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Technical Articles From Seamark zm Tech Group

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11 technical articles added by Seamark zm Tech Group

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Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

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Electronics X-Ray inspection

Apr 19, 2019 | Joy Rong +8618779975930

Electronics X-Ray inspection Tianjin Min Woo Electronics Co.,Ltd. Is located in 28R4+22 Jinnan, Tianjin, China since 2003. And specializes in the development and production of flat panel displays. Tianjin Min Woo Electronics purchased ZM X6600 for inspect their products quality. Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter The difference between the detection equipment AOI & X-RAY ...

x ray inspect PCB and SMT patch module JIJONQ

Apr 11, 2019 | Joy Rong +8618779975930

x ray inspect PCB and SMT patch module JIJONQ Technology Co., Ltd offer SMT & DIP manufacturing Service since 1997, Scope of Business: PCB / FPC SMT、DIP、Testing、Assembly、OEM Autotronics processing、Purchasing of material. ...

TSI Mexico-X ray detects Dell computer motherboard defects

Apr 04, 2019 | Joy Rong +8618779975930

TSI Mexico use Seamark x ray www.seamarkxray.com email: sales25@zhuomao.com.cn Tel/wechat/whsatspp +861879975930 TSI Mexico-X ray detects Dell computer motherboard defects. MISIÓN Proporcionar servicios de almacenamiento, embalaje, administración de inventarios, distribución, logística, remozamiento, reparación y mantenimiento de equipos electrónicos en alto volumen, de alta tecnología a nivel componente; ofreciendo oportunidad, calidad, y precio. VISIÓN Ser líder a nivel nacional e internacional ofreciendo soluciones integrales e innovadoras que nos permitan satisfacer las necesidades de los clientes y socios estratégicos cumpliendo y excediendo consistentemente sus expectativas. MISSION Provide storage services, packaging, inventory management, distribution, logistics, refurbishment, repair and maintenance of electronic equipment in high volume, high-tech component; offering opportunity, quality, and price. VISION To be a national and international leader offering integral and innovative solutions that allow us to satisfy the needs of our clients and strategic partners, consistently fulfilling and exceeding their expectations. Seamark ZM Technology Group (HK,) Co.,Ltd is one of national high-tech enterprises of development, production and sales Since 2005, with its strong technical force, efficient management, perfect sales network and after-sales service. We win the trust and support of the majority, and improved ourselves by introducing and absorbing overseas advanced technology. At the same time, we would like strengthening product research and development to improve product quality, and constantly opening up the domestic market, in the global electronic, the multi-function BGA rework field & X ray inspection equipment & X-ray SMD counter & Laser TV LCD repair ect. Seamark ZM has passed ISO9001: 2000 Quality management system and ISO14001:2004, CE, environmental management system standard certification. Many thanks TSI Mexico’ trust and support! Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter The difference between the detection equipment AOI & X-RAY ...

Persang Alloy Industries X ray 6600 for PCB

Mar 21, 2019 | Joy Rong +8618779975930

Persang Alloy Industries X ray 6600 for PCB Persang Alloy Industries Pvt. Ltd. (PAI) is one of India’s largest manufacturers / exporter of solders, soldering chemicals and alloys. Based in Vadodara, Customers include Sony, HP, Siemens, Asus, Foxconn and so on, with high recognition since 1989. PAI manufactures a wide variety of solders, lead free alloys and fluxes in various forms which perform critical tasks in the electronic, electrical and automobile industries. Persang Alloy Industries X ray 6600 The most common problem with solder paste/solder is the inclusion of impurities, which is very detrimental to the soldering effect. This is a special concern for solder paste manufacturers. The solder paste contains impurities, which will not only affect the soldering effect but also affect the customer’s experience with the product. Thanks to the manufacturer – PAI for being responsible for products quality, let us experience good product quality. Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter The difference between the detection equipment AOI & X-RAY ...

