Decapsulation of Integrated Circuits

Published:

May 29, 2019

Author:

ACI Technologies, Inc.

Abstract:

Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step....

  • Download Decapsulation of Integrated Circuits article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant, Design, IPC Standards Certification Center, Service Provider, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

ACI Technologies, Inc. website

Company Postings:

(24) products in the catalog

(125) upcoming training courses

(64) technical library articles

(3) news releases

  • Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
  • Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
  • Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
  • Apr 14, 2020 - Reliable Selective Soldering For High Volume Assemblies | ITW EAE
  • Apr 14, 2020 - Stencil Printing 008004/0201 Aperture Components | ITW EAE
  • Browse Technical Library »

Decapsulation of Integrated Circuits article has been viewed 248 times

Non-heated dispensing system

Flux-Free Reflow Soldering