Electronics Manufacturing Technical Articles

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Micro Vias in Board Station

Apr 24, 2001 | Mentor Graphics

This paper reviews the possible implementations of the Micro Via Technology within the Mentor Graphic's Board Station environment, specifically within the Librarian, Layout and Fablink applications. In this context, the definition of a Micro Via is constrained to Board Station’s support of such technology and contains only generalized descriptions of the manufacturing processes that require Micro Vias....

Publisher: Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

FSM Cookbook

Apr 24, 2001 | Mentor Graphics

Tau models describe the timing and functional information of component interfaces. Timing information specifies the delay in placing values on output signals and the timing constraints (set-up/hold, pulse-width) on input signals of a component. Functional information, through a finite state machine (FSM), specifies when output signal values change, when input signal values are latched, and how output values are determined as a function of input values....

Publisher: Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Autorouting Techniques for Mulitchip Modules

Apr 24, 2001 | John Cofield, Advanced Packaging Product Manager, Mentor Graphics Corporation

Many PCB designers are interested in taking advantage of Multichip Modules, but are unfamiliar with the technology. While the design process is very much the same, MCM manufacturing processes vary dramatically. MCM routing requirements are dictated by the manufacturing process and types of components. Components mounted on MCM substrates are predominantly, if not exclusively, bare chips. As a result, the component body and I/O pins are no longer constrained to industry standard pin counts and form factors as are packaged components......

Publisher: Mentor Graphics

A leader in software solutions for electroncs design, Mentor Graphics is the only EDA company with a total end-to-end solution for design though manufacturing.

Wilsonville, Oregon, USA

Quick Study Guide to Dummy Components

Nov 13, 2000 | TopLine Dummy Components

Free 16 page reference guide includes lots of pictures. Quickly explains the most important features of SMD components....

Publisher: TopLine Dummy Components

TopLine has the widest selection of daisy chain test packages and practice boards. In stock CCGA, BGA, CSP, QFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

MILLEDGEVILLE, Georgia, USA

Dummy Components Part Numbering System

Nov 13, 2000 | TopLine Dummy Components

Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips....

Publisher: TopLine Dummy Components

TopLine has the widest selection of daisy chain test packages and practice boards. In stock CCGA, BGA, CSP, QFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

MILLEDGEVILLE, Georgia, USA

Quick Guide to Daisy Chain

Nov 13, 2000 | TopLine

Free 16 page booklet shows 200 standard SMD Daisy Chain configurations including BGA, QFP, TQFP, TSOP, SOIC, SSOP, Flat Pack, CERQUAD and more....

Publisher: TopLine Dummy Components

TopLine has the widest selection of daisy chain test packages and practice boards. In stock CCGA, BGA, CSP, QFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

MILLEDGEVILLE, Georgia, USA

SMD Nomenclature - in Plain English

Nov 13, 2000 | TopLine Dummy Components

Free 40 page booklet explains about SMD component nomeclature. Lot of drawings. Easy to read. Want to know what 1206 means? Or the difference between a TQFP and LQFP? It's all included....

Publisher: TopLine Dummy Components

TopLine has the widest selection of daisy chain test packages and practice boards. In stock CCGA, BGA, CSP, QFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

MILLEDGEVILLE, Georgia, USA

Smart Sonic Stencil Cleaning Systems

Stencil Cleaner Meets Stringent EPA Rules

Jul 14, 2000 | Chuck Currie

The acronym "EPA" has cast almost as much fear in the hearts of industry as the letters "IRS." The Environmental Protection Agency has a plan to improve its image and actually help manufacturers attain their goals and ISO 14001 requirements....

Publisher: Smart Sonic Stencil Cleaning Systems

Our Ultrasonic Stencil cleaners are the only US & CA EPA Certified cleaners, that are environmentally and user safe. They are guaranteed to clean any type of solder paste from any fine pitch stencil.

Cleveland, Ohio, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Environmental Resources, Inspection

Reflow Profiling: The Benefits of Implementing a Ramp-to-Spike Profile

Jun 27, 2000 | David Suraski

This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the benefits of implementing the linear ramp-to-spike profile....