Methods for detecting electronic components quickly

Mar 12, 2019 | Joy Rong +8618779975930

Method for detecting electronic components quickly www.seamarkxray.com Contact:Joy Tel/WhatsApp/wechat:+86 18779975930 X-ray is a kind of light with super penetrating power, which can directly penetrate the appearance of the product and directly reach the internal structure of the product. It can play a very important role in the identification of the internal structure of the product. At present, high imitation products are endless, many high Imitation products have similar appearance, but the internal structure design is different, especially the precision products, it is impossible to disassemble at will, so only the advanced technical means can be used to distinguish the product details. Now, the non-destructive testing ( NDT ) method has X-ray inspection machine and ultrasonic detection, magnetic particle testing, NDT x ray detection are as follows: For example, the internal structure of several electronic components is different: Terminal 3D detection: IC chip detection: The chip to be tested and the genuine chip are compared under the X-ray inspection machine. As can be seen from the figure, the internal structure of the chip under X-ray detection is quite different....

Compared with manual SMD counter machine, Advantages of X-ray SMD counter

Mar 08, 2019 | Joy Rong +8618779975930

Compared with manual SMD counter machine, Advantages of X-ray SMD counter I believe that many companies have experienced the mid-year inventory and year-end inventory. For electronic companies, the statistics of electronic components are very time-consuming, scattered small components, making the inventory of personnel time-consuming and laborious, seriously affecting the quality of work. And the efficiency of the enterprise, the X-RAY spot machine can solve these problems very well. Advantages of X-ray SMD counter: 1.No need to disassemble the package, component reel raw materials directly into the warehouse, directly inventory 2. It can better maintain the integrity of the product without affecting the moisture and pollution of the product. 3. Reduce inventory staff. It can directly arrange one or two Staff to operate the X-ray spotting machine to increase the counting speed and achieve higher efficiency; The inventory data can be directly uploaded to the enterprise ERP system, which is very helpful for all departments of the enterprise to understand the quantity of the products, especially the production-related operators. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY ...

Casting NDT inspection

Jan 07, 2019 | Joy Rong +8618779975930

Casting NDT inspection Original: Casting NDT inspection Casting refers to the casting of metal. In the process of manufacturing, due to the gas generated during the cold casting and forging process, many small pores are easily caused in the casting, which has a certain influence on the overall tightness of the casting. Casting NDT inspection method: There are problems with castings. If some problems are more serious, the quality defects of the products will be increased. Generally, non-destructive testing equipment is used in the market to detect the quality of castings, such as X-RAY, ultrasonic, etc. Loose casting: During the solidification process of the casting, due to solidification shrinkage or the presence of gas, the castings produce voids, resulting in insufficient tightness of the casting; Impurities: Castings are mixed with other fine particles, foreign matter, etc., affecting product quality; Internal defects: After the castings are manufactured, the process technology lags behind, causing defects such as bubbles, cracks and delamination of the castings; Small defects won’t affect the normal use of the product, but for the precision of scientific research, the product’ quality is very important, in order to ensure the quality of the casting, X-RAY inspection equipment, ultrasonic non-destructive testing can be used to test the casting. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY ...

Why LED Lamps Are Getting Darker

Dec 17, 2018 | Joy Rong +8618779975930

The LED light source module is generally composed of a substrate, a chip, a packaging material, a lens, etc. In daily use, the long-time operation of the LED easily causes the LED to become darker and darker, and even the light fails. For this problem, D.L. Barton has done research experiments....

