• SMTnet
  • »
  • Technical Library
  • »
  • A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS

A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS

Published:

July 2, 2020

Author:

Ranjit Pandher, Rahul Raut, Michael Liberatore, Navendra Jodhan, and Karen Tellefsen

Abstract:

Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests....

  • Download A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS article
  • To read this article you need to have Adobe PDF installed

July 3, 2020

There seems to be a problem with the link to the paper A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS error 404

July 6, 2020

Thanks, Bob. We got caught with a file name that was just a bit too long. Mark this one fixed.

You must be a registered user to talk back to us.

 
Company Information:

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

Manufacturer of Assembly Material

  • Phone 508-520-0083

Cookson Electronics website

Company Postings:

(4) products in the catalog

(9) technical library articles

  • Aug 05, 2020 - ALD of Alumina Ceramic Films for Hermetic Protection | ACI Technologies, Inc.
  • Jul 01, 2020 - Lead-Free Risk Mitigation -- A Case Study | ACI Technologies, Inc.
  • Jun 02, 2020 - Lead-Free Control Plan | ACI Technologies, Inc.
  • May 08, 2020 - Pad Cratering | ACI Technologies, Inc.
  • Apr 14, 2020 - Reliable Selective Soldering For High Volume Assemblies | ITW EAE
  • Browse Technical Library »

A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS article has been viewed 236 times

  • SMTnet
  • »
  • Technical Library
  • »
  • A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS
Dual Lane Reflow Oven

pH neutral electronics cleaning agent