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Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Published:

January 3, 2021

Author:

Ning-Cheng Lee

Abstract:

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate....

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Industry 4.0 Reflow Oven