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Smart Sonic Stencil Cleaning Systems

Environmentally Certified Technologies: A Case Study

Jun 21, 2000 | William C. Schreiber

There was once a time when precision cleaning required minimal thought. Just about anything that was dirty could be placed inside a vapor degreaser and emerge clean and dry in a matter of minutes. Today, precision cleaning decisions are seemingly endless with ever-changing environmental regulations, user safety issues and product compatibility concerns. Technologies range from spray-in-atmosphere to ultrasonics to spray under immersion using aqueous, solvent or semiaqueous chemistries. Which method works and with what chemistry? Will the process be safe or even allowed by the regulating agencies?...

Publisher: Smart Sonic Stencil Cleaning Systems

Our Ultrasonic Stencil cleaners are the only US & CA EPA Certified cleaners, that are environmentally and user safe. They are guaranteed to clean any type of solder paste from any fine pitch stencil.

Cleveland, Ohio, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Environmental Resources, Inspection

Dam and Fill Encapsulation for Microelectronic Packages

Aug 27, 1999 | Steven J. Adamson and Christian Q. Ness

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective......

Publisher: Nordson ASYMTEK

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Considerations in Dispensing Conformal Coatings

Aug 27, 1999 | John P. Byers and Christopher E. Havlik

Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards....

Publisher: Nordson ASYMTEK

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Conductive Adhesive Dispensing, Process Considerations

Aug 27, 1999 | Alan Lewis and Alec Babiarz.

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given....

Publisher: Nordson ASYMTEK

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

An Air-Assisted "Airless" Conformal Coating Process

Aug 27, 1999 | Steven Felstein, Joan Lum

A need to move beyond aerosol sprays and dipping leads to a development that answers tough requirements for controlled coverage, low waste, and environmental restrictions....

Publisher: Nordson ASYMTEK

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly, Component Packaging

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Parasitic Extraction for Deep Submicron and Ultra-deep Submicron Designs

Aug 09, 1999 | Cadence Design Systems, Inc.

Shrinking process technologies and increasing design sizes continually challenge design methodologies and EDA tools to develop at an ever-increasing rate. Before the complexities of deep submicron (DSM), gate and transistor delays dominated interconnect delays, and enabled simplified design methodologies that could focus on device analysis. The advent of DSM processes is changing all of this, invalidating assumptions and approximations that existing design methodologies are based upon, and forcing design teams to re-tool. High-capacity parasitic extraction tools are now critical for successful design tape-outs....

Publisher: Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

World's leading EDA company.

San Jose, California, USA

Design

Alternatives to HASL: Users Guide for Surface Finishes

Aug 09, 1999 | Dan T. Parquet and David W. Boggs, Merix

A great deal of controversy continues to surround the use of Hot Air Solder Leveling (HASL) in the production of printed circuit boards (PCBs). The financial burden, technological limitations and environmental issues surrounding the HASL process continue to grow. This requires an in-depth review by the printed circuit board manufacturing plant, as well as the assembly operation and instrument designers ( OEMs), to determine what alternative surface finishes are appropriate....

Publisher: Viasystems Group, Inc.

Viasystems Group, Inc.

A leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs

St. Louis, Missouri, USA

Contract Manufacturer

Introducing the OSP Process as an Alternative to HASL

Aug 09, 1999 | David W. Boggs, Senior Process Engineer, Merix Corporation - Viasystem

Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements....

Publisher: Viasystems Group, Inc.

Viasystems Group, Inc.

A leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs

St. Louis, Missouri, USA

Contract Manufacturer

The Effects of Ergonomic Stressors on Process Tool Maintenance and Utilization

Aug 05, 1999 | Dwight Miller (Sandia National Laboratories)

This study examines ergonomic stressors associated with front-end process tool maintenance, relates them to decreased machine utilization, and proposes solution strategies to reduce their negative impact on productivity....

Publisher: SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Facility Fluids Metrics and Test Methods

Aug 05, 1999 | Deborah Franke

This technology transfer was prepared by the Research Triangle Institute (RTI) as part of SEMATECH's Facility Fluids Project (S100). It is a compilation of information on existing facility fluids metric and test methods. Information on standard methods was gathered from SEMATECH and SEMI. Other information was obtained from a literature search of journals and conference proceedings. The published information primarily is concerned with the test equipment used and what levels of detection and purity were found. Many of the articles discussed the use of new equipment, either commercial or experimental. Extensive annotated bibliographies are append to the report....