Bead probe technology - increase ICT test coverage

Nov 21, 2018 | Joy Rong +8618779975930

Bead probe technology - increase ICT test coverage www.seamarkxray.com Bead probe technology is an exclusive patent application by Agilent (Keysight Technologies). Using existing wiring to increase ICT (In-Circuit-Test) test point coverage without additional board space, to increase printing. Test points on the board to achieve assembly ICT testing can be used for ICT testing purposes. he density of the parts on the board is getting denser and denser, but the space is getting smaller and smaller, especially the board of the mobile phone. The first thing to be sacrificed is the test point that does not have any function. Many bosses think: "Quality is manufactured, As long as the quality of the board assembly is completed, there is no need for subsequent electrical testing. Which engineer can guarantee that the product does not have a bug? The assembly plant also cannot guarantee that they have zero defects in assembling the board. Various design and assembly challenges are showing that it is difficult to abandon the traditional ICT, and only other methods (such as AOI, AXI) to ensure the quality of the PCB assembly, so more and more Many companies are starting to use ICT again, but the space on the board will get smaller and smaller only, and there is room for test points, so smart Agilent came up with this kind of trace on the existing trace. The method of printing solder paste replaces the "bead probe" method of the test point. The purpose of Agilent is of course to hope that the entire electronics industry can continue to maintain ICT operations, and purchase more of its 3070 series ICT test machine from them. The traditional ICT test method uses a pointed probe to form a loop on a circular test point. This method requires a large area of test point, and then the probe must be shot like a target. , it needs to use more board space; the bead probe technology is just reversed, it wants the test point to try not to occupy the space of the board, in order to form a loop with the probe, so the solder paste is printed, let test point becomes higher, and larger diameter flat probe (50, 75, 100 mils) is used to increase the chance of contact with the test point. In theory, this is really a big breakthrough in test points, but there are still many techniques to overcome in practice. Printing solder paste on the wiring is likely to cause poor contact between the probe and the test point due to the residual flux. For this point, a number of probe manufacturers have designed probes for use with bead probes.  (Image taken from ingun)  The printing of solder paste needs to be very precise. In particular, the lead-free solder paste cohesion is worse than tin-lead solder paste, which requires more precise solder paste printing. The high tin-printing amount determines the solder height. If the soldering height at the test point is not enough, the ICT misjudgment rate will increase. . This involves the solder paste printing process, the accuracy of the steel plate, and the tolerances of the board. If the width of the wiring is too small, it is easy to be inadvertently inferred by the probe, or other external force due to insufficient adhesion. In generally, it recommended that the minimum wiring width be more than 5 mils. It is said that some operators have successfully tested 4 mils, but as the width of the wiring is smaller, the misjudgment rate of ICT is higher. It is recommended to increase the width of the wiring and then mask it with green paint, which will be stronger.   (Image taken from ingun,These beads were pressed into the shape of the probe beads with a force of 2.0 N on the left and a force of 3.0 N on the right.) Does the use of bead probe technology affect the quality of high frequencies? According to Agilent's test report, it will not affect the performance of high frequencies. Is there a capacitive or antenna effect using the bead probe technology? According to Agilent's response, there is no such problem in the current test and customer response. What is the reliability of the bead probe technology? According to Agilent's reply, there were no problems with testing 200 cycles. In addition, Agilent strongly recommends that the factory use this bead probe technology. It is best to have a test period of more than six months, because it needs to choose solder paste, fine-tuning the opening of the steel plate, the amount of solder paste, and Adjust the type and accuracy of the ICT test probe. Therefore, in the initial experiment, it is best to have both traditional round test points and new bead test points on the board....

