Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
Published: |
March 10, 2011 |
Author: |
Neil Poole, Ph.D. and Brian Toleno, Ph.D. |
Abstract: |
History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Henkel Electronic Materials »
- Nov 10, 2020 - Printed Electronics for Medical Devices
- Oct 14, 2020 - FRACTURE TOUGHNESS OF THERMALLY CONDUCTIVE ADHESIVES
- Nov 30, 2016 - Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling
- Sep 23, 2010 - Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers
- Jan 06, 2010 - Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
- See all SMT / PCB technical articles from Henkel Electronic Materials »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
Solder Materials Science Gets Small as Miniaturization Challenges Old Rules article has been viewed 678 times