Publisher: SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Silicon Test Wafer Specification for 180 nm Technology

Aug 05, 1999 | Goodall, Randy

In 1998, the International 300 mm Initiative (I300I) demonstration and characterization programs will focus on 180 nm technology capability. To support these activities, I300I and equipment supplier demonstration partners must use starting silicon wafers with key parameters specified at a level appropriate level for 180 nm processing, including contamination and lithographic patterning. This document describes I300I's silicon wafer specifications, as developed with the I300I Silicon Working Group (member company technical advisors) and SEMI Standards....

Publisher: SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Test Structures for Benchmarking the Electrostatic Discharge (ESD) Robustness of CMOS Technologies

Aug 05, 1999 | Alexander, Robert

This document defines a set of standard test structures with which to benchmark the electrostatic discharge (ESD) robustness of CMOS technologies. The test structures are intended to be used to evaluate the elements of an integrated circuit in the high current and voltage ranges characteristic of ESD events. Test structures are given for resistors, diodes, MOS devices, interconnects, silicon control rectifiers, and parasitic devices. The document explains the implementation strategy and the method of tabulating ESD robustness for various technologies....

Publisher: SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Overview of Quality and Reliability Issues in the National Technology Roadmap for Semiconductors

Aug 05, 1999 | Barpoulis, Dino

This document is an update to the 1994 Quality and Reliability Roadmap issued in support of the 1994 National Technology Roadmap for Semiconductors. This report revisits the challenges, constraints, priorities, and research needs pertaining to quality and reliability issues. It also provides key project proposals that must be implemented to address concerns about reliability attainment and defect learning. An expanded section on test-to-test, diagnostics, and failure analysis; an edited version of the Product Analysis Forum Roadmap; and an appendix containing a draft report highlighting reliability issues is included....

Publisher: SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Guide for the Design of Semiconductor Equipment to Meet Voltage Sag Immunity Standards

Aug 05, 1999 | Mark Stephens, Dennis Johnson, John Soward, Jim Ammenheuser

This document summarizes the finding of testing to determine the immunity of semiconductor equipment to voltage sag events. Based in part on the findings, global standards have been adopted to define voltage sag immunity requirements for semiconductor equipment......

Publisher: SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Evaluating Automated Wafer Measurement Instruments

Aug 05, 1999 | Steven A. Eastman

This document demonstrates a sequential process of evaluating automated wafer instruments and discusses why this approach is useful for studying instruments that have automation features such as loading and focusing mechanisms. The methodology specifies a series of experiments consisting of two or more capability studies followed by a stability study. Each experiment achieves a separate goal, yet combines with the others in providing information needed to assess the usefulness of the instrument....

Publisher: SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Guidelines for Manufacturing Equipment Reference Manuals

Aug 05, 1999 | Victoria J. Pruett, SEMI/SEMATECH; Julian Serda, Advanced Micro Devices; Darin Shifley, Applied Materials, Inc.

This document provides suggested standard contents for equipment reference manuals for semiconductor process equipment. It includes a generic and detailed outline for equipment manuals, with major sections on installing, operating, controlling, and integrating process equipment....

Publisher: SEMATECH

An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.

Albany, New York, USA

Properties and Performance Of Hybrid Aluminium Electrolytic / Electrochemical Capacitors

Aug 05, 1999 | John R. Miller, JME, Inc. & David A. Evans, Evans Company

Test data was recently presented for a hybrid electrolytic/ electrochemical capacitor having sintered tantalum anodes and RuO2 cathodes. A 50-V, 18-mF capacitor of this design had electrical performance that was comparable to an advanced aluminum electrolytic capacitor but with only one-tenth the volume and just one-half the mass...

Publisher: Evans Findings

Evans Findings

Evans is the world's largest producer of deep drawn tantalum parts. Evans produces precision high volume drawn shells, metal stampings, eyelets and ferrules. Capabilities include In-House Engineering, Tool Design and Construction.

East Providence, Rhode Island, USA

Component Preparation

Thermal Management of Hybrid Electronic Devices

Jul 21, 1999 | Barry Ritchie, Jamie Serensen

Thermal management is a growing challenge in the electronics industry. As the overall size of electronic devices grows smaller, the enclosed electronic assemblies operate at higher frequencies and generate more heat....

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

The Effect of Solder Mask And Surface Mount Adhesive Types on a PCB Manufacturing Process.

Jul 21, 1999 | James A. Serenson Jr., Steven Marongelli

A high volume manufacturer of printed circuit boards (PCBs) had attempted for many years to locate an adhesive that was robust enough to meet their manufacturing needs. This proved to be a challenge because they needed the adhesive to accommodate a wide range of different dispensing equipment and board designs. The two key performance criteria required from the adhesive were dispensability and adhesion......

