...

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Optimizing BNC PCB Footprint Designs for Digital Video Equipment

Nov 06, 2010 | Tsun-kit Chin

An increasing number of video equipment is running at Gigabit rates today. They are interconnected through relatively large size coaxial BNC connectors. While these connectors are in general of good quality, their performance in the equipment depends on ...

Publisher: Samtec, Inc.

Samtec, Inc.

Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.

New Albany, Indiana, USA

Manufacturer of Assembly Material

Conductive Adhesives: TheWay Forward

Nov 04, 2010 | Dr. Ken Gilleo

Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead-free", "no clean" alternative to solder, these highly compatible materials offer viab...

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

Organic Optical Waveguide Fabrication in a Manufacturing Environment

Oct 28, 2010 | Benson Chan, How Lin, Chase Carver, Jianzhuang Huang, Jessie Berry

Optical waveguides based on organic materials have been fabricated in a laboratory environment but the scaling and manufacturing processes needed to produce these waveguides have been scant. The volume production of low loss organic waveguides in a conven...

Publisher: i3 Electronics

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

High Voltage Chip Resistors

Oct 21, 2010 | F.M. Collins, W.M. Mathias

Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level of conventional high voltage resistors which are generally availab...

Publisher: Ohmcraft

Ohmcraft

Ohmcraft is the leader in high-performance resistor design and manufacturing.

Honeoye Falls, New York, USA

Contract Manufacturer

Assessment of Residual Damage in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling

Oct 21, 2010 | Pradeep Lall, Rahul Vaidya, Vikrant More, Kai Goebel, Jeff Suhling

Electronic systems are often stored for long periods prior to deployment in the intended environment. Aging has been previously shown to effect the reliability and constitutive behavior of second-level leadfree interconnects....

Publisher: Auburn University

Auburn University

Auburn University is a comprehensive land-grant institution with primary missions including instruction, research, and extension/outreach.

Auburn, Alabama, USA

School

Electrostatic Discharge (ESD) - Sources of Electrostatic Charges in Production Line (SMT)

Oct 13, 2010 | Dipl.-Ing. Hartmut Berndt

The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So, it is necessary for everyone, who handles electrostatic sensitive devices (ESDS), to know the reasons of such failures. This presentation will give ...

Publisher: B.E.STAT European ESD Competence Centre

B.E.STAT European ESD Competence Centre

The B.E.STAT group© counts to the leading and most competent static control companies in Europe.

Kesselsdorf, Germany

Other

3D IC Development Needs Innovative Socket Solution

Oct 07, 2010 | Ila Pal

Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin...

Publisher: Ironwood Electronics

Ironwood Electronics

Ironwood Electronics, an ISO9001/2000 company, offers a wide selection of high performance adapters and sockets for all the various SMT IC Packages. Fast, high quality quick turn custom projects are o

Burnsville, Minnesota, USA

Design

Color Based Printed Circuit Board Solder Segmentation

Sep 30, 2010 | Tz-Sheng Peng, Chiou-Shann Fuh

As technology is much more advanced nowadays, electronic devices are ubiquitous in our daily life. PCB (Printed Circuit Board) plays an important role in almost every modern electronic device. However, there still is not a perfect PCB manufacturing proces...

Publisher: National Taiwan University

National Taiwan University

NTU is the top-ranked university in Taiwan and placed among the best 95 universities in the world.

Taipei, Taiwan

Mass Analysis Of The Components Separated From Printed Circuit Boards.

Sep 23, 2010 | Hana Charvátová, Dagmar Janáčová, Miloslav Fialka and Karel Kolomazník

Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thi...

Publisher: Acta Montanistica Slovaca

Acta Montanistica Slovaca

An international scientific journal published jointly by the Union of Metallurgy, Mining Industry and Geology of Slovak Republic, the Institute of Geotechnics of the Slovak Academy of Sciences.

Kosice, Slovakia

Publication or Online Resource

Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers

Sep 23, 2010 | Brian Toleno, Ph.D., Henkel Corporation

If you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed (maybe in scared whispered tones). Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940’s and 1950's. But, over half a century later, we're still talking about it....

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Sep 16, 2010 | Evstatin Krastev, David Bernard

With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de...

Publisher: Nordson DAGE

Nordson DAGE

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Aylesbury. Buckinghamshire, United Kingdom

Inspection, Test Services

How to Profile a PCB.

Sep 10, 2010 | M. N. Srinivasa Prasad.

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process....

Publisher: Robert Bosch LLC Automotive Electronics Division

Robert Bosch LLC Automotive Electronics Division

Within the Bosch-Group, the Automotive Electronics Division develops, produces, and sells microelectronic products for automotive and non-automotive applications.

