• SMTnet
  • »
  • Technical Library
  • »
  • Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Published:

January 3, 2021

Author:

Ning-Cheng Lee

Abstract:

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate....

  • Download Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
  • Apr 19, 2022 - Scalable Reliability for Consumer Electronics | HZO, Inc.
  • Apr 19, 2022 - Protective Coatings for Non-Invasive Medical Devices for Real-World Reliability | HZO, Inc.
  • Apr 19, 2022 - How to Resolve Smart Meter Reliability Issues with Parylene Conformal Coating | HZO, Inc.
  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Browse Technical Library »

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies article has been viewed 1155 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
IPC Certification Training Schedule

Eliminate premature failure from corrosion