2D X-RAY INSPECTION WITH MATERIALS AND THICKNESS IDENTIFICATION

Published:

November 20, 2023

Author:

Paul D. Scott, Ph.D. Evstatin Krastev, Ph.D., P.E.

Abstract:

X-ray inspection systems are key tools for quality control, yield enhancement, and failure analysis of PCBs and semiconductor devices. In many cases, these capable tools provide the only non-destructive techniques for inspection of electronic components. There have been significant improvements in the X-ray inspection capabilities (both 2D and 3D) in the last several years. In this paper we report a new development that permits material and thickness information to be obtained via 2D X-ray inspection.  

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