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Reliability Considerations of Electrically Conductive Adhesives.

Jul 21, 1999 | Darryl J. Small

Isotropic conductive adhesives are typically silver filled epoxy resins. Electronics assemblers have evaluated these materials for a variety of unique interconnect applications. The goal is a conductive polymer that exhibits similar reliability and performance to traditional solder while offering the benefits of a polymer structure such as low temperature processing and good thermal stability as well as the ability to bond a variety of substrates....

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Effects of Tg and CTE on Semiconductor Encapsulants

Jul 21, 1999 | Dr. Mark M. Konarski

As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability....

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Murata Manufacturing Co., Ltd.

Pre-Compliance Testing the Conducted Line Emissions of DC Supplied Circuits

Jul 20, 1999 | Paul Lee, Director of Engineering, Murata Power Solutions

It's quite common for a power supply (PSU) designer to work with a circuit designer to realize a system design compliant with international EMC regulations. PSU designers will be well aware of the requirement of the power supply to provide clean DC voltage and not disturb the AC mains voltage. However, they may not have any idea of the noise that can potentially be introduced to the mains through the PSU by the target circuit. Likewise, the circuit designers (digital or analogue) may not know what attenuation the PSU will provide....

Publisher: Murata Manufacturing Co., Ltd.

Murata is a leading company involved in the manufacturing of ceramic electronic components with an overwhelming share worldwide in ceramic filters, high frequency parts, and sensors.

Kyoto, Japan

Manufacturer of Components, Components/Substrates

Parallel SmartSpice: Fast and Accurate Circuit Simulation Finally Available

Jul 20, 1999 | Dr. Mounir Hahad

Circuit simulation is a necessary everyday tool to circuit designers who need to constantly verify and debug their circuits during the design process. As engineers face larger, more complex designs and tighter project schedules, fast SPICE simulation with no loss in accuracy has become a necessity. Simulation indeed accounts for a large portion of the time spent in the design and optimization of a new circuit......

Publisher: Silvaco

Silvaco

Silvaco is a supplier of TCAD software and a major supplier of EDA software for circuit simulation and design of analog, mixed-signal and RF integrated circuits.

Santa Clara, California, USA

Software Manufacturer

The Best Way to Clean Water-Soluble Fluxes

Jul 20, 1999 | Rick Roney

One logical approach to eliminating chloroflurocarbons is to use water-soluble solder pastes. For years, electronic assembly houses have used aqueous cleaning for removing the water-soluble fluxes of the wave soldering operation. In fact, aqueous cleaningof assemblies bas been studied and characterized extensively. Obviously, a "drop-in" solder paste that could be cleaned in the same aqueous cleaner would eliminate many of the headaches associated with qualifymg an entirely new cleaning process......

Publisher: Benchmark Electronics

Benchmark Electronics

Provider of electronics contract manufacturing services and integrated engineering design and test services.

Huntsville, Alabama, USA

Manufacturer of Assembled PCBs, Design, Contract Manufacturer, Service Provider

How to Select a Heat Sink

Jul 20, 1999 | Seri Lee, Advanced Thermal Engineering, Aavid Thermal Technologies, Inc.

With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management bmomes a more and more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment......

Publisher: Aavid Thermalloy, LLC

Aavid Thermalloy, LLC

For nearly 50 years, Aavid has been the world leader in thermal management solutions.

Laconia, New Hampshire, USA

Manufacturer of Assembled PCBs, Assembly, Design, Contract Manufacturer, Service Provider

Circuits Cost Cutting Tips

Jul 20, 1999 | Murrietta Circuits

What affects the price of boards? Number of layers: Limit the number of layers as much as possible. If higher quantities are anticipated, spend the extra time and money in engineering to minimize layer count.......

Publisher: Murrietta Circuits

Murrietta Circuits

A turnkey supplier of Electronic Manufacturing Services with a specialization in pcb design, pcb assembly, pcb manufacturing, pcb prototype.

Anaheim, California, USA

Simple, Effective Process Control in Wave Soldering

Jun 23, 1999 | Chrys Shea

This paper outlines the harmful effects of out-of-control process parameters and describes methods of measuring and tracking them to keep them in control. It addresses all critical variables of wave soldering: flux deposition, preheat application, conveyor speed, solder temperature and solder contact time....

