Technical Articles From Nordson DAGE
Read technical articles about electronics manufacturing added by Nordson DAGE
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5 technical articles added by Nordson DAGE
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Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Analysis
Nov 20, 2023 | David Bernard & Steve Ainsworth
Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for checking product quality without compromising productivity. Using x-ray inspection, not only provides a non-destructive test but also allows investigation within optically hidden areas, such as the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips). As the size of components continues to diminish, today's x-ray inspection systems must provide increased magnification, as well as better quality x-ray images to provide the necessary analytical information. This has led to a number of x-ray manufacturers offering digital x-ray inspection systems, either as standard or as an option, to satisfy these needs. This paper will review the capabilities that these digital x-ray systems offer compared to their analogue counterparts. There is also a discussion of the various types of digital x-ray systems that are available and how the use of different digital detectors influences the operational capabilities that such systems provide....
MODERN 2D / 3D X-RAY INSPECTION -- EMPHASIS ON BGA, QFN, 3D PACKAGES, AND COUNTERFEIT COMPONENTS
Nov 20, 2023 | Evstatin Krastev and David Bernard
With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and dense packages have more opportunities to exhibit defects both internal to the package as well as to the PCB. As components increase in complexity their cost increases, making counterfeiting them a potentially lucrative business for unscrupulous individuals and organizations....
Considerations for Minimizing Radiation Doses to Components during X-ray Inspection
Feb 21, 2022 | David Bernard, Richard C. Blish, II
The ability to undertake non-destructive testing on semiconductor devices, during both their manufacture and their subsequent use in printed circuit boards (PCBs), has become ever more important for checking product quality without compromising productivity. The use of x-ray inspection not only provides a potentially non-destructive test but also allows investigation within optically hidden areas, such as the wire bonding within packages and the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips)....
Common Process Defect Identification of QFN Packages
Jul 23, 2019 | David Bernard @ Dage Precision Industries, Bob Willis @ ASKbobwillis.com
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed....
Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components
Sep 16, 2010 | Evstatin Krastev, David Bernard
With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de...