Stuttgart, Germany

Other

Cleanliness of Stencils and Cleaned Misprinted Circuit Boards

Sep 09, 2010 | Bev Christian

The effectiveness of cleaning stencils and misprinted/dirty printed circuit boards can be effectively monitored. This can be done by washing known clean circuit boards and then checking to see if they have stayed clean as a result of the washing process. ...

Publisher: Research In Motion

Research In Motion

Research In Motion (RIM) is a leading designer, manufacturer and marketer of innovative wireless solutions for the worldwide mobile communications market.

Waterloo, Ontario, Canada

OEM

Using JTAG Emulation for Board-Level Functional Test Demanding Test

Sep 02, 2010 | ScanExpress JET™ White Paper

As chip packaging and interconnectivity have become more dense and operate at higher clock frequencies, physical access for traditional bed-of-nails testing becomes limited. This results in loss of ICT (in-circuit test) fault coverage and higher test fi...

Publisher: Corelis Inc

Corelis Inc

Corelis offers bus analysis tools, embedded test tools, and the industry’s broadest line of JTAG / boundary-scan software and hardware products.

Cerritos, California, USA

Test Services, OEM, Software Manufacturer, Manufacturer of Test Equipment

Digital manufacturing for traceability: The way to higher product quality and better warranty management

Aug 26, 2010 | Siemens PLM Software

Driven by high-profile regulations compliance like the TREAD Act, warranty management has become a hot topic across industries worldwide. Recalls are costly and time-consuming events that should be avoided entirely. But without adequate process traceability and product genealogy, too many customers will get defective products and too many products will be recalled for repair or replacement even though they are not defective. Both scenarios have enormous implications for the quality-conscious manufacturer that gets rated on the number of recalls it performs - not to mention the enormous direct costs. The core issue is visibility into product quality....

Publisher: ASM Assembly Systems GmbH & Co. KG

ASM Assembly Systems GmbH & Co. KG

ASM Assembly Systems is the supplier of SIPLACE, a leader in surface mount technology (SMT) equipment, software, and services to the electronics assembly market.

Munich, Germany

Manufacturer of Assembly Equipment, Pick and Place, Software Manufacturer

Implementation challenges for PCB tracking using RFID

Aug 26, 2010 | Murata

Radio frequency identification (RFID) ICs are a popular alternative to barcodes for PCB tracking applications. This article outlines some of the challenges that may be encountered when implementing an RFID system...

Publisher: Murata Manufacturing Co., Ltd.

Murata Manufacturing Co., Ltd.

Murata is a leading company involved in the manufacturing of ceramic electronic components with an overwhelming share worldwide in ceramic filters, high frequency parts, and sensors.

Kyoto, Japan

Manufacturer of Components, Components / Substrates

AdvancedCMT vs. Pressfit. The advantages of the Compression Mount Technology (CMT) when using AdvancedTCA and MicroTCA connectors.

Aug 26, 2010 | CODICO GmbH, Yamaichi Electronics

The advantages of the Compression Mount Technology (CMT) when using AdvancedTCA and MicroTCA connectors....

Publisher: Yamaichi Electronics

Yamaichi Electronics

Yamaichi Electronics is an international manufacturer of Memory Card connectors, test & burn-in-sockets, production sockets, test contactors, and high-density connectors.

San Jose, California, USA

Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications

Aug 19, 2010 | Dong Zhang, Meg Tredinnick, Mark Challingsworth

The silver end termination plays an important role for multilayer chip inductors. A basic requirement is to achieve excellent electrical properties with superior adhesion to the chip. Driven by the increasing price of silver, interest has been shown to ...

Publisher: Heraeus

Heraeus

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer of Assembly Material, Soldering

Realistic Implementation of Signal Integrity Screening – Guidelines for PCB Designers

Aug 19, 2010 | Griff Derryberry

This article looks at each of the roles of the engineer and PCB designer, considers the traditional design process, and makes suggestions on how the designer can contribute significantly to improving a design’s overall signal integrity while simultaneousl...

Publisher: Zuken

Zuken

One of the leading companies in the EDA and ECAD/CAE industry, offers a wide range of software solutions and consulting services for end-to-end electrical and electronic engineering.

Yokohama, Kanagawa, Japan

Software Manufacturer

PWB Manufacturing Variability Effects on High Speed SerDes Links: Statistical Insights from Thousands of 4-Port SParameter Measurements

Aug 05, 2010 | Bart O. McCoy, Robert Techentin, Benjamin Buhrow, Kevin Buchs, Dr. Barry K. Gilbert, Dr. Erik S. Daniel, How Lin

Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI me...

Publisher: i3 Electronics