Publisher: Siemens Process Industries and Drives

Siemens Process Industries and Drives

Siemens industrial manufacturing software, process automation, and automation and drives technology increases flexibility, cuts market launch lead time, and significantly reduces energy for manufacturing companies.

Alpharetta, Georgia, USA

Manufacturer of Assembly Equipment, Inspection, Consultant, Software Manufacturer, Training Provider

Assembly Process Development for Chip-Scale and Chip-Size μBGA™

May 09, 1999 | Vern Solberg.

This paper will review chip-scale and chip-size package variations, solder alloy options, furnish guidelines for solder stencil development and outline the actual processes used to successfully produce SMT assemblies utilizing CSP technology. ...

Publisher: Tessera Technologies

Tessera Technologies

Tessera is focused on miniaturization technologies and has licensed its chip packaging technology to numerous semiconductor manufacturers, including Intel and Samsung Electronics.

San Jose, California, USA

Component Packaging

A Study of Lead-Free Solder Alloys

May 09, 1999 | Karl F. Seelig.

With the ongoing concern regarding environmental pollutants, Iead is being targeted in the electronic assembly arena. This paper highlights lead-free solders and the different combinations of elemental makeups. ...

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Soldering Faster At Lower Temperatures: A Performance Comparison

May 09, 1999 | Doug Wilkerson, Technical Services Manager.

Studies and tests of comparative soldering iron thermal performance at low temperatures - Metcal direct power soldering technology compared to conventional stored energy soldering irons from leading manufacturers. ...

Publisher: Metcal

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Repair/Rework, Soldering

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Hand Soldering, Electrical Overstress, and Electrostatic Discharge

May 09, 1999 | Ron LaValley, Edwin Oh

This paper will give the reader a general understanding of EOS and ESD phenomena. It specifically addresses hand soldering's role in EOS and ESD and how to protect against and test for potential problems. It discusses how Metcal Systems address EOS and ESD concerns and how they differ from conventional soldering systems....

Publisher: Metcal

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Repair/Rework, Soldering

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Extending Soldering Iron Tip Life

May 09, 1999 | Metcal

This Technical Note discusses the construction of solder tips, the various failure modes associated with tip plating (cracking, wear, corrosion, and dewetting), how to diagnose those failure modes, and specific practices that can be taken to minimize or eliminate each one....

Publisher: Metcal

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Repair/Rework, Soldering

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Surface Mount Rework Techniques

May 09, 1999 | Brian Moylan

This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices. ...

Publisher: Metcal

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Repair/Rework, Soldering

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Managing the transition on a global scale -- changing the cleaning agent means changes to equipment, processes, process control specifications and standards.

May 09, 1999 | William G. Kenyon, Sr. Research Associate

The production of electronics began with hand soldering, followed by manual cleaning, which reached its peak during the NASA program. Each step in the process tended to be considered on a stand alone basis, without thought being given to the preceding and following steps. Since each step had its own set of specifications, this led to a "patchwork" approach to overall quality....

Publisher: DuPont

DuPont

World's most dynamic science company, creating sustainable solutions for a better, safer and healthier life.

Wilmington, Delaware, USA

Manufacturer of Assembly Material, Components/Substrates, Laminates

Manufacturing Considerations When Implementing Voc-Free Flux Technology

May 07, 1999 | David Scheiner, Senior Technical Service Engineer Kester

In 1990 the United States Environmental Protection Agency Issued the Clean Air Act. The Clean Air Act and subsequent amendments are designed to limit the use of chemicals that contain volatile organic compounds (VOCs). The document goes into great detail setting limits for allowable VOC emissions for different industries....

Publisher: Kester

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

SMT Process Recommendations Defect Minimization Methods for a No-Clean SMT Process

May 07, 1999 | Kurt Rajewski

Key competitive advantages can be obtained through the minimization of process defects and disruptions. In today's electronic manufacturing processes there are many variables to optimize. By gaining an understanding of what the defects are, and where they come from, is a key step in the process towards defect free/six sigma manufacturing. In the last decade, Surface Mount Technology processes have been slowly converting towards the No-Clean philosophy. This new trend has spawned new processing issues which need to be addressed. This paper will investigate solutions to current problems in the processing of No-Clean SMT processes....

Publisher: Kester

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Soldering to Gold Over Nickel Surfaces

May 07, 1999 | Dennis Bernier

There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold....

Publisher: Kester

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA