2 technical articles added by Sandia National Laboratories
Effects Of Storage Environments On The Solderability Of Nickel Palladium- Gold Finish With Pb-Based And Pb- Free Solders
Mar 02, 2022 | Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly George
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH)....
May 30, 2016 | Kim M. Archuleta, Rochelle Piatt
New engineered cleaning and defluxing agents promise great improvement in cleaning and reliability for electronic assemblies. As complexity grows and dimensions shrink in high reliability electronics, the need for materials compatibility and effectiveness in cleaning and rinsing is vital....