Solder Joint Reliability Under Realistic Service Conditions

Published:

October 30, 2014

Author:

P. Borgesen, S. Hamasha, M. Obaidat, V. Raghavan, X. Dai; Department of Systems Science & Industrial Engineering, Binghamton University, M. Meilunas, M. Anselm; Universal Instruments Corporation.

Abstract:

The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly.

We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed...

  • Download Solder Joint Reliability Under Realistic Service Conditions article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.

Conklin, New York, USA

Manufacturer

  • Phone +1-800-432-2607
  • Fax +1-607-779-4466

See Company Website »

Company Postings:

(7) used SMT equipment marketplace items

(168) SMT parts, accessories & PCB supplies items

(3) products in the catalog

(13) technical library articles

(60) news releases

  • Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Browse Technical Library »

Solder Joint Reliability Under Realistic Service Conditions article has been viewed 776 times

IPC Certification Training Schedule IPC Questions and answers

Global manufacturing solutions provider