SMT BGA voids Formation and prevention

Nov 13, 2018 | Joy Rong

Address: 10 Building, Huaide Cuihai Industrial Park, Fuyong Street, Bao'an, Shenzhen, China Tel: +8618779975930 E-mail: Sales25@zhuomao.com.cn Written by Joy Rong More details: www.seamarkxray.com SMT BGA voids Formation and prevention News: The 2nd China Manufacturing Technology-Automation Exhibition (CMM) & the 1st China Electronics Manufacturing Resource Exhibition (CEM) was held at the Dongguan International Convention and Exhibition, such as B&P, Anda, Huancheng, Deshen Huawei, OPPO, VIVO, Xiaomi, ZTE, Foxconn, Flextronics, Lenovo and so on, More than 500 electronic manufacturing companies participated in the exhibition. In the annual feast of the field, the realization of mobile phone production automation can reduce 60% of employees? BGA voids cause current-intensive effects and reduce the mechanical strength of the solder joint. Therefore, from the perspective of reliability, the cavity should be reduced. So how can you reduce BGA voids? There are many reasons for the formation of BGA voids, such as the crystal structure of the solder joint alloy, the design of the PCB, the deposition amount of the solder paste, the reflow soldering process used, and the voids in the soldering process. Next, we will explain the formation and prevention of BGA solder joint voids from the layer of solder paste to reduce the number of BGA solder joint void formation. 1.Furnace temperature curve is improperly set ① In the temperature rising section, the gradient is set too high, causing the rapidly escaping gas to detach the BGA from the pad; ② The duration of the heating section is not long enough. When the temperature rises, the gas that should be volatilized has not completely escaped. This part of the gas continues to escape during the reflow phase, affecting the fluxing system to play a role in the reflow phase. 2. The solder paste solvent is not properly matched ① During the heating phase, the rapidly escaping gas propels up the BGA, causing misalignment and barriers; ② During the reflow phase, a considerable amount of gas still escapes from the solder paste system, but is limited by the narrow space between the BGA and the pad. These volatile gases cannot smoothly escape through this space, causing them to be squeezed. Molten solder joints. 3. Insufficient ability of solder paste to wet the pad 4. The surface tension of the solder paste system is too high during the reflow phase 5. The solder paste system has a high non-volatile content 6. Carrier rosin quality 7. The amount of rosin used Another reason for the BGA cavity is the back-wetting phenomenon during the welding process. The formation of this phenomenon is related to the duration of action of the active material in the solder paste system and the duration of action. During the BGA reflow soldering process, BGA pads are more prone to this undesirable phenomenon than SMT solder paste soldering. After realizing these influencing factors, the corresponding testing measures were added in the research and development. For example, we introduced a thermogravimetric analyzer to conduct thermal analysis on the materials to be used and the solder paste produced, to visually understand these thermal characteristics, and to test Differences between design assumptions and actual performance, measures are taken to overcome them to ultimately meet the process requirements; and surface tension measurements are performed. The appropriate surface tension range is finally determined by measuring the surface tension of the solder paste system and its affected objects at different temperatures. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Detecting advantages of AOI and X-ray Inspection Equipment Maybe you still are interested in: Importance of X-ray inspection technology in the SMT FAI/ First Article Inspection Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY ...

Reasons for BGA insufficient solder & short

Nov 13, 2018 | Joy Rong

Reason for BGA insufficient solder & short-There are cases of insufficient solder & solder short in BGA, and some BGA solder ball inspection methods. Written by Joy Rong Reasons for BGA insufficient solder & short There are cases of insufficient solder and solder short in BGA soldering, but it is also possible. Because the PCB BGA board has too much gap due to heat shrinkage (CTE), the edge of the BGA board is upturned. The smile curve is formed, and the circuit board is too long due to TAL (Time Above Liquidus), and the temperature difference between the upper and lower furnaces of the reflow furnace is too large, and the two-phase interaction forms a circuit board to bend down,Caused the so-called cry curve. If the cry curve, smile curve is severely deformed, short-circuit and air-welding of the BGA will be formed at the same time, which is usually the case when both occur at the same time. The picture shows that the BGA smile curve and the cry curve on the printed circuit board strongly squeeze the BGA solder balls, causing several short circuits. In general, consider reducing the slope of the reflow oven, either by preheating the BGA to eliminate thermal stress, or by requiring BGA manufacturers to use higher Tg to overcome it. Other reasons for BGA insufficient solder: 1.Circuit board pads or BGA solder balls are oxidized. In addition, printed circuit boards or BGAs with improper moisture resistance will have similar problems. 2.Solder paste expired. 3.Insufficient solder paste printing. 4.The temperature profile is poorly set, and the furnace temperature should be measured at the insufficient solder. In addition, when the temperature rises too fast, it is more likely to cause the above-mentioned cry curve, smile curve problems. 5.Design issues. For example, Via-in-pad will cause a decrease in solder paste, which may also cause the solder ball to be hollow and blow up the solder ball. 6.Head in Pillow. This phenomenon often occurs when the BGA board or printed circuit board is deformed by reflow. When the solder paste is melted, the BGA solder ball does not touch the solder paste. When cooling, the BGA carrier board and the board are deformed. Decrease, the solder ball falls back to the cured solder paste. In general, there are several methods for analyzing insufficient solder and solder short (for details, please refer:SMT BGA solder ball inspection method): 1.Microscope. 2.X-Ray inspection machine. ( Tel/whatspp/wechat +8618779975930 ) 3.Red Dye Penetration. 4.Cross section. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Formation and prevention of SMT BGA voids Maybe you still are interested in: As PCB designer and technician/Buyer, you do not know technologies Skills? Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY More details: www.seamarkxray.com...

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